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1. 发明授权

US4946242A Optical part including integral combination of optical fiber and light emitting or receiving element and method of manufacturing the same 失效
标题翻译：光学部件包括光纤和发光或接收元件的整体组合及其制造方法
公开(公告)号：US4946242A
公开(公告)日：1990-08-07
申请号：US234929
申请日：1988-08-22
申请人： Seikichi Tanno , Noriaki Taketani , Shuji Eguchi , Hideki Asano , Yukio Shimazaki , Yuuetsu Takuma , Masahiko Ibamoto , Junji Mukai
发明人： Seikichi Tanno , Noriaki Taketani , Shuji Eguchi , Hideki Asano , Yukio Shimazaki , Yuuetsu Takuma , Masahiko Ibamoto , Junji Mukai
IPC分类号： G01F23/292 , G01P3/486 , G02B6/42
CPC分类号： G02B6/4202 , G01F23/2927 , G01P3/486 , G02B6/4212 , G02B6/4298
摘要： An optical part for light transmission comprises a light conductor formed of a core of a transparent material and a clad of a material having a smaller refractive index than that of the core material, and a light emitting and/or receiving element, wherein the light emitting and/or receiving element is integrally combined with the core of the light conductor by a same material as the core material or by a material having a same refractive index as that of the core material and having a greater rigidity than that of the material forming the clad and/or jacket. The optical part can be used in a high temperature environment as well as a room temperature environment without involving any appreciable loss in light transmission.

2. 发明授权

US4873030A Method of molding a resinous optical transmitting element 失效
标题翻译：树脂光学传递元件的模制方法
公开(公告)号：US4873030A
公开(公告)日：1989-10-10
申请号：US214463
申请日：1988-07-01
申请人： Noriaki Taketani , Hideki Asano , Akira Endo , Tomiya Abe , Masahiko Ibamoto , Junji Mukai , Seikichi Tanno , Shuji Eguchi , Masato Shimura
发明人： Noriaki Taketani , Hideki Asano , Akira Endo , Tomiya Abe , Masahiko Ibamoto , Junji Mukai , Seikichi Tanno , Shuji Eguchi , Masato Shimura
IPC分类号： G02B6/00 , B29D11/00 , G02B6/02 , G02B6/28 , G02B6/30 , G02B6/42 , G02B6/44
CPC分类号： G02B6/4458 , B29D11/00663 , G02B6/02 , G02B6/2804 , G02B6/30 , G02B6/4203 , G02B6/4204 , G02B6/4255 , G02B6/4295 , Y10S425/808
摘要： There is provided a resinous optical transmitting element in which a core, through which light is transmitted, is formed into a predetermined non-linear configuration, and a cladding lower in refractive index than the core is in close contact with the core. A method of manufacturing the optical transmitting element comprises the steps of polymerizing polymeric material forming the core, within a mold having a predetermined non-linear cavity, subsequently removing the mold, and forming the cladding about the core. The resinous optical transmitting element obtained by the method can be formed into a selected one of various configurations in compliance with the purpose. In addition, the resinous optical transmitting element is less in distortion, making it possible to reduce the transmission loss.
摘要翻译：提供了一种树脂光学传输元件，其中光被透射的芯被形成为预定的非线性构造，并且折射率低于芯的包层与芯紧密接触。制造光学透射元件的方法包括以下步骤：在具有预定的非线性空腔的模具内聚合形成芯的聚合材料，随后移除模具，并围绕芯部形成包层。通过该方法获得的树脂光学发射元件可以根据目的形成各种配置中的所选择的一种。此外，树脂光发射元件的变形较小，可以降低传输损耗。

3. 发明授权

US5113477A Plastic optical fibers from polymers derived from metallic salts of ethylenic carboxyl monomers 失效
标题翻译：从乙烯羧酸单体的金属盐衍生的聚合物的塑料光纤
公开(公告)号：US5113477A
公开(公告)日：1992-05-12
申请号：US483294
申请日：1990-02-20
申请人： Shuji Eguchi , Noriaki Taketani , Seikichi Tanno , Yoshiaki Okabe , Hiromu Terao , Hideki Asano , Motoyo Wajima , Tomiya Abe
发明人： Shuji Eguchi , Noriaki Taketani , Seikichi Tanno , Yoshiaki Okabe , Hiromu Terao , Hideki Asano , Motoyo Wajima , Tomiya Abe
IPC分类号： G02B6/00 , C08F2/44 , C08F20/06 , C08F220/04 , D01F8/10 , G02B6/02
CPC分类号： D01F8/10 , G02B6/02033
摘要： A plastic optical fiber comprising a core and a clad, said core being formed by an amorphous and optically transparent polymer and said clad being formed by a polymer having a refractive index lower than that of the core by at least 0.3%, at least one of the core and the clad being formed by an amorphous and optically transparent polymer containing metal elements and halogen atoms, is low in light loss and excellent in heat resistance.
摘要翻译：一种包含芯和包层的塑料光纤，所述芯由无定形和光学透明的聚合物形成，所述包层由折射率低于芯的折射率至少0.3％的聚合物形成，至少有0.3％由包含金属元素和卤素原子的无定形和光学透明聚合物形成的芯和包层的光损耗低，耐热性优异。

