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1. 发明申请

US20050161129A1 Cu alloy material, method of manufacturing Cu alloy conductor using the same, Cu alloy conductor obtained by the method, and cable or trolley wire using the Cu alloy conductor 审中-公开
标题翻译： Cu合金材料，使用其制造Cu合金导体的方法，通过该方法获得的Cu合金导体，以及使用Cu合金导体的电缆或电车线
公开(公告)号：US20050161129A1
公开(公告)日：2005-07-28
申请号：US10970717
申请日：2004-10-22
申请人： Seigi Aoyama , Takaaki Ichikawa , Hiroyoshi Hiruta , Hiromitsu Kuroda
发明人： Seigi Aoyama , Takaaki Ichikawa , Hiroyoshi Hiruta , Hiromitsu Kuroda
IPC分类号： C22C9/02
CPC分类号： C22C9/02 , C22F1/08
摘要： A method of manufacturing a Cu alloy conductor comprises the steps of: adding and dissolving In of 0.1-0.7 weight % to a Cu matrix containing oxygen of 0.001-0.1 weight % (10-1000 weight ppm) to form a molten Cu alloy, performing a continuous casting with the molten Cu alloy, rapidly quenching a casting material to a temperature by at least 15° C. or more lower than a melting point of molten Cu alloy, controlling the casting material at a temperature equal to or lower than 900° C., and performing a plurality of hot rolling processes to the casting material such that a temperature of a final hot rolling is within a range of from 500 to 600° C. to form the rolled material.
摘要翻译：制造Cu合金导体的方法包括以下步骤：将含有0.1-0.7重量％的含有0.001-0.1重量％（10-1000重量ppm）的氧的Cu基质加入并溶解，以形成熔融的Cu合金，进行与熔融的Cu合金连续铸造，将铸造材料快速淬火至熔融Cu合金的熔点至少15℃以上的温度，控制铸造材料的温度等于或低于900℃ 并且对铸造材料进行多次热轧工序，使得最终热轧的温度在500〜600℃的范围内，形成轧制材料。

2. 发明授权

US07148426B2 Lead-free solder, and connection lead and electrical component using said lead-free solder 有权
公开(公告)号：US07148426B2
公开(公告)日：2006-12-12
申请号：US09892630
申请日：2001-06-28
申请人： Seigi Aoyama , Takaaki Ichikawa , Hiromitsu Kuroda , Takashi Nemoto , Atsushi Ohtake , Hiroyoshi Hiruta
发明人： Seigi Aoyama , Takaaki Ichikawa , Hiromitsu Kuroda , Takashi Nemoto , Atsushi Ohtake , Hiroyoshi Hiruta
IPC分类号： H05K1/16 , C22C13/00
CPC分类号： B23K35/262 , H01L31/0504 , H01L31/0508 , H01L31/0512 , H05K3/3426 , H05K3/3463 , Y02E10/50
摘要： In a lead-free solder comprising an alloy composition composed mainly of tin, the alloy composition further contains 0.002 to 0.015% by mass of phosphorus. This lead-free solder can be used as a plating in a connection lead comprising: a copper strip or other strip conductor; and the plating provided on at least one side of the strip constructor, the plating having a shape such that the plating in the widthwise direction of the strip conductor has a bulge as viewed in section with the apex being located at a proper position in the widthwise direction of the strip conductor. By virtue of this constitution, the lead-free solder on its surface is less likely to be oxidized, and the connection lead has excellent bond strength owing to the property of the lead-free solder and, in addition, has the function of breaking the formed oxide layer and the function of removing included gas bubbles and can eliminate the need to form the plating in very large thickness. Further, the lead-free solder can be used as a connection element in an electrical component that is less likely to cause oxidation of the connection element on its surface and, thus, can have a strong connection structure by the connection element.

