专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20070082833A1 LOW COST AND LOW DISHING SLURRY FOR POLYSILICON CMP 审中-公开
标题翻译：低成本和低抛光浆料用于多晶硅CMP
公开(公告)号：US20070082833A1
公开(公告)日：2007-04-12
申请号：US11611027
申请日：2006-12-14
申请人： Sen-Hou Ko , Kevin Song
发明人： Sen-Hou Ko , Kevin Song
IPC分类号： C11D3/00 , C11D9/20
CPC分类号： H01L21/3212 , C09G1/02 , H01L21/7684
摘要： Methods and compositions are provided for planarizing substrate surfaces with low dishing. Aspects of the invention provide methods of using compositions comprising an abrasive selected from the group consisting of alumina and ceria and a surfactant for chemical mechanical planarization of substrates to remove polysilicon.
摘要翻译：提供了用于将低凹陷平坦化基板表面的方法和组合物。本发明的方面提供使用包含选自氧化铝和二氧化铈的研磨剂的组合物和用于底物的化学机械平面化以除去多晶硅的表面活性剂的方法。

2. 发明授权

US07828626B2 Apparatus for conditioning processing pads 有权
标题翻译：用于调理加工垫的装置
公开(公告)号：US07828626B2
公开(公告)日：2010-11-09
申请号：US12248302
申请日：2008-10-09
申请人： Paul D. Butterfield , Sen-Hou Ko
发明人： Paul D. Butterfield , Sen-Hou Ko
IPC分类号： B24B53/00
CPC分类号： B24B53/017 , B24B53/12
摘要： Embodiments of an apparatus for conditioning a processing pad are provided. In one embodiment, an apparatus for conditioning a processing pad includes a member having a bottom surface selectively maintained in a non-planar orientation and an abrasive disposed on the bottom surface of the member. The abrasive is configured for conditioning a processing pad. The member and abrasive have a profile that produces a non-planar processing pad surface.
摘要翻译：提供了一种用于调理处理垫的装置的实施例。在一个实施例中，用于调理处理垫的装置包括具有选择性地保持在非平面取向的底表面和设置在构件的底表面上的研磨件的构件。研磨剂配置用于调理加工垫。构件和磨料具有产生非平面加工垫表面的轮廓。

3. 发明申请

US20090029629A1 METHODS AND APPARATUS FOR POLISHING AN EDGE OF A SUBSTRATE 审中-公开
标题翻译：用于抛光衬底边缘的方法和装置
公开(公告)号：US20090029629A1
公开(公告)日：2009-01-29
申请号：US12239726
申请日：2008-09-26
申请人： Ho Seon Shin , Gary C. Ettinger , Donald J.K. Olgado , Erik C. Wasinger , Sen-Hou Ko , Charles I. Dodds , Yufei Chen , Wei-Yung Hsu
发明人： Ho Seon Shin , Gary C. Ettinger , Donald J.K. Olgado , Erik C. Wasinger , Sen-Hou Ko , Charles I. Dodds , Yufei Chen , Wei-Yung Hsu
IPC分类号： B24B49/00
CPC分类号： B24B9/065 , B24B21/002 , B24B41/067 , B24B49/16 , B24B57/02
摘要： Methods for polishing an edge of a substrate are provided. The invention includes rotating a substrate against a polishing film so as to remove material from the edge of the substrate; and detecting an amount of force exerted in pressing the polishing film against the substrate. Numerous other aspects are provided.
摘要翻译：提供了抛光衬底边缘的方法。本发明包括将衬底旋转抵靠抛光膜，以便从衬底的边缘去除材料; 并且检测在将抛光膜压在基板上时施加的力的量。提供了许多其他方面。

4. 发明申请

US20070131654A1 Methods and apparatus for processing a substrate 有权
标题翻译：用于处理衬底的方法和设备
公开(公告)号：US20070131654A1
公开(公告)日：2007-06-14
申请号：US11299295
申请日：2005-12-09
申请人： Erik Wasinger , Gary Ettinger , Sen-Hou Ko , Wei-Yung Hsu , Liang-Yuh Chen , Ho Shin , Donald Olgado
发明人： Erik Wasinger , Gary Ettinger , Sen-Hou Ko , Wei-Yung Hsu , Liang-Yuh Chen , Ho Shin , Donald Olgado
IPC分类号： C03C15/00 , H01L21/306
CPC分类号： C03C19/00 , B24B1/04 , B24B9/065 , B24B21/004 , H01L21/02021
摘要： Apparatus and methods adapted to polish an edge of a substrate include a polishing film, a frame adapted to tension and load the polishing film so that at least a portion of the film is supported in a plane, and a substrate rotation driver adapted to rotate a substrate against the plane of the polishing film such that the polishing film is adapted to apply force to the substrate, contour to an edge of the substrate, the edge including at least an outer edge and a first bevel, and polish the outer edge and the first bevel as the substrate is rotated. Numerous other aspects are provided.
摘要翻译：适于抛光衬底边缘的装置和方法包括抛光膜，适于张紧和加载抛光膜的框架，使得膜的至少一部分被支撑在平面中，以及基板旋转驱动器，其适于旋转衬底抵靠抛光膜的平面，使得抛光膜适于对衬底施加力，轮廓到衬底的边缘，边缘至少包括外边缘和第一斜面，并且抛光外边缘和第一斜面作为基底旋转。提供了许多其他方面。

