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1. 发明授权

US06507801B1 Semiconductor device testing system 失效
标题翻译：半导体器件测试系统
公开(公告)号：US06507801B1
公开(公告)日：2003-01-14
申请号：US09697026
申请日：2000-10-25
申请人： Se-Jang Oh , Ki-Sang Kang , Jeong-Ho Bang
发明人： Se-Jang Oh , Ki-Sang Kang , Jeong-Ho Bang
IPC分类号： G06F300
CPC分类号： G01R31/31707 , G01R31/3183 , G01R31/318371
摘要： The present invention relates to a semiconductor device testing system having an advanced testing capability for performing tests on a semiconductor device. A system frame includes both normal and high-speed testing formatters, and a test head is arranged in electrical communication with the system frame. Normal PIN drivers are included to operate the testing system at a first frequency to transmit the signals required to perform tests at a normal speed. High-speed PIN drivers are also included to operate the testing system at a second frequency, higher than the first frequency, to transmit the signals required to perform tests at a higher speed. In this manner, the testing system of this invention is able-to achieve superior testing performance while reducing the overall system production cost.
摘要翻译：本发明涉及具有用于对半导体器件进行测试的先进测试能力的半导体器件测试系统。系统框架包括正常和高速测试格式化程序，测试头与系统框架电气通信。包括正常PIN驱动程序，以第一频率操作测试系统，以正常速度传输执行测试所需的信号。还包括高速PIN驱动程序，以高于第一个频率的第二个频率操作测试系统，以更高速度传输执行测试所需的信号。以这种方式，本发明的测试系统能够在降低整个系统生产成本的同时实现优异的测试性能。

2. 发明授权

US06625766B1 Tester of semiconductor memory device and test method thereof 失效
标题翻译：半导体存储器件测试仪及其测试方法
公开(公告)号：US06625766B1
公开(公告)日：2003-09-23
申请号：US09512158
申请日：2000-02-24
申请人： Se-Jang Oh , Ki-Sang Kang
发明人： Se-Jang Oh , Ki-Sang Kang
IPC分类号： G11C2900
CPC分类号： G11C29/20 , G11C2029/0405
摘要： A test method of a tester of a semiconductor memory device which includes recording a test pattern into the semiconductor memory device, reading the recorded test pattern to compare with a expected pattern, detecting information on a defect of the semiconductor memory device with a result of the comparison and interpreting the information on the defect of the semiconductor memory device, the method comprising the steps of: setting up minimum and maximum values relevant to a desired capacity of the semiconductor memory device to be tested; counting up from the preset minimum to the preset maximum values; generating a carry signal by comparing the preset maximum value with the counted value when the counted value gets to the preset maximum value; and resetting a value to be counted if the carry signal is generated, to thereby generate addresses of the semiconductor memory device, and a tester of the semiconductor memory device comprising: minimum and maximum address registering means for saving minimum and maximum address values relevant to a desired capacity of the semiconductor memory device to be tested; address counting means for increasingly counting from the minimum value to generate addresses; and carry signal generating means for generating carry signals, if the addresses output from the address counting means and a signal output from the maximum address registering means are the same, to thereby reset the address counting means, so that a user of the tester does not have to make a new test program, providing convenience in performing a test and improving reliability in results of the test.
摘要翻译：一种半导体存储器件的测试器的测试方法，包括将测试图案记录到半导体存储器件中，读取记录的测试图案以与预期图案进行比较，检测关于半导体存储器件的缺陷的信息，结果是比较和解释关于半导体存储器件的缺陷的信息，该方法包括以下步骤：设置与要测试的半导体存储器件的期望容量相关的最小值和最大值; 从预设最小值到预设最大值; 当计数值达到预设最大值时，通过将预设最大值与计数值进行比较来产生进位信号; 并且如果产生进位信号，则重置要计数的值，从而生成半导体存储器件的地址，以及半导体存储器件的测试器，包括：最小和最大地址寄存装置，用于保存与a相关的最小和最大地址值要测试的半导体存储器件的期望容量; 地址计数装置，用于从最小值逐渐计数以产生地址; 以及用于产生进位信号的进位信号产生装置，如果从地址计数装置输出的地址和从最大地址登记装置输出的信号相同，从而复位地址计数装置，使得测试仪的用户不必须制定一个新的测试程序，提供方便的测试和提高测试结果的可靠性。