3. 发明授权

US08845829B2 Cu alloy material, method of manufacturing Cu alloy conductor using the same, Cu alloy conductor obtained by the method, and cable or trolley wire using the Cu alloy conductor 有权
标题翻译： Cu合金材料，使用其制造Cu合金导体的方法，通过该方法获得的Cu合金导体，以及使用Cu合金导体的电缆或电车线
公开(公告)号：US08845829B2
公开(公告)日：2014-09-30
申请号：US12716766
申请日：2010-03-03
申请人： Seigi Aoyama , Takaaki Ichikawa , Hiroyoshi Hiruta , Hiromitsu Kuroda
发明人： Seigi Aoyama , Takaaki Ichikawa , Hiroyoshi Hiruta , Hiromitsu Kuroda
IPC分类号： C22C9/02 , C22F1/08 , B60M1/13
CPC分类号： C22C9/02 , C22F1/08
摘要： A method of manufacturing a Cu alloy conductor includes the steps of: adding and dissolving In of 0.1-0.7 weight % to a Cu matrix containing oxygen of 0.001-0.1 weight % (10-1000 weight ppm) to form a molten Cu alloy, performing a continuous casting with the molten Cu alloy, rapidly quenching a casting material to a temperature by at least 15° C. or more lower than a melting point of molten Cu alloy, controlling the casting material at a temperature equal to or lower than 900° C., and performing a plurality of hot rolling processes to the casting material such that a temperature of a final hot rolling is within a range of from 500 to 600° C. to form the rolled material.
摘要翻译：制造Cu合金导体的方法包括以下步骤：向含有0.001-0.1重量％（10-1000重量ppm）的氧的Cu基质中添加和溶解0.1-0.7重量％的In以形成熔融的Cu合金，进行与熔融的Cu合金连续铸造，将铸造材料快速淬火至熔融Cu合金的熔点至少15℃以上的温度，控制铸造材料的温度等于或低于900℃ 并且对铸造材料进行多次热轧工序，使得最终热轧的温度在500〜600℃的范围内，形成轧制材料。

4. 发明申请

US20100163139A1 Cu ALLOY MATERIAL, METHOD OF MANUFACTURING Cu ALLOY CONDUCTOR USING THE SAME, Cu ALLOY CONDUCTOR OBTAINED BY THE METHOD, AND CABLE OR TROLLEY WIRE USING THE Cu ALLOY CONDUCTOR 有权
标题翻译：铜合金材料，使用该方法制造Cu合金导体的方法，通过该方法获得的Cu合金导体，以及使用铜合金导体的电缆或拉杆
公开(公告)号：US20100163139A1
公开(公告)日：2010-07-01
申请号：US12716766
申请日：2010-03-03
申请人： Seigi AOYAMA , Takaaki Ichikawa , Hiroyoshi Hiruta , Hiromitsu Kuroda
发明人： Seigi AOYAMA , Takaaki Ichikawa , Hiroyoshi Hiruta , Hiromitsu Kuroda
IPC分类号： C22F1/08 , B22D11/00
CPC分类号： C22C9/02 , C22F1/08
摘要： A method of manufacturing a Cu alloy conductor comprises the steps of: adding and dissolving In of 0.1-0.7 weight % to a Cu matrix containing oxygen of 0.001-0.1 weight % (10-1000 weight ppm) to form a molten Cu alloy, performing a continuous casting with the molten Cu alloy, rapidly quenching a casting material to a temperature by at least 15° C. or more lower than a melting point of molten Cu alloy, controlling the casting material at a temperature equal to or lower than 900° C., and performing a plurality of hot rolling processes to the casting material such that a temperature of a final hot rolling is within a range of from 500 to 600° C. to form the rolled material.
摘要翻译：制造Cu合金导体的方法包括以下步骤：将含有0.1-0.7重量％的含有0.001-0.1重量％（10-1000重量ppm）的氧的Cu基质加入并溶解，以形成熔融的Cu合金，进行与熔融的Cu合金连续铸造，将铸造材料快速淬火至熔融Cu合金的熔点至少15℃以上的温度，控制铸造材料的温度等于或低于900℃ 并且对铸造材料进行多次热轧工序，使得最终热轧的温度在500〜600℃的范围内，形成轧制材料。

