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1. 发明申请

US20070045644A1 Light emitting diode package with diffuser and method of manufacturing the same 有权
标题翻译：具有扩散器的发光二极管封装及其制造方法
公开(公告)号：US20070045644A1
公开(公告)日：2007-03-01
申请号：US11491947
申请日：2006-07-25
申请人： Seong Han , Seon Lee , Chang Song , Jung Park , Young Park , Kyung Han
发明人： Seong Han , Seon Lee , Chang Song , Jung Park , Young Park , Kyung Han
IPC分类号： H01L33/00
CPC分类号： H01L33/58 , H01L33/505 , H01L2224/48091 , H01L2224/49107 , H01L2224/73265 , H01L2924/181 , H01L2933/0091 , H01L2924/00014 , H01L2924/00012
摘要： The invention relates to an LED package for facilitating color mixing using a diffuser and a manufacturing method of the same. The LED package includes a substrate with an electrode formed thereon, and an LED chip mounted on the substrate. The LED package also includes an encapsulant applied around the light emitting diode chip, containing a diffuser. The LED package further includes a lens part disposed on the light emitting diode chip and the encapsulant to radiate light in a wide angle. The LED package allows light from the light emitting diode chip to be emitted out of the package without distortion. The invention allows light to exit through the encapsulant containing the diffuser and the lens part, achieving uniform diffusion and emission of light from the LED chip, thereby increasing a radiating angle and obtaining a uniform light source.
摘要翻译：本发明涉及一种便于使用扩散器进行混色的LED封装及其制造方法。 LED封装包括其上形成有电极的基板和安装在基板上的LED芯片。 LED封装还包括施加在发光二极管芯片周围的密封剂，其包含扩散器。 LED封装还包括设置在发光二极管芯片上的透镜部分和密封剂以广角度辐射光。 LED封装允许来自发光二极管芯片的光从封装外部发射而不变形。本发明允许光通过包含扩散器和透镜部分的密封剂而离开，实现来自LED芯片的均匀的扩散和发射，从而增加辐射角度并获得均匀的光源。

2. 发明申请

US20070029572A1 LED having improved soldering structure, method for soldering the LED to PCB, and LED assembly manufactured by the method 审中-公开
标题翻译：具有改善的焊接结构的LED，将LED焊接到PCB的方法以及通过该方法制造的LED组件
公开(公告)号：US20070029572A1
公开(公告)日：2007-02-08
申请号：US11497233
申请日：2006-08-02
申请人： Kyung Han , Seon Lee , Hun Hahm , Seong Han , Chang Song , Young Park
发明人： Kyung Han , Seon Lee , Hun Hahm , Seong Han , Chang Song , Young Park
IPC分类号： H01L33/00 , H01L21/00
CPC分类号： H01L33/486 , H01L33/62 , H01L2224/48091 , H05K3/3426 , H05K3/3494 , H05K2201/10106 , H05K2201/10651 , H05K2201/1084 , H05K2203/0195 , Y02P70/613 , H01L2924/00012 , H01L2924/00014
摘要： The invention relates to an LED with an improved soldering structure, a method of assembling the LED to a PCB, and an LED assembly manufactured by the method. The LED includes an LED chip and a pair of leads with an end electrically connected the LED chip and the other end to be connected to an external power source, having a hole or a cutout part formed therein. The LED also includes a package body housing a part of the lead in the side of the LED chip, and a transparent lens placed on a surface of the package body in the side of the LED chip, for emitting light laterally. This improves soldering conditions for soldering with the other end of the lead placed on the solder, saving the amount of a solder paste while enhancing bonding strength after soldering.
摘要翻译：本发明涉及具有改进的焊接结构的LED，将LED组装到PCB的方法以及通过该方法制造的LED组件。 LED包括LED芯片和一对引线，端部电连接LED芯片，另一端连接到外部电源，其中形成有孔或切口部分。 LED还包括容纳LED芯片侧的引线的一部分的封装体，以及位于LED芯片侧的封装体的表面上的透明透镜，用于横向发光。这样可以提高钎焊焊接条件，同时提高焊接后的焊接强度。

