专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20100226095A1 HEAT CONDUCTIVE SHEET AND POWER MODULE 有权
标题翻译：热传导片和功率模块
公开(公告)号：US20100226095A1
公开(公告)日：2010-09-09
申请号：US12675549
申请日：2008-09-12
申请人： Kenji Mimura , Hideki Takigawa , Hiroki Shiota , Kazuhiro Tada , Takashi Nishimura , Hiromi Ito , Seiki Hiramatsu , Atsuko Fujino , Kei Yamamoto , Motoki Masaki
发明人： Kenji Mimura , Hideki Takigawa , Hiroki Shiota , Kazuhiro Tada , Takashi Nishimura , Hiromi Ito , Seiki Hiramatsu , Atsuko Fujino , Kei Yamamoto , Motoki Masaki
IPC分类号： H05K7/20 , F28F7/00 , B21D53/02
CPC分类号： H01L23/3737 , F28F2013/006 , H01L23/4334 , H01L23/49568 , H01L23/49575 , H01L24/29 , H01L24/45 , H01L24/48 , H01L2224/2929 , H01L2224/29386 , H01L2224/29499 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2924/01019 , H01L2924/181 , Y10T29/4935 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Provided is a heat conductive sheet obtained by dispersing an inorganic filler in a thermosetting resin, in which the inorganic filler contains secondary aggregation particles formed by isotropically aggregating scaly boron nitride primary particles having an average length of 15 μm or less, and the inorganic filler contains more than 20 vol % of the secondary aggregation particles each having a particle diameter of 50 μm or more. The heat conductive sheet is advantageous in terms of productivity and cost and excellent in heat conductivity and electrical insulating properties.
摘要翻译：提供了一种通过将无机填料分散在热固性树脂中而获得的导热片，其中无机填料含有通过各向同性地聚集平均长度为15μm以下的鳞片状氮化硼一次粒子形成的二次凝集粒子，无机填料含有大于20体积％的二次聚集粒子各自具有50μm以上的粒径。导热片在生产率和成本方面是有利的，并且导热性和电绝缘性能优异。

2. 发明授权

US07514782B2 Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US07514782B2
公开(公告)日：2009-04-07
申请号：US11697094
申请日：2007-04-05
申请人： Seiki Hiramatsu , Kei Yamamoto , Atsuko Fujino , Hiromi Ito
发明人： Seiki Hiramatsu , Kei Yamamoto , Atsuko Fujino , Hiromi Ito
IPC分类号： H01L23/373
CPC分类号： H01L23/3735 , H01L23/3677 , H01L23/3731 , H01L25/0655 , H01L2023/4081 , H01L2224/48247 , H01L2224/49111 , H01L2224/49175 , H01L2924/09701 , H01L2924/181 , H01L2924/19107 , H01L2924/00 , H01L2924/00012
摘要： An objective is to provide a reliability-improved semiconductor device in which heat radiation characteristics are superior, and warpage of the semiconductor device occurring due to heat generation of a semiconductor chip or to varying of the usage environment is also suppressed. The semiconductor device is provided that includes a thermal-conductive sheet 3 formed on a base board 4, including thermal-conductive resin 6, a heat sink 2 provided on the base board 4 through the thermal-conductive sheet 3, a semiconductor chip 1 mounted on the heat sink 2, and a ceramic-embedded region 31 selectively provided in a region of the thermal-conductive sheet 3 under the semiconductor chip 1, including a ceramic component 5. In this semiconductor device, superior thermal conductivity can be ensured, and warpage and peeling in the semiconductor device occurring due to heat generation of the semiconductor chip or to varying of the usage environment can also be reduced.
摘要翻译：目的是提供一种可靠性改善的半导体器件，其中散热特性优异，并且还抑制了由于半导体芯片的发热而产生的半导体器件的翘曲或者使用环境的变化。该半导体装置具备：包括导热性树脂6的基板4上形成的导热片3，通过导热片3设置在基板4上的散热片2，安装有半导体芯片1 并且在包含陶瓷部件5的半导体芯片1的下方的热传导片3的区域中选择性地设置陶瓷嵌入区域31.在该半导体装置中，可以确保优良的导热性，也可以减少由于半导体芯片的发热而发生的半导体器件的翘曲和剥离或使用环境的变化。