3. 发明申请

US20100150549A1 Test interface device, test system and optical interface memory device 有权
标题翻译：测试接口设备，测试系统和光接口存储设备
公开(公告)号：US20100150549A1
公开(公告)日：2010-06-17
申请号：US12592817
申请日：2009-12-03
申请人： Sang-Hoon Lee , Eun-Jo Byun , Cheol-Jong Woo , Se-Jang Oh
发明人： Sang-Hoon Lee , Eun-Jo Byun , Cheol-Jong Woo , Se-Jang Oh
IPC分类号： H04B10/08
CPC分类号： G11C29/56 , G11C29/32 , G11C2029/2602 , G11C2029/5602
摘要： A test interface device includes a serializer, an optical transmitter, an optical receiver, and a deserializer. The serializer receives parallel test signals from automatic test equipment, and serializes the parallel test signals into a serial test signal. The optical transmitter converts the serial test signal into an optical test signal. The optical receiver receives the optical test signal from the optical transmitter, and converts the optical test signal into the serial test signal. The deserializer deserializes the serial test signal into the parallel test signals, and transmits the parallel test signals to a device under test. As a result, signal transfer speed may be improved and optical resource usage may be reduced.
摘要翻译：测试接口设备包括串行器，光发送器，光接收器和解串器。串行器从自动测试设备接收并行测试信号，将并行测试信号串行化为串行测试信号。光发射机将串行测试信号转换为光学测试信号。光接收机从光发射机接收光测试信号，并将光测试信号转换为串行测试信号。解串器将串行测试信号反序列化为并行测试信号，并将并行测试信号发送到被测设备。结果，可以提高信号传送速度，并且可以减少光学资源的使用。

4. 发明申请

US20090102500A1 Interposer and probe card having the same 有权
标题翻译：内插器和探针卡具有相同的功能
公开(公告)号：US20090102500A1
公开(公告)日：2009-04-23
申请号：US12285962
申请日：2008-10-17
申请人： Young-Soo An , Sang-Hoon Lee , Se-Jang Oh
发明人： Young-Soo An , Sang-Hoon Lee , Se-Jang Oh
IPC分类号： G01R31/26 , H01R12/00
CPC分类号： G01R31/2889 , H01R12/714
摘要： An interposer may include a first base, at least one first signal line in the first base, and at least one first ground line in the first base, wherein the ground line surrounds the at least one first signal line. The at least one first signal line and the at least one first ground line may be exposed through an upper surface of the first base. The at least one first signal line may be configured to conduct a test current through the first base. An interposer may also include a second base below the first base and may include a printed circuit board between the first base and the second base. A probe card may include a multilayer substrate having at least one contact needle, a coaxial board having at least one coaxial signal cable and the above described interposer between the multilayer substrate and the coaxial board.
摘要翻译：插入器可以包括第一基极，第一基极中的至少一个第一信号线和第一基极中的至少一个第一接地线，其中接地线包围至少一个第一信号线。所述至少一个第一信号线和所述至少一个第一接地线可以通过所述第一基座的上表面暴露。所述至少一个第一信号线可以被配置为进行穿过所述第一基座的测试电流。插入器还可以包括位于第一基座下方的第二基座，并且可以包括在第一基座和第二基座之间的印刷电路板。探针卡可以包括具有至少一个接触针的多层衬底，具有至少一个同轴信号电缆的同轴板以及多层衬底和同轴板之间的上述插入器。

5. 发明申请

US20100025682A1 Interface device for wireless testing, semiconductor device and semiconductor package including the same, and method for wirelessly testing using the same 审中-公开
标题翻译：用于无线测试的接口设备，包括其的半导体器件和半导体封装以及使用其的无线测试的方法
公开(公告)号：US20100025682A1
公开(公告)日：2010-02-04
申请号：US12462373
申请日：2009-08-03
申请人： Sang-Hoon Lee , Eun-Jo Byun , Se-Jang Oh , Young-Soo An , Chang-Hyun Cho
发明人： Sang-Hoon Lee , Eun-Jo Byun , Se-Jang Oh , Young-Soo An , Chang-Hyun Cho
IPC分类号： H01L21/66 , H01L23/00
CPC分类号： G01R31/2889 , G01R31/3025 , G01R31/303 , H01L2224/48472 , H01L2924/3011 , H01L2924/00
摘要： In an interface device for wireless testing capable of testing a semiconductor chip in a non-contact manner, a semiconductor device and a semiconductor package including the same, and a method for wirelessly testing a semiconductor device using the same are provided, the interface device for wireless testing includes an interface substrate, interface antennas on the interface substrate, and interface transmitting and receiving circuits on the interface substrate, wherein the interface transmitting and receiving circuits are electrically connected to input/output pads of a semiconductor chip via interface vias passing through the interface substrate.
摘要翻译：在能够以非接触方式测试半导体芯片的无线测试用接口装置中，提供一种半导体器件和包括该半导体器件的半导体封装以及使用其的半导体器件的无线测试方法，无线测试包括接口基板，接口基板上的接口天线和接口基板上的接口发射和接收电路，其中接口发射和接收电路通过经过接口基板的接口通孔电连接到半导体芯片的输入/输出焊盘界面基板。