3. 发明申请

US20060273337A1 Side-emitting LED package and method of manufacturing the same 审中-公开
标题翻译：侧面发光LED封装及其制造方法
公开(公告)号：US20060273337A1
公开(公告)日：2006-12-07
申请号：US11444402
申请日：2006-06-01
申请人： Kyung Han , Myoung Choi , Seon Lee , Hun Hahm , Seong Han , Chang Song , Young Park
发明人： Kyung Han , Myoung Choi , Seon Lee , Hun Hahm , Seong Han , Chang Song , Young Park
IPC分类号： H01L33/00
CPC分类号： H01L33/54 , H01L24/97 , H01L25/0753 , H01L33/60 , H01L2224/48091 , H01L2924/12035 , H01L2924/12041 , H01L2924/15787 , H01L2924/181 , H01L2924/1815 , H01L2924/00 , H01L2924/00014
摘要： The invention relates to a side-emitting LED package and a manufacturing method thereof. The side-emitting LED package includes a substrate with an electrode formed thereon, and a light source disposed on the substrate and electrically connected to the electrode. The side-emitting LED package also includes a molded part having an upper surface with a center thereof depressed concavely, covering and protecting the substrate and the light source, and a reflection layer covering an entire upper surface of the molded part to reflect light sideward from the molded part which forms a light transmitting surface. The package is not restricted in the shape of the molded part and is not affected by the LED chip size, enabling a compact structure. The invention can also process a substrate by a PCB process, enabling mass-production.
摘要翻译：本发明涉及一种侧面发光LED封装及其制造方法。侧发光LED封装包括其上形成有电极的基板和设置在基板上并与电极电连接的光源。侧发光LED封装还包括具有上表面的模制部件，其中心凹陷地凹陷，覆盖和保护基板和光源，以及覆盖模制部件的整个上表面的反射层，以将光从侧向反射模制部件形成透光表面。封装不限制成型件的形状，不受LED芯片尺寸的影响，从而实现了紧凑的结构。本发明还可以通过PCB工艺处理衬底，从而实现批量生产。

4. 发明申请

US20070019416A1 Light emitting diode package having dual lens structure for lateral light emission 有权
标题翻译：具有用于横向发光的双透镜结构的发光二极管封装
公开(公告)号：US20070019416A1
公开(公告)日：2007-01-25
申请号：US11488067
申请日：2006-07-18
申请人： Kyung Han , Myoung Choi , Seon Lee , Seong Han , Hun Hahm , Chang Song
发明人： Kyung Han , Myoung Choi , Seon Lee , Seong Han , Hun Hahm , Chang Song
IPC分类号： F21V7/00
CPC分类号： H01L33/58 , G02B19/0028 , G02B19/0061 , G02B19/0071 , H01L33/60 , H01L33/62 , H01L33/644 , H01L33/647 , H01L2224/48247 , H01L2924/3025 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： An LED package having a dual structure for lateral emission of light includes an LED chip, a lower structure, a lower lens and an upper lens. The lower structure includes a pair of electric connection parts, a package body, and a transparent encapsulant filled in the recess of the package body to seal the LED chip. The upper-hemispheric lower lens is fixed to an upper part of the lower structure with a bottom part thereof attached to an upper surface of the transparent encapsulant. The funnel-shaped upper lens is fixed to an upper end of the lower lens, and includes an axially symmetrical reflecting surface for laterally reflecting light from the lower lens, and an emitting surface for laterally emitting light reflected from the reflecting surface. The upper lens and the lower lens are separately molded and combined together to easily manufacture and efficiently install the LED package.
摘要翻译：具有用于光的横向发射的双重结构的LED封装包括LED芯片，下部结构，下部透镜和上部透镜。下部结构包括一对电连接部分，封装主体和填充在封装体的凹部中的透明密封剂，以密封LED芯片。上半球下透镜固定到下结构的上部，其下部附接到透明密封剂的上表面。漏斗状上透镜固定在下透镜的上端，并且包括用于横向反射来自下透镜的光的轴对称反射表面和用于横向发射从反射表面反射的光的发射表面。上透镜和下透镜分别模制并组合在一起以容易地制造和有效地安装LED封装。

5. 发明申请

US20070030703A1 LED package having recess in heat conducting part 有权
标题翻译： LED封装在导热部分具有凹槽
公开(公告)号：US20070030703A1
公开(公告)日：2007-02-08
申请号：US11500361
申请日：2006-08-08
申请人： Seon Lee , Chang Song , Kyung Han
发明人： Seon Lee , Chang Song , Kyung Han
IPC分类号： H01J1/62
CPC分类号： H01L33/647 , H01L24/97 , H01L33/486 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/12041 , H01L2924/181 , Y10S362/80 , H01L2924/00014 , H01L2924/00
摘要： The invention provides an LED package including an LED chip. In the LED package, a heat conducting part of folded sheet metals has a recess formed thereon to seat the LED chip therein. A package body houses the heat conducting part and directs light generated from the LED chip upward. Also, a transparent encapsulant is provided to at least the recess of the heat conducting part. Leads are partially housed by the package body to supply power to the LED chip. According to the invention, the sheet metals are folded to form the heat conducting part, and the recess is formed on the heat conducting part to seat the LED chip therein. This improves reflection efficiency and simplifies an overall process.
摘要翻译：本发明提供一种包括LED芯片的LED封装。在LED封装中，折叠的金属片的导热部分具有形成在其上的凹部，以将LED芯片置于其中。包装体容纳导热部分，并将LED芯片产生的光向上引导。此外，透明密封剂至少设置在导热部分的凹部上。引线部分地由封装体容纳以向LED芯片供电。根据本发明，折叠金属板以形成导热部分，并且在导热部分上形成凹部以将LED芯片置于其中。这提高了反射效率并简化了整个过程。