4. 发明授权

US4810048A Mechanical part mounting chassis with integrated circuit 失效
标题翻译：机械部件安装底盘带集成电路
公开(公告)号：US4810048A
公开(公告)日：1989-03-07
申请号：US788258
申请日：1985-10-17
申请人： Hideki Asano , Shuji Eguchi , Seikichi Tanno , Yoshiaki Okabe , Noriaki Taketani , Masanori Nemoto , Tuneo Narusawa , Yoshimitsu Mihara , Yukihiko Takada
发明人： Hideki Asano , Shuji Eguchi , Seikichi Tanno , Yoshiaki Okabe , Noriaki Taketani , Masanori Nemoto , Tuneo Narusawa , Yoshimitsu Mihara , Yukihiko Takada
IPC分类号： H05K7/04 , G02B6/12 , G11B33/02 , G11B33/12 , H05K1/00 , H05K1/02 , H05K1/05 , H05K1/18 , H05K3/30
CPC分类号： G11B33/12 , G02B6/12004 , G11B33/02 , H05K1/0284 , H05K1/0274 , H05K1/0393 , H05K1/056 , H05K1/18 , H05K2201/09045 , H05K2201/09118 , H05K2203/1327 , H05K3/301
摘要： This invention comprises unifying circuits with a base on which mechanical parts are mounted and relates to a mechanical part mounting chassis provided with a substrate and a circuit buried in the substrate and/or spread out on the substrate surface.
摘要翻译：本发明包括具有安装有机械部件的基座的统一电路，并且涉及设置有衬底和埋置在衬底中和/或扩散在衬底表面上的电路的机械部件安装底盘。

5. 发明授权

US4585841A Transparent resin material containing metallic atoms bonded to pendent carboxylic acid groups 失效
标题翻译：透明树脂材料含有金属原子键合到侧链羧酸基团
公开(公告)号：US4585841A
公开(公告)日：1986-04-29
申请号：US547585
申请日：1983-11-01
申请人： Shuji Eguchi , Noriaki Taketani , Hideki Asano , Motoyo Wajima
发明人： Shuji Eguchi , Noriaki Taketani , Hideki Asano , Motoyo Wajima
IPC分类号： C08F212/08 , C08F220/04 , C08F220/06 , G02B1/04 , C08F30/04 , C08F130/04 , C08F230/04
CPC分类号： C08F220/04 , G02B1/04
摘要： A transparent resin material containing metallic atoms (except for alkali metals) which are ionic-bonded to a vitreous polymeric material constituting the substance of said resin material, in an amount of at least 8% by weight based on the total weight of the resin material, said resin material having a transparency of at least 80% in terms of a light transmittance, and a refractive index n.sub.D.sup.25 of at least 1.55.
摘要翻译：以构成所述树脂材料的物质的玻璃质聚合物离子键合的金属原子（碱金属除外）的透明树脂材料的含量相对于树脂材料的总重量为8重量％以上所述树脂材料的透光率为透明度至少为80％，折射率nD25至少为1.55。

