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    • 1. 发明授权
    • Sample observing method and scanning electron microscope
    • 样品观察法和扫描电子显微镜
    • US08309923B2
    • 2012-11-13
    • US13148864
    • 2010-02-09
    • Seiko OmoriZhaohui ChengHideyuki Kazumi
    • Seiko OmoriZhaohui ChengHideyuki Kazumi
    • H01J37/28G01N23/04
    • G01B15/04H01J37/222H01J37/28H01J2237/24592H01J2237/2817
    • Provided is a sample observing method wherein the effect on throughput is minimized, and a pattern profile can be obtained at high accuracy even in a complicated LSI pattern, regardless of the scanning direction of an electron beam. In the sample observing method, the presence or absence of an edge parallel to a scanning direction (707) of an electron beam is judged regarding an edge (708) of a pattern to be observed (S702); if the edge is present, an area in the vicinity of the pattern edge is designated as a local pre-dose area (709) (S703); a local pre-dose of an electron beam is performed, so that the initial charged state is controlled not to return secondary electrons generated by irradiation of an electron beam when an image is captured, to the surface of a sample.
    • 提供了一种对吞吐量的影响最小化的样本观察方法,即使在复杂的LSI图案中也可以以高精度获得图案轮廓,而与电子束的扫描方向无关。 在样本观察方法中,关于要观察的图案的边缘(708)判断是否存在与电子束的扫描方向(707)平行的边缘(S702)。 如果存在边缘,则将图案边缘附近的区域指定为局部剂量前区域(709)(S703); 执行电子束的局部预先剂量,使得初始充电状态被控制为不将通过将图像捕获时的电子束的照射产生的二次电子返回到样品的表面。
    • 2. 发明申请
    • SAMPLE OBSERVING METHOD AND SCANNING ELECTRON MICROSCOPE
    • 样品观察方法和扫描电子显微镜
    • US20110303843A1
    • 2011-12-15
    • US13148864
    • 2010-02-09
    • Seiko OmoriZhaohui ChengHideyuki Kazumi
    • Seiko OmoriZhaohui ChengHideyuki Kazumi
    • G01N23/04H01J37/28
    • G01B15/04H01J37/222H01J37/28H01J2237/24592H01J2237/2817
    • Provided is a sample observing method wherein the effect on throughput is minimized, and a pattern profile can be obtained at high accuracy even in a complicated LSI pattern, regardless of the scanning direction of an electron beam. In the sample observing method, the presence or absence of an edge parallel to a scanning direction (707) of an electron beam is judged regarding an edge (708) of a pattern to be observed (S702); if the edge is present, an area in the vicinity of the pattern edge is designated as a local pre-dose area (709) (S703); a local pre-dose of an electron beam is performed, so that the initial charged state is controlled not to return secondary electrons generated by irradiation of an electron beam when an image is captured, to the surface of a sample.
    • 提供了一种对吞吐量的影响最小化的样本观察方法,即使在复杂的LSI图案中也可以以高精度获得图案轮廓,而与电子束的扫描方向无关。 在样本观察方法中,关于要观察的图案的边缘(708)判断与电子束的扫描方向(707)平行的边缘的存在或不存在(S702)。 如果存在边缘,则将图案边缘附近的区域指定为局部剂量前区域(709)(S703); 执行电子束的局部预先剂量,使得初始充电状态被控制为不将通过将图像捕获时的电子束的照射产生的二次电子返回到样品的表面。
    • 5. 发明授权
    • Apparatus and method for inspection and measurement
    • 仪器和方法进行检查和测量
    • US07910884B2
    • 2011-03-22
    • US12349059
    • 2009-01-06
    • Zhaohui ChengNatsuki Tsuno
    • Zhaohui ChengNatsuki Tsuno
    • G01N23/22G21K7/00H01J37/256
    • H01J37/28H01J37/244H01J2237/24475H01J2237/2448H01J2237/24564H01J2237/24592H01J2237/2817
    • An electrification control electrode B is installed at a measured or inspected specimen side of an electrification control electrode A, and a constant voltage is applied from an electrification control electrode control portion of an electrification control electrode B according to an electrification state of a specimen, whereby a variation of an electrification state and a potential barrier of a specimen surface formed before an inspection is suppressed. A retarding potential is applied by an electrification control electrode, and the electrification control electrode B is disposed below the electrification control electrode A adjusted to equal potential to a specimen. As a result, it is possible to adjust the amount that secondary electrons emitted from a specimen such as a wafer to which a primary electron beam is irradiated return to a specimen, and thus it is possible to stably maintain an inspection condition of high sensitivity during an inspection.