5. 发明授权

US07173188B2 Straight angle conductor and method of manufacturing the same 有权
标题翻译：直角导体及其制造方法
公开(公告)号：US07173188B2
公开(公告)日：2007-02-06
申请号：US10891456
申请日：2004-07-15
申请人： Yuju Endo , Hakaru Matsui , Seigi Aoyama , Takaaki Ichikawa
发明人： Yuju Endo , Hakaru Matsui , Seigi Aoyama , Takaaki Ichikawa
IPC分类号： H02G3/06
CPC分类号： H01B1/026 , H01L2924/0002 , Y02P80/30 , H01L2924/00
摘要： A straight angle conductor 10 is provided with a cladding material including a core-sheet metal 11 and conductor-sheet metals 12a, 12b that sandwich both surfaces of the core-sheet metal 11. The conductor-sheet metals 12a, 12b having a volume resistivity equal to or less than 5.0 (μΩ·cm) wraps both sides of the core-sheet metal 11 having a thermal expansion coefficient equal to or less than 10 (×10−6/C. °) to prevent the core-sheet metal 11 from being exposed to an outside of the conductor-sheet metals 12a, 12b. As a result, it prevents occurrence of an electrical potential difference in a boundary side face between the core-sheet metal 11 and the conductor-sheet metals 12a, 12b to improve corrosion resistance. Especially even when the straight angle conductor 10 is used on a silicon crystal wafer for a solar cell, damage of the silicon crystal wafer caused by heat occurring in soldering process of the conductor 10 or a change in temperature on use thereof for a solar cell is avoided.
摘要翻译：直角导体10设置有包括芯片金属11和夹着芯片金属11的两个表面的导体片金属12a，2b的包层材料。体积电阻率等于或小于5.0（μΩ·cm）的导体片金属12a，12b将具有等于或小于10的热膨胀系数的芯片金属11的两侧包裹（x10 ^{-6℃/℃），以防止芯片金属11暴露于导体片金属12a，12b的外侧。结果，能够防止在芯片金属11与导体片金属12a，12b之间的边界侧面发生电位差，以提高耐腐蚀性。特别是即使在太阳能电池用硅晶片上使用直角导体10时，由于在导体10的焊接工艺中发生的热量导致的硅晶片的损坏或者太阳能电池的使用温度的变化，避免。}

6. 发明申请

US20050039943A1 Straight angle conductor and method of manufacturing the same 有权
标题翻译：直角导体及其制造方法
公开(公告)号：US20050039943A1
公开(公告)日：2005-02-24
申请号：US10891456
申请日：2004-07-15
申请人： Yuju Endo , Hakaru Matsui , Seigi Aoyama , Takaaki Ichikawa
发明人： Yuju Endo , Hakaru Matsui , Seigi Aoyama , Takaaki Ichikawa
IPC分类号： B23K35/26 , C22C13/00 , H01B1/02 , H01B5/02 , H01B13/00 , H01L23/48 , H02G3/06
CPC分类号： H01B1/026 , H01L2924/0002 , Y02P80/30 , H01L2924/00
摘要： A straight angle conductor 10 is provided with a cladding material including a core-sheet metal 11 and conductor-sheet metals 12a, 12b that sandwich both surfaces of the core-sheet metal 11. The conductor-sheet metals 12a, 12b having a volume resistivity equal to or less than 5.0 (μΩ·cm) wraps both sides of the core-sheet metal 11 having a thermal expansion coefficient equal to or less than 10 (×106/C°) to prevent the core-sheet metal 11 from being exposed to an outside of the conductor-sheet metals 12a, 12b. As a result, it prevents occurrence of an electrical potential difference in a boundary side face between the core-sheet metal 11 and the conductor-sheet metals 12a, 12b to improve corrosion resistance. Especially even when the straight angle conductor 10 is used on a silicon crystal wafer for a solar cell, damage of the silicon crystal wafer caused by heat occurring in soldering process of the conductor 10 or a change in temperature on use thereof for a solar cell is avoided.
摘要翻译：直角导体10设置有包含芯片金属11和夹着芯片金属11的两面的导体片金属12a，12b的包层材料。具有体积电阻率的导体片金属12a，12b 为了防止芯片金属11的热膨胀系数等于或小于10（x10 <6℃/℃）的芯片状金属11的两面，将5.0重量％（μm）暴露于导体片金属12a，12b的外侧。结果，防止芯片金属11与导体片金属12a，12b之间的边界侧面发生电位差，提高耐腐蚀性。特别是即使在太阳能电池用硅晶片上使用直角导体10时，由于在导体10的焊接工艺中发生的热量导致的硅晶片的损坏或者太阳能电池的使用温度的变化，避免。

