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1. 发明授权

US08236666B2 Semiconductor device and process for producing same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US08236666B2
公开(公告)日：2012-08-07
申请号：US12664751
申请日：2007-12-05
申请人： Seiki Hiramatsu , Kei Yamamoto , Atsuko Fujino , Takashi Nishimura , Kenji Mimura , Hideki Takigawa , Hiroki Shiota , Nobutake Taniguchi , Hiroshi Yoshida
发明人： Seiki Hiramatsu , Kei Yamamoto , Atsuko Fujino , Takashi Nishimura , Kenji Mimura , Hideki Takigawa , Hiroki Shiota , Nobutake Taniguchi , Hiroshi Yoshida
IPC分类号： H01L21/00 , H01L21/46 , H01L21/30
CPC分类号： H01L23/3737 , H01L23/16 , H01L23/3121 , H01L23/3735 , H01L23/5386 , H01L23/562 , H01L2224/48091 , H01L2924/09701 , H01L2924/19107 , H05K1/056 , H05K3/041 , H05K3/202 , H05K3/44 , H05K2201/0209 , H05K2201/09745 , H05K2201/09881 , H01L2924/00014
摘要： Provided is a semiconductor device including: a base plate; a thermally conductive resin layer formed on an upper surface of the base plate; an integrated layer which is formed on an upper surface of the thermally conductive resin layer, and includes an electrode and an insulating resin layer covering all side surfaces of the electrode; and a semiconductor element formed on an upper surface of the electrode, in which the integrated layer is thermocompression bonded to the base plate through the thermally conductive resin layer. This semiconductor device excels in insulating properties and reliability.
摘要翻译：提供一种半导体器件，包括：基板; 形成在所述基板的上表面上的导热树脂层; 形成在导热性树脂层的上表面的整体层，具有覆盖电极的所有侧面的电极和绝缘性树脂层; 以及形成在所述电极的上表面上的半导体元件，其中所述一体层通过所述导热树脂层热压接合到所述基板。该半导体器件的绝缘性和可靠性优异。

2. 发明申请

US20100201002A1 SEMICONDUCTOR DEVICE AND PROCESS FOR PRODUCING SAME 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20100201002A1
公开(公告)日：2010-08-12
申请号：US12664751
申请日：2007-12-05
申请人： Seiki Hiramatsu , Kei Yamamoto , Atsuko Fujino , Takashi Nishimura , Kenji Mimura , Hideki Takigawa , Hiroki Shiota , Nobutake Taniguchi , Hiroshi Yoshida
发明人： Seiki Hiramatsu , Kei Yamamoto , Atsuko Fujino , Takashi Nishimura , Kenji Mimura , Hideki Takigawa , Hiroki Shiota , Nobutake Taniguchi , Hiroshi Yoshida
IPC分类号： H01L23/36 , H01L21/58 , H01L23/31
CPC分类号： H01L23/3737 , H01L23/16 , H01L23/3121 , H01L23/3735 , H01L23/5386 , H01L23/562 , H01L2224/48091 , H01L2924/09701 , H01L2924/19107 , H05K1/056 , H05K3/041 , H05K3/202 , H05K3/44 , H05K2201/0209 , H05K2201/09745 , H05K2201/09881 , H01L2924/00014
摘要： Provided is a semiconductor device including: a base plate; a thermally conductive resin layer formed on an upper surface of the base plate; an integrated layer which is formed on an upper surface of the thermally conductive resin layer, and includes an electrode and an insulating resin layer covering all side surfaces of the electrode; and a semiconductor element formed on an upper surface of the electrode, in which the integrated layer is thermocompression bonded to the base plate through the thermally conductive resin layer. This semiconductor device excels in insulating properties and reliability.
摘要翻译：提供一种半导体器件，包括：基板; 形成在所述基板的上表面上的导热树脂层; 形成在导热性树脂层的上表面的整体层，具有覆盖电极的所有侧面的电极和绝缘性树脂层; 以及形成在所述电极的上表面上的半导体元件，其中所述一体层通过所述导热树脂层热压接合到所述基板。该半导体器件的绝缘性和可靠性优异。