6. 发明申请

US20090189624A1 Interposer and a probe card assembly for electrical die sorting and methods of operating and manufacturing the same 审中-公开
标题翻译：内插器和用于电气模具排列的探针卡组件及其操作和制造方法
公开(公告)号：US20090189624A1
公开(公告)日：2009-07-30
申请号：US12232963
申请日：2008-09-26
申请人： Se-Jang Oh , Hal-young Lee , Young-soo An , Sang-hoon Lee , Sung-ho Joo , Dong-yeop Kim
发明人： Se-Jang Oh , Hal-young Lee , Young-soo An , Sang-hoon Lee , Sung-ho Joo , Dong-yeop Kim
IPC分类号： G01R31/02 , H01R12/00
CPC分类号： G01R1/07378 , H01R12/714 , H01R13/2407
摘要： An interposer and a probe card assembly for electrical die sorting is provided. The assembly may include probes electrically contacting pads of dies on a substrate, a first wiring unit including a first wire on and electrically contacting the probes, an interposer unit including interposers on the first wiring unit and electrically contacting the first wire, and a second wiring unit including a second wire on the interposer unit and electrically contacting the interposers. At least one interposer includes a conductive member, a first connection member adjacent to a first end of the conductive member so as to electrically connect the conductive member to the first wire, a second connection member adjacent to a second end of the conductive member so as to electrically connect the conductive member to the second wire, and at least one protrusion member on an external surface of the conductive member between the first and second connection members.
摘要翻译：提供了用于电气模具分选的插入件和探针卡组件。组件可以包括电接触衬底上的管芯焊盘的探针，第一布线单元，其包括在第一布线单元上并与第一布线电接触的插入件和与第一布线电接触的插入件，单元，其包括在所述插入单元上的第二导线，并与所述插入件电接触。至少一个插入器包括导电构件，与导电构件的第一端相邻的第一连接构件，以便将导电构件电连接到第一线，与导电构件的第二端相邻的第二连接构件，以便将导电构件电连接到第二线，以及在第一和第二连接构件之间的导电构件的外表面上的至少一个突出构件。

7. 发明授权

US08139949B2 Electrical signal transmission module, method of transmitting electric signals and electrical inspection apparatus having the same 有权
标题翻译：电信号传输模块，发送电信号的方法和具有该信号的电气检查装置
公开(公告)号：US08139949B2
公开(公告)日：2012-03-20
申请号：US12179015
申请日：2008-07-24
申请人： Sang-Hoon Lee , Ho-Jeong Choi , Se-Jang Oh , Young-Soo An , Gyu-Yeol Kim
发明人： Sang-Hoon Lee , Ho-Jeong Choi , Se-Jang Oh , Young-Soo An , Gyu-Yeol Kim
IPC分类号： H04B10/12
CPC分类号： H04B10/2504 , G01R31/2889 , H04B10/801
摘要： An electrical signal transmission module includes a plurality of optical signal lines and a plurality of electrical signal lines. The plurality of optical signal lines converting a first externally input electrical signal into an optical signal, transmitting the optical signal, converting the optical signal back into the first electrical signal, and outputting the first electrical signal. The plurality of electrical signal lines transmitting a second externally input electrical signal and outputting the second electrical signal.
摘要翻译：电信号传输模块包括多个光信号线和多个电信号线。多个光信号线将第一外部输入的电信号转换为光信号，发送光信号，将光信号转换回第一电信号，并输出第一电信号。多个电信号线发送第二外部输入电信号并输出第二电信号。