7. 发明授权

US06521838B2 Heat-resistant, flex-resistant flexible flat cable and process for producing the same 有权
标题翻译：耐热，耐弯曲柔性扁平电缆及其制造方法
公开(公告)号：US06521838B2
公开(公告)日：2003-02-18
申请号：US09910954
申请日：2001-07-24
申请人： Hiroshi Yamanobe , Takaaki Ichikawa , Seigi Aoyama , Tsutomu Komori , Masato Ito , Katsuo Endo , Noboru Nakakuki
发明人： Hiroshi Yamanobe , Takaaki Ichikawa , Seigi Aoyama , Tsutomu Komori , Masato Ito , Katsuo Endo , Noboru Nakakuki
IPC分类号： H01B700
CPC分类号： H05K3/281 , H01B7/0838 , H05K1/0393 , H05K3/202 , H05K3/386 , H05K2201/0154
摘要： A flexible flat cable has a single conductor or a plurality of conductors, juxtaposed to each other or one another, which are sandwiched between a pair of plastic films with an adhesive to form an integral structure. The plastic films with an adhesive have a modulus of longitudinal elasticity of not less than 300 kg/mm2 and an elongation of not less than 20%. The plastic films are formed of a polyimide. The adhesive is formed of an epoxy having a glass transition temperature Tg of 80° C. or above, and the 180° peel strength between the adhesive and the single conductor or the plurality of conductors is not less than 0.5 kg/cm.
摘要翻译：柔性扁平电缆具有彼此并置的单个导体或多个导体，它们被夹在一对具有粘合剂的塑料膜之间以形成一体结构。具有粘合剂的塑料膜的纵向弹性模量不小于300kg / mm 2，伸长率不小于20％。塑料膜由聚酰亚胺形成。粘合剂由玻璃化转变温度Tg为80℃以上的环氧树脂形成，粘合剂与单个导体或多个导体之间的180°剥离强度为0.5kg / cm以上。

8. 发明授权

US06751855B2 Process for forming an ultrafine copper alloy wire 有权
标题翻译：用于形成超细铜合金线的工艺
公开(公告)号：US06751855B2
公开(公告)日：2004-06-22
申请号：US10309046
申请日：2002-12-04
申请人： Hakaru Matsui , Takaaki Ichikawa , Koichi Tamura , Seigi Aoyama , Osamu Seya , Ryohei Okada
发明人： Hakaru Matsui , Takaaki Ichikawa , Koichi Tamura , Seigi Aoyama , Osamu Seya , Ryohei Okada
IPC分类号： H01R4300
CPC分类号： H01B1/026 , Y10T29/49117 , Y10T29/5187
摘要： A process for forming an ultrafine copper alloy wire is provided. The alloy includes a copper matrix of high purity copper having a total unavoidable impurity content of not more than 10 mass ppm. The matrix contains 0.05 to 0.9 mass % of at least one metallic element of the group of tin, indium, silver, antimony, magnesium, aluminum, and boron. The alloy is melted in a carbon crucible. The molten alloy is cast into a wire rod utilizing a carbon mold. The wire rod is then subjected to a primary wire drawing, an annealing, and a secondary wire drawing. The produced ultrafine copper alloy wire has excellent tensile strength, electrical conductivity, and drawability.
摘要翻译：提供一种形成超细铜合金线的工艺。该合金包括总不可避免的杂质含量不大于10质量ppm的高纯度铜的铜基质。该基质含有0.05〜0.9质量％的锡，铟，银，锑，镁，铝和硼组中的至少一种金属元素。合金在碳坩埚中熔化。将熔融的合金用碳素模铸成线材。然后对线材进行一次拉丝，退火和二次拉丝。所生产的超细铜合金线材具有优异的拉伸强度，导电性和拉伸性。

