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    • 5. 发明授权
    • Method of fabricating bipolar transistors and insulated gate field
effect transistors having doped polycrystalline silicon conductors
    • 制造具有掺杂多晶硅导体的双极晶体管和绝缘栅场效应晶体管的方法
    • US4735916A
    • 1988-04-05
    • US13252
    • 1987-02-10
    • Hideo HommaYutaka MisawaNaohiro Momma
    • Hideo HommaYutaka MisawaNaohiro Momma
    • H01L27/06H01L21/033H01L21/3213H01L21/331H01L21/336H01L21/8234H01L21/8249H01L29/73H01L29/732H01L29/78H01L21/385
    • H01L29/66272H01L21/0337H01L21/32137H01L21/8249H01L29/41783H01L29/6659H01L29/78H01L29/66545
    • A method of fabricating a semiconductor device includes the steps of: forming at least one first semiconductor region of a first conductivity type and at least one second semiconductor region of a second conductivity type in a main surface of a semiconductor layer of the first conductivity type; forming a three-layer film having a desired shape on each of the first and second semiconductor regions, the three-layer film being made up of a bottom layer which is a conductive film, an intermediate layer which is a silicon nitride film, and a top layer which is a polycrystalline silicon film doped with one of arsenic and phosphorus; forming a first insulating layer on the side wall of the three-layer film; forming a second polycrystalline silicon film on the whole surface, and diffusing one of arsenic and phosphorus from the first polycrystalline silicon film into the second polycrystalline silicon film; selectively etching off the first polycrystalline silicon film and that portion of the second polycrystalline silicon film, in which one of arsenic and phosphorus has been diffused; forming a second insulating layer at least on the surface of the portion of the second polycrystalline silicon film which exists on the second semiconductor region; removing the silicon nitride film and the conductive film which exist on the second semiconductor region, while using the second insulating layer as a mask, to form an aperture; and forming a third polycrystalline silicone film so that the aperture is covered by the third polycrystalline silicon film.
    • 一种制造半导体器件的方法包括以下步骤:在第一导电类型的半导体层的主表面中形成第一导电类型的至少一个第一半导体区域和第二导电类型的至少一个第二半导体区域; 在第一和第二半导体区域中的每一个上形成具有期望形状的三层膜,该三层膜由作为导电膜的底层,作为氮化硅膜的中间层和 顶层,其是掺杂有砷和磷之一的多晶硅膜; 在三层膜的侧壁上形成第一绝缘层; 在整个表面上形成第二多晶硅膜,并将砷和磷中的一种从第一多晶硅膜扩散到第二多晶硅膜中; 选择性地蚀刻出第一多晶硅膜和其中砷和磷之一已经扩散的第二多晶硅膜的那部分; 至少在所述第二半导体区域上存在的所述第二多晶硅膜的所述部分的表面上形成第二绝缘层; 在使用第二绝缘层作为掩模的同时,除去存在于第二半导体区域上的氮化硅膜和导电膜,以形成孔径; 以及形成第三多晶硅膜,使得所述孔被所述第三多晶硅膜覆盖。