5. 发明授权

US07040971B2 Carrier head with a flexible membrane 失效
标题翻译：带头的柔性膜
公开(公告)号：US07040971B2
公开(公告)日：2006-05-09
申请号：US10946186
申请日：2004-09-20
申请人： Steven M. Zuniga , Manoocher Birang , Hung Chen , Sen-Hou Ko
发明人： Steven M. Zuniga , Manoocher Birang , Hung Chen , Sen-Hou Ko
IPC分类号： B24B1/00
CPC分类号： B24B37/30 , B24B37/32
摘要： A carrier head for a chemical mechanical polishing apparatus is described. The carrier head has a base, a rigid body, a membrane and a pressurizing structure. The rigid body is movable relative to the base and includes a downwardly-extending projection. The membrane has a mounting surface for a substrate. The membrane extends below the base to provide a chamber between the base and the membrane. The pressurizing structure applies a downward pressure on the rigid body to cause a lower surface of the rigid body to press on an inner surface of the membrane.
摘要翻译：描述了用于化学机械抛光装置的载体头。承载头具有底座，刚体，膜和加压结构。刚体相对于基座可移动并包括向下延伸的突出部。膜具有用于基底的安装表面。膜延伸到底部下方以在基底和膜之间提供腔室。加压结构向刚体施加向下的压力，以使刚体的下表面压在膜的内表面上。

6. 发明申请

US20050133363A1 Conductive polishing article for electrochemical mechanical polishing 失效
标题翻译：电化学机械抛光用导电抛光制品
公开(公告)号：US20050133363A1
公开(公告)日：2005-06-23
申请号：US11031545
申请日：2005-01-08
申请人： Yongqi Hu , Yan Wang , Alain Duboust , Feng Liu , Antoine Manens , Siew Neo , Stan Tsai , Liang-Yuh Chen , Paul Butterfield , Yuan Tian , Sen-Hou Ko
发明人： Yongqi Hu , Yan Wang , Alain Duboust , Feng Liu , Antoine Manens , Siew Neo , Stan Tsai , Liang-Yuh Chen , Paul Butterfield , Yuan Tian , Sen-Hou Ko
IPC分类号： B23H5/08 , B23H5/10 , B24B37/04 , B24B53/007 , B24D13/14 , H01L21/321 , C25D17/00
CPC分类号： B82Y30/00 , B23H5/08 , B23H5/10 , B24B37/046 , B24B37/14 , B24B37/16 , B24B37/205 , B24B37/22 , B24B37/24 , B24B37/26 , B24B53/017 , H01L21/32125 , Y10T428/249924
摘要： Embodiments of a polishing article for processing a substrate are provided. In one embodiment, a polishing article for processing a substrate comprises a fabric layer having a conductive layer disposed thereover. The conductive layer has an exposed surface adapted to polish a substrate. The fabric layer may be woven or non-woven. The conductive layer may be comprised of a soft metal and, in one embodiment, the exposed surface may be planar.
摘要翻译：提供了用于处理基板的抛光制品的实施例。在一个实施例中，用于处理衬底的抛光制品包括其上设置有导电层的织物层。导电层具有适于抛光衬底的暴露表面。织物层可以是编织的或非织造的。导电层可以由软金属构成，并且在一个实施例中，暴露的表面可以是平面的。

