专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20100150549A1 Test interface device, test system and optical interface memory device 有权
标题翻译：测试接口设备，测试系统和光接口存储设备
公开(公告)号：US20100150549A1
公开(公告)日：2010-06-17
申请号：US12592817
申请日：2009-12-03
申请人： Sang-Hoon Lee , Eun-Jo Byun , Cheol-Jong Woo , Se-Jang Oh
发明人： Sang-Hoon Lee , Eun-Jo Byun , Cheol-Jong Woo , Se-Jang Oh
IPC分类号： H04B10/08
CPC分类号： G11C29/56 , G11C29/32 , G11C2029/2602 , G11C2029/5602
摘要： A test interface device includes a serializer, an optical transmitter, an optical receiver, and a deserializer. The serializer receives parallel test signals from automatic test equipment, and serializes the parallel test signals into a serial test signal. The optical transmitter converts the serial test signal into an optical test signal. The optical receiver receives the optical test signal from the optical transmitter, and converts the optical test signal into the serial test signal. The deserializer deserializes the serial test signal into the parallel test signals, and transmits the parallel test signals to a device under test. As a result, signal transfer speed may be improved and optical resource usage may be reduced.
摘要翻译：测试接口设备包括串行器，光发送器，光接收器和解串器。串行器从自动测试设备接收并行测试信号，将并行测试信号串行化为串行测试信号。光发射机将串行测试信号转换为光学测试信号。光接收机从光发射机接收光测试信号，并将光测试信号转换为串行测试信号。解串器将串行测试信号反序列化为并行测试信号，并将并行测试信号发送到被测设备。结果，可以提高信号传送速度，并且可以减少光学资源的使用。

2. 发明授权

US08606102B2 Test interface device, test system and optical interface memory device 有权
标题翻译：测试接口设备，测试系统和光接口存储设备
公开(公告)号：US08606102B2
公开(公告)日：2013-12-10
申请号：US12592817
申请日：2009-12-03
申请人： Sang-Hoon Lee , Eun-Jo Byun , Cheol-Jong Woo , Se-Jang Oh
发明人： Sang-Hoon Lee , Eun-Jo Byun , Cheol-Jong Woo , Se-Jang Oh
IPC分类号： H04B10/08 , H04B17/00
CPC分类号： G11C29/56 , G11C29/32 , G11C2029/2602 , G11C2029/5602
摘要： A test interface device includes a serializer, an optical transmitter, an optical receiver, and a deserializer. The serializer receives parallel test signals from automatic test equipment, and serializes the parallel test signals into a serial test signal. The optical transmitter converts the serial test signal into an optical test signal. The optical receiver receives the optical test signal from the optical transmitter, and converts the optical test signal into the serial test signal. The deserializer deserializes the serial test signal into the parallel test signals, and transmits the parallel test signals to a device under test. As a result, signal transfer speed may be improved and optical resource usage may be reduced.
摘要翻译：测试接口设备包括串行器，光发送器，光接收器和解串器。串行器从自动测试设备接收并行测试信号，将并行测试信号串行化为串行测试信号。光发射机将串行测试信号转换为光学测试信号。光接收机从光发射机接收光测试信号，并将光测试信号转换为串行测试信号。解串器将串行测试信号反序列化为并行测试信号，并将并行测试信号发送到被测设备。结果，可以提高信号传送速度，并且可以减少光学资源的使用。