8. 发明授权

US07538566B2 Electrical test system including coaxial cables 有权
标题翻译：电测试系统包括同轴电缆
公开(公告)号：US07538566B2
公开(公告)日：2009-05-26
申请号：US11926172
申请日：2007-10-29
申请人： Young-Soo An , Se-Jang Oh , Jung-Hyun Nam
发明人： Young-Soo An , Se-Jang Oh , Jung-Hyun Nam
IPC分类号： G01R31/02 , G01R31/28
CPC分类号： G01R31/2889
摘要： An electrical test system includes a test head, a performance board, a probe card and coaxial cables. The performance board includes a first side and an opposite second side, where the first side of the performance board is electrically connected to the test head and the second side of the performance board includes first coaxial cable connection portions. The probe card includes a first side and an opposite second side, where the first side of the probe card includes second coaxial cable connection portions and the second side includes a wafer test probes. The coaxial cables respectively electrically connect the first coaxial cable connection portions of the performance board to the second coaxial cable connection portions of the probe card.
摘要翻译：电气测试系统包括测试头，演奏板，探针卡和同轴电缆。所述性能板包括第一侧和相对的第二侧，其中所述性能板的第一侧电连接到所述测试头，并且所述性能板的第二侧包括第一同轴电缆连接部分。探针卡包括第一侧和相对的第二侧，其中探针卡的第一侧包括第二同轴电缆连接部分，并且第二侧包括晶片测试探针。同轴电缆分别将性能板的第一同轴电缆连接部分电连接到探针卡的第二同轴电缆连接部分。

9. 发明申请

US20090028571A1 ELECTRICAL SIGNAL TRANSMISSION MODULE, METHOD OF TRANSMITTING ELECTRIC SIGNALS AND ELECTRICAL INSPECTION APPARATUS HAVING THE SAME 有权
标题翻译：电子信号传输模块，发送电信号的方法和具有该信号的电子检测装置
公开(公告)号：US20090028571A1
公开(公告)日：2009-01-29
申请号：US12179015
申请日：2008-07-24
申请人： Sang-Hoon Lee , Ho-Jeong Choi , Se-Jang Oh , Young-Soo An , Gyu-Yeol Kim
发明人： Sang-Hoon Lee , Ho-Jeong Choi , Se-Jang Oh , Young-Soo An , Gyu-Yeol Kim
IPC分类号： H04B10/00
CPC分类号： H04B10/2504 , G01R31/2889 , H04B10/801
摘要： An electrical signal transmission module includes a plurality of optical signal lines and a plurality of electrical signal lines. The plurality of optical signal lines converting a first externally input electrical signal into an optical signal, transmitting the optical signal, converting the optical signal back into the first electrical signal, and outputting the first electrical signal. The plurality of electrical signal lines transmitting a second externally input electrical signal and outputting the second electrical signal.
摘要翻译：电信号传输模块包括多个光信号线和多个电信号线。多个光信号线将第一外部输入的电信号转换为光信号，发送光信号，将光信号转换回第一电信号，并输出第一电信号。多个电信号线发送第二外部输入电信号并输出第二电信号。

10. 发明授权

US08606102B2 Test interface device, test system and optical interface memory device 有权
标题翻译：测试接口设备，测试系统和光接口存储设备
公开(公告)号：US08606102B2
公开(公告)日：2013-12-10
申请号：US12592817
申请日：2009-12-03
申请人： Sang-Hoon Lee , Eun-Jo Byun , Cheol-Jong Woo , Se-Jang Oh
发明人： Sang-Hoon Lee , Eun-Jo Byun , Cheol-Jong Woo , Se-Jang Oh
IPC分类号： H04B10/08 , H04B17/00
CPC分类号： G11C29/56 , G11C29/32 , G11C2029/2602 , G11C2029/5602
摘要： A test interface device includes a serializer, an optical transmitter, an optical receiver, and a deserializer. The serializer receives parallel test signals from automatic test equipment, and serializes the parallel test signals into a serial test signal. The optical transmitter converts the serial test signal into an optical test signal. The optical receiver receives the optical test signal from the optical transmitter, and converts the optical test signal into the serial test signal. The deserializer deserializes the serial test signal into the parallel test signals, and transmits the parallel test signals to a device under test. As a result, signal transfer speed may be improved and optical resource usage may be reduced.
摘要翻译：测试接口设备包括串行器，光发送器，光接收器和解串器。串行器从自动测试设备接收并行测试信号，将并行测试信号串行化为串行测试信号。光发射机将串行测试信号转换为光学测试信号。光接收机从光发射机接收光测试信号，并将光测试信号转换为串行测试信号。解串器将串行测试信号反序列化为并行测试信号，并将并行测试信号发送到被测设备。结果，可以提高信号传送速度，并且可以减少光学资源的使用。

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