9. 发明授权

US06518503B1 Bending-resistant flexible flat cable and production process thereof 有权
标题翻译：抗弯柔性扁平电缆及其生产工艺
公开(公告)号：US06518503B1
公开(公告)日：2003-02-11
申请号：US10046271
申请日：2002-01-16
申请人： Hiroshi Yamanobe , Takaaki Ichikawa , Seigi Aoyama , Tsutomu Komori , Hidenori Kobayashi , Masato Ito , Katsuo Endo
发明人： Hiroshi Yamanobe , Takaaki Ichikawa , Seigi Aoyama , Tsutomu Komori , Hidenori Kobayashi , Masato Ito , Katsuo Endo
IPC分类号： H01B708
CPC分类号： H05K1/028 , H01B7/0838 , H05K1/09 , H05K3/202 , H05K3/281 , H05K3/386
摘要： In FFC1 integrated by sandwiching flat type conductors 2 between plastic films 3 with adhesives, wherein the conductors are formed of pure copper or a copper alloy having a wiredrawing draught of at least 95% and an elongation of at least 5%, and the plastic films with adhesives are formed of one having a modulus of longitudinal elasticity of at least 280 kg/mm2 and an elongation of at least 80%, and the 180° peel strength between the adhesives and the conductors 2 is made to be at least 0.8 kg/cm. As a result, even if the number of conductors 2 is increased than the conventional FFC, bending-resistant characteristic equal to or higher than the conventional FFC can be exhibited.
摘要翻译：在FFC1中，通过在塑料膜3与粘合剂之间夹住扁平型导体2，其中导体由纯铜或铜合金形成，该铜铜或铜合金具有至少95％的拉丝牵伸和至少5％的伸长率，而塑料膜粘合剂由具有至少280kg / mm 2的纵向弹性模量和至少80％的伸长率的粘合剂形成，并且使粘合剂和导体2之间的180°剥离强度为至少0.8kg / 厘米。结果，即使导体2的数量比传统的FFC增加，可以表现出等于或高于常规FFC的抗弯曲特性。

10. 发明授权

US06518505B1 Ultrafine copper alloy wire and process for producing the same 有权
标题翻译：超细铜合金线及其制造方法
公开(公告)号：US06518505B1
公开(公告)日：2003-02-11
申请号：US09714668
申请日：2000-11-17
申请人： Hakaru Matsui , Takaaki Ichikawa , Koichi Tamura , Seigi Aoyama , Osamu Seya , Ryohei Okada
发明人： Hakaru Matsui , Takaaki Ichikawa , Koichi Tamura , Seigi Aoyama , Osamu Seya , Ryohei Okada
IPC分类号： H01B102
CPC分类号： H01B1/026 , Y10T29/49117 , Y10T29/5187
摘要： An ultrafine copper alloy wire drawn to a diameter of not more than 0.08 mm is provided which is formed of an alloy having a copper matrix of high purity copper with a total unavoidable impurity content of not more than 10 mass ppm. Contained in the matrix is 0.05 to 0.9 mass % of at least one metallic element selected from the group including tin, indium, silver, antimony, magnesium, aluminum, and boron. By virtue of this constitution, the ultrafine copper alloy wire has excellent tensile strength, electrical conductivity, and drawability.
摘要翻译：提供了一种直径不大于0.08mm的超细铜合金线，其由具有不大于10质量ppm的总不可避免的杂质含量的具有高纯度铜的铜基质的合金形成。在基质中含有0.05〜0.9质量％的选自锡，铟，银，锑，镁，铝和硼的至少一种金属元素。根据该结构，超细铜合金线材具有优异的拉伸强度，导电性和拉伸性。

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