    • 带电控制电极B安装在充电控制电极A的测量或检查样品侧,并根据试样的带电状态从充电控制电极B的带电控制电极控制部分施加恒定电压,由此 在检查之前形成的试样表面的带电状态和势垒的变化被抑制。 由充电控制电极施加延迟电位,并且通电控制电极B设置在调节到与试样相同电位的充电控制电极A的下方。 结果,可以调节从诸如照射一次电子束的晶片等试样的二次电子返回到试样的量,从而可以稳定地维持高灵敏度的检查条件 检查。
    • 9. 发明授权
    • Charged particle beam apparatus
    • 带电粒子束装置
    • US07714288B2
    • 2010-05-11
    • US12149218
    • 2008-04-29
    • Tasuku YanoZhaohui ChengTakashi FurukawaOsamu Nasu
    • Tasuku YanoZhaohui ChengTakashi FurukawaOsamu Nasu
    • G21K7/00G21G5/00G01N23/00H01J3/14
    • G01N23/225H01J37/026H01J37/248H01J37/265H01J37/28H01J2237/004H01J2237/28
    • Electrification affected on a surface of a sample which is caused by irradiation of a primary charged particle beam is prevented when plural frames are integrated to obtain an image of a predetermined area of the sample in a charged particle beam apparatus. The predetermined area of the sample is scanned with a primary electron beam from an electron gun, and plural frames are generated and integrated while detecting generated secondary electrons with a detector to obtain the image of the predetermined area. If it is determined by a detection signal of the detector that an electrification amount at the predetermined area becomes a specified value when generating plural frames, an electricity removal voltage is applied to a boosting electrode to remove or reduce the electrification, prior to generation of the next frame. Accordingly, the signal-to-noise ratio of the image obtained by integrating plural frames can be improved.
    • 当多个帧被一体化以防止在带电粒子束装置中的样品的预定区域的图像时,防止了由一次带电粒子束的照射引起的样品表面影响的电气化。 用来自电子枪的一次电子束扫描样品的预定区域,并且用检测器检测产生的二次电子并产生并整合多个帧以获得预定区域的图像。 如果通过检测器的检测信号确定当产生多个帧时,预定区域的通电量变为规定值,则在生成多个帧之前将电去除电压施加到升压电极以去除或减少通电, 下一帧。 因此,可以提高通过对多个帧进行积分而获得的图像的信噪比。
    • 10. 发明授权
    • Inspection method and apparatus for circuit pattern of resist material
    • 抗蚀材料电路图案检测方法及装置
    • US06952105B2
    • 2005-10-04
    • US10620702
    • 2003-07-17
    • Zhaohui ChengMari Nozoe
    • Zhaohui ChengMari Nozoe
    • H01L21/66G01N23/00G01R31/302G01R31/305G06T1/00H01J37/04H01J37/147H01J37/28
    • H01J37/28H01J2237/2817
    • A pattern inspecting technique, depending on the kind of materials, can reduce damage including shrinkage to materials when the materials are prone to such damage as shrinkage and spoilage caused by electron beam irradiation. This is accomplished by scanning a sample with a primary electron beam, detecting secondary electrons generated, or electrons reflected from the semiconductor device, or both the former and latter electrons, and converting the electrons into signals, and transforming the signals into an image, displaying the image, and detecting defective spots in the circuit pattern of the sample. The irradiation density (dose per unit area) of the electron beam is monitored and limited depending on the kind of material of the circuit pattern under inspection and the inspecting conditions, and damage, such as shrinkage and spoilage to the materials during electron beam irradiation, is reduced to an allowable range.
    • 取决于材料种类的图案检查技术可以减少材料收缩时的损伤,当材料容易受到由电子束照射引起的收缩和变质等损害时。 这是通过用一次电子束扫描样品,检测产生的二次电子或从半导体器件反射的电子,或者前者和后面的电子,并将电子转换为信号,并将信号变换为图像,显示 图像,并检测样品的电路图案中的缺陷点。 电子束的照射密度(每单位面积的剂量)根据检查中的电路图案的材料的种类和检查条件进行监测和限制,并且在电子束照射期间对材料的收缩和变质等损害, 减少到允许范围。