6. 发明授权

US07445455B2 Electronic device 失效
标题翻译：电子设备
公开(公告)号：US07445455B2
公开(公告)日：2008-11-04
申请号：US11183972
申请日：2005-07-19
申请人： Takehide Yokozuka , Masahide Harada , Shiro Yamashita , Isamu Yoshida , Masahiko Asano , Koji Sato , Shuji Eguchi , Kaoru Uchiyama
发明人： Takehide Yokozuka , Masahide Harada , Shiro Yamashita , Isamu Yoshida , Masahiko Asano , Koji Sato , Shuji Eguchi , Kaoru Uchiyama
IPC分类号： H01R12/00
CPC分类号： H05K5/069 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/19105 , H01L2924/3025 , H05K1/0313 , H05K3/3447 , H05K5/0069 , H05K2201/0999 , H05K2201/10189 , H05K2201/10977 , H05K2201/2009 , Y10S439/935 , H01L2924/00
摘要： An electronic device comprises a circuit board which has a through hole and uses a resin with a glass transition temperature exceeding 150° C. as a base member, a metal casing which has an opening, and a connector which is fitted to the opening of the metal casing in which a pin of the connector is inserted into the through hole, the pin and the through hole are connected with a conductive member, and a reinforcement member for securing the connector and the board is further provided on the conductive member, thereby improving the reliability of the electronic device.
摘要翻译：一种电子设备包括具有通孔并使用玻璃化转变温度超过150℃的树脂作为基底的电路板，具有开口的金属外壳和安装在所述开口的连接器金属壳体，其中连接器的销插入通孔中，销和通孔与导电构件连接，并且还在导电构件上设置用于固定连接器和板的加强构件，从而改善电子设备的可靠性。

7. 发明授权

US07091620B2 Semiconductor device and manufacturing method thereof 有权
公开(公告)号：US07091620B2
公开(公告)日：2006-08-15
申请号：US11116209
申请日：2005-04-28
申请人： Chuichi Miyazaki , Yukiharu Akiyama , Masnori Shibamoto , Tomoaki Kudaishi , Ichiro Anjoh , Kunihiko Nishi , Asao Nishimura , Hideki Tanaka , Ryosuke Kimoto , Kunihiro Tsubosaki , Akio Hasebe , Takehiro Ohnishi , Noriou Shimada , Shuji Eguchi , Hiroshi Koyama , Akira Nagai , Masahiko Ogino
发明人： Chuichi Miyazaki , Yukiharu Akiyama , Masnori Shibamoto , Tomoaki Kudaishi , Ichiro Anjoh , Kunihiko Nishi , Asao Nishimura , Hideki Tanaka , Ryosuke Kimoto , Kunihiro Tsubosaki , Akio Hasebe , Takehiro Ohnishi , Noriou Shimada , Shuji Eguchi , Hiroshi Koyama , Akira Nagai , Masahiko Ogino
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/50 , H01L23/3114 , H01L23/3128 , H01L23/49572 , H01L23/49816 , H01L23/49827 , H01L23/4985 , H01L24/06 , H01L24/45 , H01L24/48 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/06136 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/4824 , H01L2224/48465 , H01L2224/50 , H01L2224/85951 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/00015 , H01L2224/05599
摘要： A semiconductor device includes a semiconductor chip formed with connection terminals, an elastic structure interposed between a main surface of the chip and a wiring substrate formed with wirings connected at first ends thereof to the connection terminals, and bump electrodes connected to the other ends of the wirings. The connection terminals may be at a center part or in peripheral part(s) of the chip main surface and both the elastic structure and wiring substrate are not provided at locations of connection terminals. A resin body seals at least the connection terminals and the exposed first ends of wirings (leads). In a scheme in which the connection terminals are located in a peripheral part of the chip main surface, the wiring substrate protrudes beyond the chip boundary where the connection terminals are arranged, and the resin body shape is restricted by the protruding part of the wiring substrate.