3. 发明授权

US08193633B2 Heat conductive sheet and method for producing same, and powder module 有权
标题翻译：导热片及其制造方法和粉末组件
公开(公告)号：US08193633B2
公开(公告)日：2012-06-05
申请号：US12675549
申请日：2008-09-12
申请人： Kenji Mimura , Hideki Takigawa , Hiroki Shiota , Kazuhiro Tada , Takashi Nishimura , Hiromi Ito , Seiki Hiramatsu , Atsuko Fujino , Kei Yamamoto , Motoki Masaki
发明人： Kenji Mimura , Hideki Takigawa , Hiroki Shiota , Kazuhiro Tada , Takashi Nishimura , Hiromi Ito , Seiki Hiramatsu , Atsuko Fujino , Kei Yamamoto , Motoki Masaki
IPC分类号： H01L23/34 , H01L23/10
CPC分类号： H01L23/3737 , F28F2013/006 , H01L23/4334 , H01L23/49568 , H01L23/49575 , H01L24/29 , H01L24/45 , H01L24/48 , H01L2224/2929 , H01L2224/29386 , H01L2224/29499 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2924/01019 , H01L2924/181 , Y10T29/4935 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Provided is a heat conductive sheet obtained by dispersing an inorganic filler in a thermosetting resin, in which the inorganic filler contains secondary aggregation particles formed by isotropically aggregating scaly boron nitride primary particles having an average length of 15 μm or less, and the inorganic filler contains more than 20 vol % of the secondary aggregation particles each having a particle diameter of 50 μm or more. The heat conductive sheet is advantageous in terms of productivity and cost and excellent in heat conductivity and electrical insulating properties.
摘要翻译：提供了一种通过将无机填料分散在热固性树脂中而获得的导热片，其中无机填料含有通过各向同性地聚集平均长度为15μm以下的鳞片状氮化硼一次粒子形成的二次凝集粒子，无机填料含有大于20体积％的二次聚集粒子各自具有50μm以上的粒径。导热片在生产率和成本方面是有利的，并且导热性和电绝缘性能优异。

4. 发明申请

US20070241450A1 SEMICONDUCTOR DEVICE 失效
标题翻译：半导体器件
公开(公告)号：US20070241450A1
公开(公告)日：2007-10-18
申请号：US11697094
申请日：2007-04-05
申请人： Seiki Hiramatsu , Kei Yamamoto , Atsuko Fujino , Hiromi Ito
发明人： Seiki Hiramatsu , Kei Yamamoto , Atsuko Fujino , Hiromi Ito
IPC分类号： H01L23/34
CPC分类号： H01L23/3735 , H01L23/3677 , H01L23/3731 , H01L25/0655 , H01L2023/4081 , H01L2224/48247 , H01L2224/49111 , H01L2224/49175 , H01L2924/09701 , H01L2924/181 , H01L2924/19107 , H01L2924/00 , H01L2924/00012
摘要： An objective is to provide a reliability-improved semiconductor device in which heat radiation characteristics are superior, and warpage of the semiconductor device occurring due to heat generation of a semiconductor chip or to varying of the usage environment is also suppressed. The semiconductor device is provided that includes a thermal-conductive sheet 3 formed on a base board 4, including thermal-conductive resin 6, a heat sink 2 provided on the base board 4 through the thermal-conductive sheet 3, a semiconductor chip 1 mounted on the heat sink 2, and a ceramic-embedded region 31 selectively provided in a region of the thermal-conductive sheet 3 under the semiconductor chip 1, including a ceramic component 5. In this semiconductor device, superior thermal conductivity can be ensured, and warpage and peeling in the semiconductor device occurring due to heat generation of the semiconductor chip or to varying of the usage environment can also be reduced.
摘要翻译：目的是提供一种可靠性改善的半导体器件，其中散热特性优异，并且还抑制了由于半导体芯片的发热而产生的半导体器件的翘曲或者使用环境的变化。该半导体装置具备：包括导热性树脂6的基板4上形成的导热片3，通过导热片3设置在基板4上的散热片2，安装有半导体芯片1 以及选择性地设置在包含陶瓷部件5的半导体芯片1的导热性片3的区域内的陶瓷嵌入区域31。在该半导体装置中，可以确保优异的导热性，并且还可以降低由于半导体芯片的发热而产生的半导体器件的翘曲和剥离或者使用环境的变化。