3. 发明授权

US07973550B2 Semiconductor device test apparatus including interface unit and method of testing semiconductor device using the same 有权
标题翻译：包括接口单元的半导体器件测试装置和使用其的半导体器件的测试方法
公开(公告)号：US07973550B2
公开(公告)日：2011-07-05
申请号：US12582980
申请日：2009-10-21
申请人： Eun-Jo Byun , Sang-Hoon Lee , Se-Jang Oh , Cheol-Jong Woo
发明人： Eun-Jo Byun , Sang-Hoon Lee , Se-Jang Oh , Cheol-Jong Woo
IPC分类号： G01R31/02 , G01R31/26
CPC分类号： G01R31/31932 , G11C29/56 , G11C29/56012 , G11C2029/5602
摘要： A semiconductor device test apparatus is provided. The semiconductor device test apparatus includes a test unit on which a semiconductor device under test is disposed, and an automatic test equipment (ATE) unit that inputs a test signal to the test unit and reads a test result signal output by the test unit. The semiconductor device test apparatus includes an interface unit that is interposed between the test unit and the ATE unit, and that compares the test signal with the test result signal and outputs to the ATE unit comparison signals indicating whether the semiconductor device is a failure or not or whether a specific bit failure has occurred or not.
摘要翻译：提供一种半导体器件测试装置。半导体器件测试装置包括一个测试单元，在该测试单元上设置有被测半导体器件，以及一个自动测试设备（ATE）单元，它将测试信号输入到测试单元并读取由测试单元输出的测试结果信号。半导体器件测试装置包括插入在测试单元和ATE单元之间的接口单元，并且将测试信号与测试结果信号进行比较，并输出到指示半导体器件是否为故障的ATE单元比较信号或者是否发生特定位故障。

4. 发明申请

US20100182035A1 SEMICONDUCTOR DEVICE TEST APPARATUS INCLUDING INTERFACE UNIT AND METHOD OF TESTING SEMICONDUCTOR DEVICE USING THE SAME 有权
标题翻译：包括界面单元的半导体器件测试装置和使用其的测试半导体器件的方法
公开(公告)号：US20100182035A1
公开(公告)日：2010-07-22
申请号：US12582980
申请日：2009-10-21
申请人： Eun-Jo Byun , Sang-Hoon Lee , Se-Jang Oh , Cheol-Jong Woo
发明人： Eun-Jo Byun , Sang-Hoon Lee , Se-Jang Oh , Cheol-Jong Woo
IPC分类号： G01R31/26
CPC分类号： G01R31/31932 , G11C29/56 , G11C29/56012 , G11C2029/5602
摘要： A semiconductor device test apparatus is provided. The semiconductor device test apparatus includes a test unit on which a semiconductor device under test is disposed, and an automatic test equipment (ATE) unit that inputs a test signal to the test unit and reads a test result signal output by the test unit. The semiconductor device test apparatus includes an interface unit that is interposed between the test unit and the ATE unit, and that compares the test signal with the test result signal and outputs to the ATE unit comparison signals indicating whether the semiconductor device is a failure or not or whether a specific bit failure has occurred or not.
摘要翻译：提供一种半导体器件测试装置。半导体器件测试装置包括一个测试单元，在该测试单元上设置有被测半导体器件，以及一个自动测试设备（ATE）单元，它将测试信号输入到测试单元并读取由测试单元输出的测试结果信号。半导体器件测试装置包括插入在测试单元和ATE单元之间的接口单元，并且将测试信号与测试结果信号进行比较，并输出到指示半导体器件是否为故障的ATE单元比较信号或者是否发生特定位故障。

5. 发明申请

US20100025682A1 Interface device for wireless testing, semiconductor device and semiconductor package including the same, and method for wirelessly testing using the same 审中-公开
标题翻译：用于无线测试的接口设备，包括其的半导体器件和半导体封装以及使用其的无线测试的方法
公开(公告)号：US20100025682A1
公开(公告)日：2010-02-04
申请号：US12462373
申请日：2009-08-03
申请人： Sang-Hoon Lee , Eun-Jo Byun , Se-Jang Oh , Young-Soo An , Chang-Hyun Cho
发明人： Sang-Hoon Lee , Eun-Jo Byun , Se-Jang Oh , Young-Soo An , Chang-Hyun Cho
IPC分类号： H01L21/66 , H01L23/00
CPC分类号： G01R31/2889 , G01R31/3025 , G01R31/303 , H01L2224/48472 , H01L2924/3011 , H01L2924/00
摘要： In an interface device for wireless testing capable of testing a semiconductor chip in a non-contact manner, a semiconductor device and a semiconductor package including the same, and a method for wirelessly testing a semiconductor device using the same are provided, the interface device for wireless testing includes an interface substrate, interface antennas on the interface substrate, and interface transmitting and receiving circuits on the interface substrate, wherein the interface transmitting and receiving circuits are electrically connected to input/output pads of a semiconductor chip via interface vias passing through the interface substrate.
摘要翻译：在能够以非接触方式测试半导体芯片的无线测试用接口装置中，提供一种半导体器件和包括该半导体器件的半导体封装以及使用其的半导体器件的无线测试方法，无线测试包括接口基板，接口基板上的接口天线和接口基板上的接口发射和接收电路，其中接口发射和接收电路通过经过接口基板的接口通孔电连接到半导体芯片的输入/输出焊盘界面基板。