3. 发明申请

US20100226095A1 HEAT CONDUCTIVE SHEET AND POWER MODULE 有权
标题翻译：热传导片和功率模块
公开(公告)号：US20100226095A1
公开(公告)日：2010-09-09
申请号：US12675549
申请日：2008-09-12
申请人： Kenji Mimura , Hideki Takigawa , Hiroki Shiota , Kazuhiro Tada , Takashi Nishimura , Hiromi Ito , Seiki Hiramatsu , Atsuko Fujino , Kei Yamamoto , Motoki Masaki
发明人： Kenji Mimura , Hideki Takigawa , Hiroki Shiota , Kazuhiro Tada , Takashi Nishimura , Hiromi Ito , Seiki Hiramatsu , Atsuko Fujino , Kei Yamamoto , Motoki Masaki
IPC分类号： H05K7/20 , F28F7/00 , B21D53/02
CPC分类号： H01L23/3737 , F28F2013/006 , H01L23/4334 , H01L23/49568 , H01L23/49575 , H01L24/29 , H01L24/45 , H01L24/48 , H01L2224/2929 , H01L2224/29386 , H01L2224/29499 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2924/01019 , H01L2924/181 , Y10T29/4935 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Provided is a heat conductive sheet obtained by dispersing an inorganic filler in a thermosetting resin, in which the inorganic filler contains secondary aggregation particles formed by isotropically aggregating scaly boron nitride primary particles having an average length of 15 μm or less, and the inorganic filler contains more than 20 vol % of the secondary aggregation particles each having a particle diameter of 50 μm or more. The heat conductive sheet is advantageous in terms of productivity and cost and excellent in heat conductivity and electrical insulating properties.
摘要翻译：提供了一种通过将无机填料分散在热固性树脂中而获得的导热片，其中无机填料含有通过各向同性地聚集平均长度为15μm以下的鳞片状氮化硼一次粒子形成的二次凝集粒子，无机填料含有大于20体积％的二次聚集粒子各自具有50μm以上的粒径。导热片在生产率和成本方面是有利的，并且导热性和电绝缘性能优异。

4. 发明授权

US08193633B2 Heat conductive sheet and method for producing same, and powder module 有权
标题翻译：导热片及其制造方法和粉末组件
公开(公告)号：US08193633B2
公开(公告)日：2012-06-05
申请号：US12675549
申请日：2008-09-12
申请人： Kenji Mimura , Hideki Takigawa , Hiroki Shiota , Kazuhiro Tada , Takashi Nishimura , Hiromi Ito , Seiki Hiramatsu , Atsuko Fujino , Kei Yamamoto , Motoki Masaki
发明人： Kenji Mimura , Hideki Takigawa , Hiroki Shiota , Kazuhiro Tada , Takashi Nishimura , Hiromi Ito , Seiki Hiramatsu , Atsuko Fujino , Kei Yamamoto , Motoki Masaki
IPC分类号： H01L23/34 , H01L23/10
CPC分类号： H01L23/3737 , F28F2013/006 , H01L23/4334 , H01L23/49568 , H01L23/49575 , H01L24/29 , H01L24/45 , H01L24/48 , H01L2224/2929 , H01L2224/29386 , H01L2224/29499 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2924/01019 , H01L2924/181 , Y10T29/4935 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Provided is a heat conductive sheet obtained by dispersing an inorganic filler in a thermosetting resin, in which the inorganic filler contains secondary aggregation particles formed by isotropically aggregating scaly boron nitride primary particles having an average length of 15 μm or less, and the inorganic filler contains more than 20 vol % of the secondary aggregation particles each having a particle diameter of 50 μm or more. The heat conductive sheet is advantageous in terms of productivity and cost and excellent in heat conductivity and electrical insulating properties.
摘要翻译：提供了一种通过将无机填料分散在热固性树脂中而获得的导热片，其中无机填料含有通过各向同性地聚集平均长度为15μm以下的鳞片状氮化硼一次粒子形成的二次凝集粒子，无机填料含有大于20体积％的二次聚集粒子各自具有50μm以上的粒径。导热片在生产率和成本方面是有利的，并且导热性和电绝缘性能优异。