5. 发明授权

US08236666B2 Semiconductor device and process for producing same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US08236666B2
公开(公告)日：2012-08-07
申请号：US12664751
申请日：2007-12-05
申请人： Seiki Hiramatsu , Kei Yamamoto , Atsuko Fujino , Takashi Nishimura , Kenji Mimura , Hideki Takigawa , Hiroki Shiota , Nobutake Taniguchi , Hiroshi Yoshida
发明人： Seiki Hiramatsu , Kei Yamamoto , Atsuko Fujino , Takashi Nishimura , Kenji Mimura , Hideki Takigawa , Hiroki Shiota , Nobutake Taniguchi , Hiroshi Yoshida
IPC分类号： H01L21/00 , H01L21/46 , H01L21/30
CPC分类号： H01L23/3737 , H01L23/16 , H01L23/3121 , H01L23/3735 , H01L23/5386 , H01L23/562 , H01L2224/48091 , H01L2924/09701 , H01L2924/19107 , H05K1/056 , H05K3/041 , H05K3/202 , H05K3/44 , H05K2201/0209 , H05K2201/09745 , H05K2201/09881 , H01L2924/00014
摘要： Provided is a semiconductor device including: a base plate; a thermally conductive resin layer formed on an upper surface of the base plate; an integrated layer which is formed on an upper surface of the thermally conductive resin layer, and includes an electrode and an insulating resin layer covering all side surfaces of the electrode; and a semiconductor element formed on an upper surface of the electrode, in which the integrated layer is thermocompression bonded to the base plate through the thermally conductive resin layer. This semiconductor device excels in insulating properties and reliability.
摘要翻译：提供一种半导体器件，包括：基板; 形成在所述基板的上表面上的导热树脂层; 形成在导热性树脂层的上表面的整体层，具有覆盖电极的所有侧面的电极和绝缘性树脂层; 以及形成在所述电极的上表面上的半导体元件，其中所述一体层通过所述导热树脂层热压接合到所述基板。该半导体器件的绝缘性和可靠性优异。

6. 发明申请

US20100201002A1 SEMICONDUCTOR DEVICE AND PROCESS FOR PRODUCING SAME 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20100201002A1
公开(公告)日：2010-08-12
申请号：US12664751
申请日：2007-12-05
申请人： Seiki Hiramatsu , Kei Yamamoto , Atsuko Fujino , Takashi Nishimura , Kenji Mimura , Hideki Takigawa , Hiroki Shiota , Nobutake Taniguchi , Hiroshi Yoshida
发明人： Seiki Hiramatsu , Kei Yamamoto , Atsuko Fujino , Takashi Nishimura , Kenji Mimura , Hideki Takigawa , Hiroki Shiota , Nobutake Taniguchi , Hiroshi Yoshida
IPC分类号： H01L23/36 , H01L21/58 , H01L23/31
CPC分类号： H01L23/3737 , H01L23/16 , H01L23/3121 , H01L23/3735 , H01L23/5386 , H01L23/562 , H01L2224/48091 , H01L2924/09701 , H01L2924/19107 , H05K1/056 , H05K3/041 , H05K3/202 , H05K3/44 , H05K2201/0209 , H05K2201/09745 , H05K2201/09881 , H01L2924/00014
摘要： Provided is a semiconductor device including: a base plate; a thermally conductive resin layer formed on an upper surface of the base plate; an integrated layer which is formed on an upper surface of the thermally conductive resin layer, and includes an electrode and an insulating resin layer covering all side surfaces of the electrode; and a semiconductor element formed on an upper surface of the electrode, in which the integrated layer is thermocompression bonded to the base plate through the thermally conductive resin layer. This semiconductor device excels in insulating properties and reliability.
摘要翻译：提供一种半导体器件，包括：基板; 形成在所述基板的上表面上的导热树脂层; 形成在导热性树脂层的上表面的整体层，具有覆盖电极的所有侧面的电极和绝缘性树脂层; 以及形成在所述电极的上表面上的半导体元件，其中所述一体层通过所述导热树脂层热压接合到所述基板。该半导体器件的绝缘性和可靠性优异。