7. 发明授权

US06857946B2 Carrier head with a flexure 有权
标题翻译：承载头弯曲
公开(公告)号：US06857946B2
公开(公告)日：2005-02-22
申请号：US10353326
申请日：2003-01-28
申请人： Steven M. Zuniga , Manoocher Birang , Hung Chen , Sen-Hou Ko
发明人： Steven M. Zuniga , Manoocher Birang , Hung Chen , Sen-Hou Ko
IPC分类号： B24B37/30 , B24B37/32 , B24B49/16 , H01L21/304 , B24B1/00
CPC分类号： B24B37/30 , B24B37/32
摘要： A carrier head for a chemical mechanical polishing apparatus. The carrier head includes a housing, a base, a loading mechanism, a gimbal mechanism, and a substrate backing assembly. The substrate backing assembly includes a support structure positioned below the base, a substantially horizontal, annular flexure connecting the support structure to the base, and a flexible membrane connected to the support structure. The flexible membrane has a mounting surface for a substrate, and extends beneath the base to define a chamber.
摘要翻译：用于化学机械抛光装置的载体头。承载头包括壳体，基座，装载机构，万向节机构和基底背衬组件。衬底背衬组件包括位于底座下方的支撑结构，将支撑结构连接到基座的基本水平的环形弯曲部，以及连接到支撑结构的柔性膜。柔性膜具有用于基底的安装表面，并且在基底之下延伸以限定腔室。

8. 发明申请

US20050037698A1 Carrier head with a flexible membrane 失效
标题翻译：带头的柔性膜
公开(公告)号：US20050037698A1
公开(公告)日：2005-02-17
申请号：US10946186
申请日：2004-09-20
申请人： Steven Zuniga , Manoocher Birang , Hung Chen , Sen-Hou Ko
发明人： Steven Zuniga , Manoocher Birang , Hung Chen , Sen-Hou Ko
IPC分类号： B24B37/30 , B24B37/32 , B24B49/16 , H01L21/304 , B24B1/00
CPC分类号： B24B37/30 , B24B37/32
摘要： A carrier head for a chemical mechanical polishing apparatus is described. The carrier head has a base, a rigid body, a membrane and a pressurizing structure. The rigid body is movable relative to the base and includes a downwardly-extending projection. The membrane has a mounting surface for a substrate. The membrane extends below the base to provide a chamber between the base and the membrane. The pressurizing structure applies a downward pressure on the rigid body to cause a lower surface of the rigid body to press on an inner surface of the membrane.
摘要翻译：描述了用于化学机械抛光装置的载体头。承载头具有底座，刚体，膜和加压结构。刚体相对于基座可移动并包括向下延伸的突出部。膜具有用于基底的安装表面。膜延伸到底部下方以在基底和膜之间提供腔室。加压结构向刚体施加向下的压力，以使刚体的下表面压在膜的内表面上。

9. 发明授权

US06824455B2 Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus 失效
公开(公告)号：US06824455B2
公开(公告)日：2004-11-30
申请号：US10665925
申请日：2003-09-19
申请人： Thomas H. Osterheld , Sen-Hou Ko
发明人： Thomas H. Osterheld , Sen-Hou Ko
IPC分类号： B24B2900
CPC分类号： B24B37/26
摘要： A polishing pad for a chemical mechanical polishing apparatus. The polishing pad includes a plurality of concentric circular grooves. The polishing pad may include multiple regions with grooves of different widths and spacings.

10. 发明授权

US06648740B2 Carrier head with a flexible membrane to form multiple chambers 有权
标题翻译：载体头部具有柔性膜以形成多个腔室
公开(公告)号：US06648740B2
公开(公告)日：2003-11-18
申请号：US10251302
申请日：2002-09-19
申请人： Ilya Perlov , Eugene Gantvarg , Sen-Hou Ko
发明人： Ilya Perlov , Eugene Gantvarg , Sen-Hou Ko
IPC分类号： B24B2900
CPC分类号： B24B37/30 , B24B37/32 , B24B47/10 , B24B47/12 , B24B49/16
摘要： A carrier head with a flexible member connected to a base to define a first chamber, a second chamber and a third chamber. A lower surface of the flexible member provides a substrate receiving surface with an inner portion associated with the first chamber, a substantially annular middle portion surrounding the inner portion and associated with the second chamber, and a substantially annular outer portion surrounding the middle portion and associated with the third chamber. The width of the outer portion may be significantly less than the width of the middle portion. The carrier head may also include a flange connected to a drive shaft and a gimbal pivotally connecting the flange to the base.
摘要翻译：具有连接到基座以限定第一室，第二室和第三室的柔性构件的承载头。柔性构件的下表面提供了具有与第一腔室相关联的内部部分的基底接收表面，围绕内部部分并与第二腔室相关联的基本上环形的中间部分，以及围绕中间部分和相关联的基本上环形的外部部分与第三个房间。外部部分的宽度可以明显小于中间部分的宽度。承载头还可以包括连接到驱动轴的凸缘和将凸缘枢转地连接到基座的万向架。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式