5. 发明申请

US20130012621A1 THERMOSETTING RESIN COMPOSITION, B-STAGE HEAT CONDUCTIVE SHEET, AND POWER MODULE 有权
标题翻译：热固性树脂组合物，B级导热片和电源模块
公开(公告)号：US20130012621A1
公开(公告)日：2013-01-10
申请号：US13576065
申请日：2010-12-28
申请人： Kei Yamamoto , Takashi Nishimura , Kenji Mimura , Motoki Masaki , Seiki Hiramatsu , Xiaohong Yin
发明人： Kei Yamamoto , Takashi Nishimura , Kenji Mimura , Motoki Masaki , Seiki Hiramatsu , Xiaohong Yin
IPC分类号： C08L63/02 , C08L63/00 , C08L79/08 , C08L71/10 , C08L79/04 , C08L83/00 , C08K3/38 , C08L67/00
CPC分类号： C08K3/10 , H01L23/3737 , H01L23/49568 , H01L24/48 , H01L25/072 , H01L2224/451 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/00014 , H01L2924/01004 , H01L2924/10253 , H01L2924/10272 , H01L2924/1033 , H01L2924/12042 , H01L2924/15159 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Provided is a thermosetting resin composition including an inorganic filler and a thermosetting resin matrix component, in which the inorganic filler includes secondary sintered particles each formed of primary particles of scaly boron nitride, and at least some of the secondary sintered particles each have a maximum cavity diameter of 5 μm to 80 μm. The thermosetting resin composition can be used for providing a heat conductive sheet in which electrical insulation property is kept by controlling where the defects such as voids and cracks occur and their size, and which has excellent heat conductivity.
摘要翻译：提供一种包含无机填料和热固性树脂基质组分的热固性树脂组合物，其中无机填料包括由鳞状氮化硼的初级颗粒形成的二次烧结颗粒，并且至少一些二次烧结颗粒各自具有最大空腔直径为5μm〜80μm。热固性树脂组合物可用于提供通过控制诸如空隙和裂纹等缺陷及其尺寸的缺陷而导致电绝缘性能并且具有优异导热性的导热片。

6. 发明授权

US09029438B2 Thermosetting resin composition, B-stage heat conductive sheet, and power module 有权
标题翻译：热固性树脂组合物，B级导热片和电源模块
公开(公告)号：US09029438B2
公开(公告)日：2015-05-12
申请号：US13576065
申请日：2010-12-28
申请人： Kei Yamamoto , Takashi Nishimura , Kenji Mimura , Motoki Masaki , Seiki Hiramatsu , Xiaohong Yin
发明人： Kei Yamamoto , Takashi Nishimura , Kenji Mimura , Motoki Masaki , Seiki Hiramatsu , Xiaohong Yin
IPC分类号： C08G59/40 , C08K3/10 , H01L23/373 , H01L25/07 , H01L23/495 , H01L23/00
CPC分类号： C08K3/10 , H01L23/3737 , H01L23/49568 , H01L24/48 , H01L25/072 , H01L2224/451 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/00014 , H01L2924/01004 , H01L2924/10253 , H01L2924/10272 , H01L2924/1033 , H01L2924/12042 , H01L2924/15159 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Provided is a thermosetting resin composition including an inorganic filler and a thermosetting resin matrix component, in which the inorganic filler includes secondary sintered particles each formed of primary particles of scaly boron nitride, and at least some of the secondary sintered particles each have a maximum cavity diameter of 5 μm to 80 μm. The thermosetting resin composition can be used for providing a heat conductive sheet in which electrical insulation property is kept by controlling where the defects such as voids and cracks occur and their size, and which has excellent heat conductivity.
摘要翻译：提供一种包含无机填料和热固性树脂基质组分的热固性树脂组合物，其中无机填料包括由鳞状氮化硼的初级颗粒形成的二次烧结颗粒，并且至少一些二次烧结颗粒各自具有最大空腔直径为5μm〜80μm。热固性树脂组合物可用于提供通过控制诸如空隙和裂纹等缺陷及其尺寸的缺陷而导致电绝缘性能并且具有优异导热性的导热片。