7. 发明授权

US09029438B2 Thermosetting resin composition, B-stage heat conductive sheet, and power module 有权
标题翻译：热固性树脂组合物，B级导热片和电源模块
公开(公告)号：US09029438B2
公开(公告)日：2015-05-12
申请号：US13576065
申请日：2010-12-28
申请人： Kei Yamamoto , Takashi Nishimura , Kenji Mimura , Motoki Masaki , Seiki Hiramatsu , Xiaohong Yin
发明人： Kei Yamamoto , Takashi Nishimura , Kenji Mimura , Motoki Masaki , Seiki Hiramatsu , Xiaohong Yin
IPC分类号： C08G59/40 , C08K3/10 , H01L23/373 , H01L25/07 , H01L23/495 , H01L23/00
CPC分类号： C08K3/10 , H01L23/3737 , H01L23/49568 , H01L24/48 , H01L25/072 , H01L2224/451 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/00014 , H01L2924/01004 , H01L2924/10253 , H01L2924/10272 , H01L2924/1033 , H01L2924/12042 , H01L2924/15159 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Provided is a thermosetting resin composition including an inorganic filler and a thermosetting resin matrix component, in which the inorganic filler includes secondary sintered particles each formed of primary particles of scaly boron nitride, and at least some of the secondary sintered particles each have a maximum cavity diameter of 5 μm to 80 μm. The thermosetting resin composition can be used for providing a heat conductive sheet in which electrical insulation property is kept by controlling where the defects such as voids and cracks occur and their size, and which has excellent heat conductivity.
摘要翻译：提供一种包含无机填料和热固性树脂基质组分的热固性树脂组合物，其中无机填料包括由鳞状氮化硼的初级颗粒形成的二次烧结颗粒，并且至少一些二次烧结颗粒各自具有最大空腔直径为5μm〜80μm。热固性树脂组合物可用于提供通过控制诸如空隙和裂纹等缺陷及其尺寸的缺陷而导致电绝缘性能并且具有优异导热性的导热片。

8. 发明申请

US20130012621A1 THERMOSETTING RESIN COMPOSITION, B-STAGE HEAT CONDUCTIVE SHEET, AND POWER MODULE 有权
标题翻译：热固性树脂组合物，B级导热片和电源模块
公开(公告)号：US20130012621A1
公开(公告)日：2013-01-10
申请号：US13576065
申请日：2010-12-28
申请人： Kei Yamamoto , Takashi Nishimura , Kenji Mimura , Motoki Masaki , Seiki Hiramatsu , Xiaohong Yin
发明人： Kei Yamamoto , Takashi Nishimura , Kenji Mimura , Motoki Masaki , Seiki Hiramatsu , Xiaohong Yin
IPC分类号： C08L63/02 , C08L63/00 , C08L79/08 , C08L71/10 , C08L79/04 , C08L83/00 , C08K3/38 , C08L67/00
CPC分类号： C08K3/10 , H01L23/3737 , H01L23/49568 , H01L24/48 , H01L25/072 , H01L2224/451 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/00014 , H01L2924/01004 , H01L2924/10253 , H01L2924/10272 , H01L2924/1033 , H01L2924/12042 , H01L2924/15159 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Provided is a thermosetting resin composition including an inorganic filler and a thermosetting resin matrix component, in which the inorganic filler includes secondary sintered particles each formed of primary particles of scaly boron nitride, and at least some of the secondary sintered particles each have a maximum cavity diameter of 5 μm to 80 μm. The thermosetting resin composition can be used for providing a heat conductive sheet in which electrical insulation property is kept by controlling where the defects such as voids and cracks occur and their size, and which has excellent heat conductivity.
摘要翻译：提供一种包含无机填料和热固性树脂基质组分的热固性树脂组合物，其中无机填料包括由鳞状氮化硼的初级颗粒形成的二次烧结颗粒，并且至少一些二次烧结颗粒各自具有最大空腔直径为5μm〜80μm。热固性树脂组合物可用于提供通过控制诸如空隙和裂纹等缺陷及其尺寸的缺陷而导致电绝缘性能并且具有优异导热性的导热片。