8. 发明申请

US20050069277A1 Mobile millimetric wave radar 审中-公开
标题翻译：移动毫米波雷达
公开(公告)号：US20050069277A1
公开(公告)日：2005-03-31
申请号：US10494932
申请日：2001-11-09
申请人： Terumi Nakazawa , Kenji Tabuchi , Shuji Eguchi , Tsuyoshi Fujita , Hidetaka Shigi
发明人： Terumi Nakazawa , Kenji Tabuchi , Shuji Eguchi , Tsuyoshi Fujita , Hidetaka Shigi
IPC分类号： G01S7/03 , G01S13/34 , G01S13/93 , H01Q1/32 , H01Q1/42 , H01Q21/00 , H01Q23/00 , G02B6/00
CPC分类号： H01Q23/00 , G01S7/032 , G01S13/348 , G01S13/931 , G01S2013/9353 , H01L2223/6677 , H01L2224/16227 , H01L2224/48227 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01Q1/3233 , H01Q1/42 , H01Q21/0087
摘要： An antenna unit for sending out electromagnetic waves of a millimetric-wave band to outside and receiving the wave reflected from a target, and circuits for signal-processing the reflected wave are equipped as a vehicular millimetric-wave radar device. Antenna patterns are formed on a surface of a multilayer base plate formed of plural stacked layers of dielectric plates and an electroconductive layer interposed between each layer. Circuit wiring patterns and electronic components for signal processing of millimetric waves are disposed on the reverse side. Among all the above-mentioned electronic components, only a millimetric-wave signal oscillator, amplifier, and frequency converter are haused in a hermetically sealed section formed in a localized space on a face of the multilayer base plate. The other electronic components are arranged in a non-hermetically structured condition on a periphery of the hermetically sealed section. The above-mentioned oscillator, amplifier, and frequency converter are hermetically sealed in an inert gas atmosphere, whereas at least part of the other electronic components arranged in a non-hermetically structured condition is protected by resin coating. With this configuration, a compact, thin, and highly accurate millimetric-wave radar device is provided at a low cost.
摘要翻译：天线单元，用于向外部发送毫米波段的电磁波并接收从目标反射的波，以及用于信号处理反射波的电路作为车辆毫米波雷达装置。天线图案形成在由介电板的多个堆叠层和介于每层之间的导电层形成的多层基板的表面上。用于毫米波信号处理的电路布线图形和电子部件设置在反面上。在所有上述电子部件中，只有一个毫米波信号振荡器，放大器和变频器在形成在多层基板的表面上的局部空间中的气密密封部分中。其他电子部件在气密密封部分的周边上以非气密结构的状态布置。上述振荡器，放大器和变频器被气密地密封在惰性气体气氛中，而以非气密结构状态布置的其它电子部件的至少一部分被树脂涂覆保护。通过这种配置，以低成本提供了紧凑，薄型和高精度的毫米波雷达装置。

9. 发明授权

US06686226B1 Method of manufacturing a semiconductor device a ball grid array package structure using a supporting frame 失效
标题翻译：使用支撑框架制造半导体器件的球栅阵列封装结构的方法
公开(公告)号：US06686226B1
公开(公告)日：2004-02-03
申请号：US09562758
申请日：2000-05-02
申请人： Shigeharu Tsunoda , Junichi Saeki , Isamu Yoshida , Kazuya Ooji , Michiharu Honda , Makoto Kitano , Nae Yoneda , Shuji Eguchi , Kunihiko Nishi , Ichiro Anjoh , Kenichi Otsuka
发明人： Shigeharu Tsunoda , Junichi Saeki , Isamu Yoshida , Kazuya Ooji , Michiharu Honda , Makoto Kitano , Nae Yoneda , Shuji Eguchi , Kunihiko Nishi , Ichiro Anjoh , Kenichi Otsuka
IPC分类号： H01L2144
CPC分类号： H01L24/97 , H01L21/565 , H01L23/3107 , H01L23/3128 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/05554 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/12044 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2224/83 , H01L2224/85 , H01L2224/05599 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film, is sealed with resin, using a mold, which is composed of an upper mold half and a lower mold half with the lower mold half having a plurality of projections, one at a position corresponding to each of the external terminals. The mold has a divisional structure which has an air vent between the divisional elements thereof.
摘要翻译：一种半导体塑料封装，更具体地，优选的封装结构和用于制造BGA封装的方法。树脂密封BGA封装，其中固定支撑半导体部件的支撑框架; 即IC芯片，电路板或电路膜用树脂密封，使用由上半模和下半模组成的模具，下半模具有多个突起，一个在与每个外部端子对应的位置。模具具有在其分割元件之间具有通风口的分隔结构。

10. 发明授权

US06586105B2 Packaging structure and method for automotive components 有权
公开(公告)号：US06586105B2
公开(公告)日：2003-07-01
申请号：US09823976
申请日：2001-04-03
申请人： Shuji Eguchi , Masahiko Asano , Mutsumi Watanabe , Kunito Nakatsuru , Hiroatsu Tokuda
发明人： Shuji Eguchi , Masahiko Asano , Mutsumi Watanabe , Kunito Nakatsuru , Hiroatsu Tokuda
IPC分类号： B32B2706
CPC分类号： H05K3/284 , H01L23/24 , H01L24/45 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/85099 , H01L2224/85207 , H01L2224/8592 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01039 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/3025 , Y10S428/901 , Y10T428/31663 , H01L2924/00014 , H01L2924/2076 , H01L2924/20753 , H01L2924/20752 , H01L2924/00
摘要： The invention provides a packaging structure applied to an automotive component having semiconductors and electronic parts mounted on a ceramic base, characterized in that the semiconductors and electronic parts are partly or entirely sealed with a thixotropic silicone gel which has a thixotropy index of about 1.5-3.6 and a penetration depth of about 6-10 mm and a rate of change in viscosity of less than 10% of the initial value.

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