7. 发明授权

US06487444B2 Design evaluation method, equipment thereof, and goods design method 失效
标题翻译：设计评估方法，设备及货物设计方法
公开(公告)号：US06487444B2
公开(公告)日：2002-11-26
申请号：US09791851
申请日：2001-02-26
申请人： Kenji Mimura
发明人： Kenji Mimura
IPC分类号： A61B500
CPC分类号： A61B5/16 , A61B5/04842
摘要： The present inventions relates to a design evaluation method, equipment thereof, and a goods design method that make it possible to obtain a highly reliable evaluation of a design quality of an evaluated object. Thus, in the present invention, the design of an evaluated object is evaluated on the basis of a brain wave reaction by outputting an image, which expresses the design of the evaluated object, by image output means, and measuring brain waves of an arbitrary test subject by showing this image to the test subject. Hence, it is possible to obtain a highly reliable evaluation result without any subjective judgment based on the knowledge and experience of the test subject.
摘要翻译：本发明涉及一种能够获得评价对象的设计质量的可靠性高的评价方法，设备评价方法及其设计方法。因此，在本发明中，通过输出表示评价对象的设计的图像，通过图像输出单元，并且测量任意测试的脑波，基于脑波反应来评估评估对象的设计通过向测试对象显示此图像。因此，可以基于测试对象的知识和经验而获得高度可靠的评估结果而没有任何主观判断。

8. 发明授权

US5937701A Variable speed change gear 失效
标题翻译：变速档
公开(公告)号：US5937701A
公开(公告)日：1999-08-17
申请号：US930692
申请日：1997-10-06
申请人： Kenji Mimura
发明人： Kenji Mimura
IPC分类号： F16H29/14 , F16H29/04
CPC分类号： F16H29/14 , Y10T74/151
摘要： When an input shaft 6 is rotated by an external driving force, the resultant rotational force of the input shaft 6 is transmitted to an offset housing 21 of which rotational force in turn is transmitted to variable rings 39. If, at that time, angular volocities of the variable rings 39 are periodically varied relative to the angular velocity of the offset housing 21, the periodically varying angular velocities of the variable rings 39 are corrected to be substantially constant in a predetermined phase range, allowing only rotational forces having corrected angular velocities to be fetched from the variable rings 39 for transmission to an output shaft 7. Thus, by arbitrarily varying the angular velocities of the variable rings 39 relative to the angular velocity of the offset housing 21, the rotational speed of the output shaft 7 is steplessly varied relative to the rotational speed of the input shaft 7.
摘要翻译： PCT No.PCT / JP96 / 00237 Sec。 371日期：1997年10月6日 102（e）日期1997年10月6日PCT提交1996年2月6日PCT公布。 WO97 / 29301 PCT出版物日期1997年8月14日当输入轴6通过外部驱动力旋转时，输入轴6的合成旋转力传递到偏移壳体21，偏心壳体21的旋转力又传递到可变环39.如果在那时，可变环39的角度波动相对于偏移壳体21的角速度周期性变化，可变环39的周期性变化的角速度被校正为在预定相位范围内基本上恒定，仅允许旋转力具有从可变环39获取的校正角速度以传输到输出轴7.因此，通过任意地改变可变环39相对于偏移壳体21的角速度的角速度，输出的转速轴7相对于输入轴7的转速无级变化。