6. 发明申请

US20070108460A1 LED package 审中-公开
标题翻译： LED封装
公开(公告)号：US20070108460A1
公开(公告)日：2007-05-17
申请号：US11593085
申请日：2006-11-06
申请人： Seon Lee , Myoung Choi , Chang Song , Young Park
发明人： Seon Lee , Myoung Choi , Chang Song , Young Park
IPC分类号： H01L33/00 , H01L29/22
CPC分类号： H01L33/54 , H01L33/486 , H01L33/56 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2933/0091 , H01L2924/00014
摘要： An LED package is provided. A light emitting chip generates light when current is applied. A frame is electrically connected to the light emitting chip via a wire, and has the light emitting chip mounted thereon. A molding fixes the frame thereto, and has a cavity surrounding the light emitting chip and an embossed protrusion formed on a top surface thereof. A lens is domed upward from the embossed protrusion along an outer periphery of the embossed protrusion. The lens is made of a light transmissible resin filled in the cavity. The invention ensures a sufficient view angle of light generated from the LED chip, thereby increasing light extraction efficiency. This consequently simplifies an assembly process, allowing mass production and reducing manufacturing costs.
摘要翻译：提供LED封装。当施加电流时，发光芯片产生光。框架经由导线电连接到发光芯片，并且其上安装有发光芯片。模制件将框架固定在其上，并且具有围绕发光芯片的空腔和形成在其顶表面上的压花突起。透镜从压花突起沿着压纹凸起的外周向上圆顶。透镜由填充在空腔中的透光树脂制成。本发明确保从LED芯片产生的光的足够的视角，从而提高光提取效率。因此简化了组装过程，从而允许批量生产并降低制造成本。

7. 发明申请

US20060267036A1 High power light emitting diode package and fabrication method thereof 失效
标题翻译：大功率发光二极管封装及其制造方法
公开(公告)号：US20060267036A1
公开(公告)日：2006-11-30
申请号：US11442414
申请日：2006-05-30
申请人： Seon Lee , Hun Hahm , Dae Kim , Young Song , Young Park , Chang Song
发明人： Seon Lee , Hun Hahm , Dae Kim , Young Song , Young Park , Chang Song
IPC分类号： H01L33/00
CPC分类号： H01L33/647 , H01L24/97 , H01L33/60 , H01L33/62 , H01L33/641 , H01L2224/48247 , H01L2924/181 , H01L2224/48091 , H01L2924/00014 , H01L2924/00012
摘要： The invention relates to a high power LED package and a fabrication method thereof. The LED package includes a light emitting part for generating light in response to power applied, a heat conducting member with the light emitting part mounted thereon, a lead part for electrically connecting the light emitting part and a board, and a mold part for integrally fixing the heat conducting member and the lead part. The heat conducting member is composed of at least two metal layers in a height direction, and the lead part includes at least one first lead extended out of the heat conducting member and at least one second lead separated from the heat conducting member. The invention allows integration of two components into a single one, reducing the number of components and simplifying the assembly process, thereby reducing the manufacturing costs.
摘要翻译：本发明涉及一种大功率LED封装及其制造方法。 LED封装包括响应于施加的功率而产生光的发光部，安装有发光部的导热部件，用于电连接发光部和板的引线部，以及用于一体地固定的模具部导热部件和引线部分。导热构件由高度方向上的至少两个金属层构成，引线部包括从导热构件延伸的至少一个第一引线和与导热构件分离的至少一个第二引线。本发明允许将两个组件集成到一个组件中，减少组件的数量并简化组装过程，从而降低制造成本。

