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1. 发明申请

US20100263905A1 DILUTE COPPER ALLOY MATERIAL, DILUTE COPPER ALLOY WIRE, DILUTE COPPER ALLOY TWISTED WIRE AND CABLE USING THE SAME, COAXIAL CABLE AND COMPOSITE CABLE, AND METHOD OF MANUFACTURING DILUTE COPPER ALLOY MATERIAL AND DILUTE COPPER ALLOY WIRE 有权
标题翻译：稀释铜合金材料，稀土铜合金线，稀土铜合金线和使用其的电缆，同轴电缆和复合电缆，以及制造稀土铜合金材料和稀土铜合金线的方法
公开(公告)号：US20100263905A1
公开(公告)日：2010-10-21
申请号：US12756551
申请日：2010-04-08
申请人： Seigi AOYAMA , Toru Sumi , Shuji Sakai , Takahiro Sato , Hidenori Abe
发明人： Seigi AOYAMA , Toru Sumi , Shuji Sakai , Takahiro Sato , Hidenori Abe
IPC分类号： H01B9/02 , H01B5/00 , H01B5/08 , H01B11/02 , C22C9/00 , B22D11/06
CPC分类号： C22C9/00 , B22D21/025 , C22F1/08 , H01B1/026
摘要： A dilute copper alloy material includes, based on a total mass of the dilute copper alloy material, 2 to 12 mass ppm of sulfur, 2 to 30 mass ppm of oxygen, 4 to 55 mass ppm of titanium, and a balance consisting of pure copper and an inevitable impurity. A part of the sulfur and the titanium forms a compound or an aggregate of TiO, TiO2, TiS or Ti—O—S, and an other part of the sulfur and the titanium forms a solid solution. TiO, TiO2, TiS and Ti—O—S distributed in a crystal grain of the dilute copper alloy material are not more than 200 nm, not more than 1000 nm, not more than 200 nm and not more than 300 nm, respectively, in particle size thereof, and not less than 90% of particles distributed in a crystal grain of the dilute copper alloy material are not more than 500 nm or less in particle size.
摘要翻译：稀铜合金材料基于稀铜合金材料的总质量包括2〜12质量ppm的硫，2〜30质量ppm的氧，4〜55质量ppm的钛，余量由纯铜和不可避免的杂质。硫和钛的一部分形成TiO，TiO 2，TiS或Ti-O-S的化合物或聚集体，硫和钛的另一部分形成固溶体。分布在稀铜合金材料的晶粒中的TiO，TiO 2，TiS和Ti-O-S分别不大于200nm，不大于1000nm，不大于200nm且不大于300nm 其粒径分布在稀铜合金材料的晶粒中的90％以上的粒子的粒径为500nm以下。

2. 发明申请

US20120097422A1 FLEXIBLE FLAT CABLE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：柔性平板电缆及其制造方法
公开(公告)号：US20120097422A1
公开(公告)日：2012-04-26
申请号：US13276680
申请日：2011-10-19
申请人： Toru SUMI , Seigi AOYAMA , Hiromitsu KURODA , Hideyuki SAGAWA
发明人： Toru SUMI , Seigi AOYAMA , Hiromitsu KURODA , Hideyuki SAGAWA
IPC分类号： H01B7/08 , H01B13/06
CPC分类号： H01B1/026 , B22F2998/00 , C22C9/00 , C22F1/08 , C22C32/00
摘要： The present invention provides a flexible flat cable having high conductivity and high bending durability, and a method for manufacturing the same. The present invention is a flexible flat cable comprising conductors and insulating films applied over the conductors, wherein the conductor is comprised of at least one additive element selected from the group consisting of magnesium (Mg), zirconium (Zr), niobium (Nb), calcium (Ca), vanadium (V), nickel (Ni), manganese (Mn), titanium (Ti), and chromium (Cr); 2 mass-% or more of oxygen; and the balance being inevitable impurity and copper, wherein the conductor has such a recrystallized texture that the size of crystal grains in the inner area of the conductor is large and that of in the surface area thereof is smaller than that of the inner area, wherein both sides of the conductor are sandwiched between insulating films.
摘要翻译：本发明提供一种具有高导电性和高弯曲耐久性的柔性扁平电缆及其制造方法。本发明是一种柔性扁平电缆，其包括施加在导体上的导体和绝缘膜，其中导体由至少一种选自镁（Mg），锆（Zr），铌（Nb），钙（Ca），钒（V），镍（Ni），锰（Mn），钛（Ti）和铬（Cr） 2质量％以上的氧气; 余量是不可避免的杂质和铜，其中导体具有这样的再结晶织构，导体的内部区域中的晶粒尺寸大，表面积的晶粒尺寸小于内部区域的晶粒尺寸，其中导体的两侧夹在绝缘膜之间。

3. 发明申请

US20100163139A1 Cu ALLOY MATERIAL, METHOD OF MANUFACTURING Cu ALLOY CONDUCTOR USING THE SAME, Cu ALLOY CONDUCTOR OBTAINED BY THE METHOD, AND CABLE OR TROLLEY WIRE USING THE Cu ALLOY CONDUCTOR 有权
标题翻译：铜合金材料，使用该方法制造Cu合金导体的方法，通过该方法获得的Cu合金导体，以及使用铜合金导体的电缆或拉杆
公开(公告)号：US20100163139A1
公开(公告)日：2010-07-01
申请号：US12716766
申请日：2010-03-03
申请人： Seigi AOYAMA , Takaaki Ichikawa , Hiroyoshi Hiruta , Hiromitsu Kuroda
发明人： Seigi AOYAMA , Takaaki Ichikawa , Hiroyoshi Hiruta , Hiromitsu Kuroda
IPC分类号： C22F1/08 , B22D11/00
CPC分类号： C22C9/02 , C22F1/08
摘要： A method of manufacturing a Cu alloy conductor comprises the steps of: adding and dissolving In of 0.1-0.7 weight % to a Cu matrix containing oxygen of 0.001-0.1 weight % (10-1000 weight ppm) to form a molten Cu alloy, performing a continuous casting with the molten Cu alloy, rapidly quenching a casting material to a temperature by at least 15° C. or more lower than a melting point of molten Cu alloy, controlling the casting material at a temperature equal to or lower than 900° C., and performing a plurality of hot rolling processes to the casting material such that a temperature of a final hot rolling is within a range of from 500 to 600° C. to form the rolled material.
摘要翻译：制造Cu合金导体的方法包括以下步骤：将含有0.1-0.7重量％的含有0.001-0.1重量％（10-1000重量ppm）的氧的Cu基质加入并溶解，以形成熔融的Cu合金，进行与熔融的Cu合金连续铸造，将铸造材料快速淬火至熔融Cu合金的熔点至少15℃以上的温度，控制铸造材料的温度等于或低于900℃ 并且对铸造材料进行多次热轧工序，使得最终热轧的温度在500〜600℃的范围内，形成轧制材料。

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