9. 发明授权

US5723813A Insulating spacer with shield electrodes having a graded resistance 失效
标题翻译：绝缘垫片与屏蔽电极具有分级电阻
公开(公告)号：US5723813A
公开(公告)日：1998-03-03
申请号：US663733
申请日：1996-06-14
申请人： Hiromi Ito , Kenji Mimura , Hirofumi Fujioka , Etsuro Tomonaga , Hiroshi Aoki , Hiroyuki Hama
发明人： Hiromi Ito , Kenji Mimura , Hirofumi Fujioka , Etsuro Tomonaga , Hiroshi Aoki , Hiroyuki Hama
IPC分类号： H02G5/06 , H01B7/00
CPC分类号： H02G5/068 , Y10T29/49227
摘要： The present invention provides an insulating spacer for a high-voltage conductor constructed with a plastic made of an epoxy resin composition so that the volumetric specific resistance of the shield electrode increases toward the median point between a container and the conductor and a method for manufacturing shield electrode used therein. The insulating spacer according to the present invention can lessen the concentration of electric fields in the boundary areas between the shield electrode and the insulating member with the result that reliability is improved and service life is lengthened.
摘要翻译：本发明提供一种用由环氧树脂组合物制成的塑料构成的高压导体的绝缘间隔件，使得屏蔽电极的体积电阻率朝向容器和导体之间的中点增加，并且制造屏蔽的方法电极。根据本发明的绝缘间隔物可以减小屏蔽电极和绝缘构件之间的边界区域中的电场浓度，从而提高可靠性并延长使用寿命。

10. 发明授权

US5865071A Differential gear setting differential limiting forces in response to rotational force transmission direction 失效
标题翻译：差速齿轮设定差速限制力响应旋转力传递方向
公开(公告)号：US5865071A
公开(公告)日：1999-02-02
申请号：US777478
申请日：1996-12-30
申请人： Kenji Mimura
发明人： Kenji Mimura
IPC分类号： F16H48/12 , F16H48/14 , F16H48/20
CPC分类号： F16H48/147 , F16H48/12 , Y10T74/19005
摘要： A differential gear is capable of differentially setting magnitudes of differential limiting forces depending on directions of rotational force transmission. A rotational force of the input-side rotary element is transmitted by way of rolling elements and grooves to the rotary elements. The rolling elements roll along grooves of the rotary elements while reciprocating within elongated holes of the retainer element, thereby permitting the difference in speeds of rotation between the rotary elements. The differential motions of the rotary elements are limited by axial reaction forces generated between the rotary elements and the grooves. At that time, if the directions of the rotational force transmission between the input-side rotary element and the rotary elements differ from each other, then the magnitudes of the axial reaction forces generated between the rotary elements and the grooves will also be different from each other. Hence, differential limiting forces are generated which differ in magnitude from one another depending on the directions of transmission of rotational forces. According to the present invention, therefore, a small and low-cost configuration is achieved and there can be generated differential limiting forces having any magnitudes which differ between upon the acceleration and deceleration of automobiles. A secure coping will thus be ensured with running performances of automobiles, objects of use and combinations with attached mechanisms, thereby remarkably enhancing utility value as the differential gear having a differential limiting function.
摘要翻译：差速齿轮能够根据旋转力传递的方向差异地设定差速限制力的大小。输入侧旋转元件的旋转力通过滚动元件和沟槽传递到旋转元件。滚动元件沿着旋转元件的凹槽滚动，同时在保持器元件的细长孔内往复运动，从而允许旋转元件之间的旋转速度差。旋转元件的微分运动受到旋转元件和凹槽之间产生的轴向反作用力的限制。此时，如果输入侧旋转元件和旋转元件之间的旋转力传递方向彼此不同，则在旋转元件和凹槽之间产生的轴向反作用力的大小也将各不相同其他。因此，根据旋转力的传递方向产生彼此不同的差异限制力。因此，根据本发明，实现了小型和低成本的构造，并且可以产生具有在汽车的加速和减速之间不同的任何量级的差动限制力。因此，通过汽车的运行性能，使用对象和与附接的机构的组合来确保安全的应对，从而显着提高作为具有差速限制功能的差动齿轮的效用值。

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