8. 发明申请

US20070121225A1 Optical pick-up actuator 失效
标题翻译：拾光执行器
公开(公告)号：US20070121225A1
公开(公告)日：2007-05-31
申请号：US11605277
申请日：2006-11-29
申请人： Chang Shin , Chang Song
发明人： Chang Shin , Chang Song
IPC分类号： G02B7/02
CPC分类号： G11B7/0932 , G02B7/08 , G11B7/093
摘要： An optical pick-up actuator includes a lens holder, a magnetic circuit, a wire spring, a wire holder, and a damper material receptacle. The lens holder includes an objective lens. The magnetic circuit moves the lens holder. The wire spring is coupled at one end thereof to a side of the lens holder, and supports the lens holder. The wire holder fixes the other end of the wire spring. The damper material receptacle defines an insert hole and a through-hole, through which the other end of the wire spring is inserted and passes. The damper material receptacle holds a predetermined damper material that absorbs vibrations imparted on the wire spring. The damper material defines an injecting hole, through which the damper material is injected, separately from the insert hole and the through-hole.
摘要翻译：光学拾取致动器包括透镜保持器，磁路，线弹簧，线夹和阻尼材料容器。透镜架包括物镜。磁路移动透镜架。线弹簧的一端连接到透镜保持器的一侧，并支撑透镜架。线架固定线弹簧的另一端。阻尼器材料容器限定了插入孔和通孔，线弹簧的另一端穿过该通孔和通孔。阻尼材料容器保持吸收线弹簧上施加的振动的预定阻尼材料。阻尼材料与插入孔和通孔分开设置一个注入孔，通过该注入孔阻尼材料被注入。

9. 发明申请

US20070113527A1 Air conditioning system 审中-公开
标题翻译：空调系统
公开(公告)号：US20070113527A1
公开(公告)日：2007-05-24
申请号：US11518282
申请日：2006-09-11
申请人： Chang Song , Ho Lee , Jong Park , Dong Kang , Ki Bang
发明人： Chang Song , Ho Lee , Jong Park , Dong Kang , Ki Bang
IPC分类号： B01D46/00
CPC分类号： F24F3/1603 , F24F1/0047 , F24F1/0071 , F24F7/08 , F24F12/006 , F24F2003/1614 , F24F2013/0616 , Y02A50/21 , Y02B30/563
摘要： An air conditioning system is provided. The air conditioning system includes an air cleaning unit. The air cleaning unit includes a grill having a discharge grill on a side portion, a fan sucking indoor air and/or outdoor air, a filter cleaning the sucked air, and an installation case attached to one side of the discharge grill and having a suction hole and an exhaust hole. A ventilation unit operates in association with the air cleaning unit. A duct member connects the air cleaning unit and the ventilation unit.
摘要翻译：提供空调系统。空调系统包括空气净化单元。空气净化单元包括在侧面具有放电格栅的格栅，吸入室内空气和/或室外空气的风扇，清洁吸入的空气的过滤器和附接到排放格栅的一侧的安装壳体，孔和排气孔。通风单元与空气净化单元相关联地操作。管道构件连接空气净化单元和通风单元。

10. 发明申请

US20070066215A1 Air conditioning apparatus 审中-公开
标题翻译：空调设备
公开(公告)号：US20070066215A1
公开(公告)日：2007-03-22
申请号：US11491165
申请日：2006-07-24
申请人： Chang Song , Ho Lee , Jong Park , Dong Kang , Kang Ko
发明人： Chang Song , Ho Lee , Jong Park , Dong Kang , Kang Ko
IPC分类号： F24F13/06 , B01D46/00 , F25D17/04
CPC分类号： F24F3/1603 , B01D46/0004 , B01D46/0023 , B01D46/0038 , B01D46/0039 , B01D46/008 , B01D2267/40 , B01D2273/30 , B01D2279/50 , F24F1/0071 , F24F11/30 , F24F13/32 , F24F2003/1614 , F24F2013/0616 , F24F2110/50 , F24F2110/70 , F24F2221/14 , Y02A50/21
摘要： An air conditioning apparatus is provided. The air conditioning apparatus includes a cover assembly having an indoor air suction hole, a filter assembly cleaning indoor air sucked through the indoor air suction hole, and a grill. The grill includes a discharge grill formed on a side for discharging the indoor air cleaned by the filter assembly to an indoor area, and an exhaust grill for discharging indoor air to an outdoor area. A fan assembly draws indoor or outdoor air toward the grill. A rear panel is coupled to the grill. The rear panel includes a suction hole formed in one side for introducing outdoor air and an exhaust hole formed beside the suction hole for discharging indoor air to the outdoor area.
摘要翻译：提供一种空调装置。该空气调节装置包括具有室内空气吸入孔的盖组件，清洁通过室内空气吸入孔吸入的室内空气的过滤器组件和格栅。格栅包括形成在用于将由过滤器组件清洁的室内空气排放到室内的侧面的排放格栅和用于将室内空气排放到室外区域的排气格栅。风扇组件将室内或室外空气朝向烤架抽吸。后面板连接到格栅。后面板包括形成在一侧的用于引入室外空气的吸入孔和形成在吸入孔旁边的用于将室内空气排放到室外区域的排气孔。

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