9. 发明申请

US20130306991A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20130306991A1
公开(公告)日：2013-11-21
申请号：US13980692
申请日：2011-04-22
申请人： Mamoru Terai , Seiki Hiramatsu , Tatsuo Ota , Hiroya Ikuta , Takashi Nishimura
发明人： Mamoru Terai , Seiki Hiramatsu , Tatsuo Ota , Hiroya Ikuta , Takashi Nishimura
IPC分类号： H01L23/28 , H01L29/16
CPC分类号： H01L23/28 , H01L25/07 , H01L25/072 , H01L25/18 , H01L29/16 , H01L2224/32225 , H01L2224/45015 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/4903 , H01L2224/73265 , H01L2924/13091 , H01L2924/181 , H01L2924/19107 , H01L2924/00 , H01L2924/00014 , H01L2924/2076 , H01L2924/00012
摘要： A semiconductor device includes: a semiconductor-element substrate in which a front-surface electrode pattern is formed on a surface of an insulating substrate and a back-surface electrode is formed on another surface; semiconductor elements affixed to the surface of the front-surface electrode pattern opposite the insulating substrate; and a sealing resin member which covers the semiconductor element and the semiconductor-element substrate, wherein at a position of the front-surface electrode pattern where the position has potential equivalent to that of the front-surface electrode pattern at a position where a semiconductor element is bonded, an insulating terminal table formed with a conductive relay terminal and an insulating member that insulates the relay terminal and the front-surface electrode pattern from each other are provided, and wiring from the semiconductor element to the outside is led out via the relay terminal.
摘要翻译：半导体器件包括：在绝缘基板的表面上形成有前表面电极图案和在其他表面上形成背面电极的半导体元件基板; 固定在与绝缘基板相对的前表面电极图案表面的半导体元件; 以及覆盖半导体元件和半导体元件基板的密封树脂部件，其中，在前表面电极图案的位置具有与前表面电极图案的电位相当的电位的位置，在半导体元件设置有形成有导电继电器端子和绝缘构件的绝缘端子台，其使继电器端子和前表面电极图案彼此绝缘，并且从半导体元件到外部的布线经由继电器引出终奌站。

10. 发明授权

US08222752B2 Organopolysiloxane composition and semiconductor apparatus 有权
标题翻译：有机聚硅氧烷组合物和半导体装置
公开(公告)号：US08222752B2
公开(公告)日：2012-07-17
申请号：US12970211
申请日：2010-12-16
申请人： Seiki Hiramatsu
发明人： Seiki Hiramatsu
IPC分类号： H01L23/29
CPC分类号： C08L83/04 , C08G77/20 , H01L23/296 , H01L2224/48091 , H01L2224/48137 , H01L2924/1301 , H01L2924/13034 , H01L2924/00014 , H01L2924/00
摘要： Provided is an organopolysiloxane composition that provides a cured product which has excellent heat resistance and does not peel or crack even under high temperatures. The organopolysiloxane composition comprises (A) an organopolysiloxane having difunctional siloxane units (D units) and trifunctional siloxane units (T units), and a weight-average molecular weight of 37,000 to 140,000 in which the molar ratio (T/D) of the T units to the D units is 0.3 to 0.8; and (B) an organopolysiloxane having the difunctional siloxane units (D units) and the trifunctional siloxane units (T units), and a weight-average molecular weight of 1,000 to 60,000 in which the molar ratio (T/D) of the T units to the D units is 0.15 or less, the organopolysiloxane composition being characterized by having a molar ratio (B/A) of the organopolysiloxane (B) to the organopolysiloxane (A) of 1.5 to 6.5.
摘要翻译：提供一种有机聚硅氧烷组合物，其提供具有优异的耐热性并且即使在高温下也不会剥离或龟裂的固化产物。有机聚硅氧烷组合物包含（A）具有双官能硅氧烷单元（D单元）和三官能硅氧烷单元（T单元）的有机聚硅氧烷，重均分子量为37,000〜140,000，其中T（D）的摩尔比（T / D） D单位单位为0.3〜0.8; 和（B）具有双官能硅氧烷单元（D单元）和三官能硅氧烷单元（T单元）的有机聚硅氧烷，其重均分子量为1000〜60,000，其中T单元的摩尔比（T / D）对于D单元为0.15以下，有机聚硅氧烷组合物的特征在于有机聚硅氧烷（B）与有机聚硅氧烷（A）的摩尔比（B / A）为1.5〜6.5。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式