6. 发明申请

US20090189624A1 Interposer and a probe card assembly for electrical die sorting and methods of operating and manufacturing the same 审中-公开
标题翻译：内插器和用于电气模具排列的探针卡组件及其操作和制造方法
公开(公告)号：US20090189624A1
公开(公告)日：2009-07-30
申请号：US12232963
申请日：2008-09-26
申请人： Se-Jang Oh , Hal-young Lee , Young-soo An , Sang-hoon Lee , Sung-ho Joo , Dong-yeop Kim
发明人： Se-Jang Oh , Hal-young Lee , Young-soo An , Sang-hoon Lee , Sung-ho Joo , Dong-yeop Kim
IPC分类号： G01R31/02 , H01R12/00
CPC分类号： G01R1/07378 , H01R12/714 , H01R13/2407
摘要： An interposer and a probe card assembly for electrical die sorting is provided. The assembly may include probes electrically contacting pads of dies on a substrate, a first wiring unit including a first wire on and electrically contacting the probes, an interposer unit including interposers on the first wiring unit and electrically contacting the first wire, and a second wiring unit including a second wire on the interposer unit and electrically contacting the interposers. At least one interposer includes a conductive member, a first connection member adjacent to a first end of the conductive member so as to electrically connect the conductive member to the first wire, a second connection member adjacent to a second end of the conductive member so as to electrically connect the conductive member to the second wire, and at least one protrusion member on an external surface of the conductive member between the first and second connection members.
摘要翻译：提供了用于电气模具分选的插入件和探针卡组件。组件可以包括电接触衬底上的管芯焊盘的探针，第一布线单元，其包括在第一布线单元上并与第一布线电接触的插入件和与第一布线电接触的插入件，单元，其包括在所述插入单元上的第二导线，并与所述插入件电接触。至少一个插入器包括导电构件，与导电构件的第一端相邻的第一连接构件，以便将导电构件电连接到第一线，与导电构件的第二端相邻的第二连接构件，以便将导电构件电连接到第二线，以及在第一和第二连接构件之间的导电构件的外表面上的至少一个突出构件。

7. 发明申请

US20090102500A1 Interposer and probe card having the same 有权
标题翻译：内插器和探针卡具有相同的功能
公开(公告)号：US20090102500A1
公开(公告)日：2009-04-23
申请号：US12285962
申请日：2008-10-17
申请人： Young-Soo An , Sang-Hoon Lee , Se-Jang Oh
发明人： Young-Soo An , Sang-Hoon Lee , Se-Jang Oh
IPC分类号： G01R31/26 , H01R12/00
CPC分类号： G01R31/2889 , H01R12/714
摘要： An interposer may include a first base, at least one first signal line in the first base, and at least one first ground line in the first base, wherein the ground line surrounds the at least one first signal line. The at least one first signal line and the at least one first ground line may be exposed through an upper surface of the first base. The at least one first signal line may be configured to conduct a test current through the first base. An interposer may also include a second base below the first base and may include a printed circuit board between the first base and the second base. A probe card may include a multilayer substrate having at least one contact needle, a coaxial board having at least one coaxial signal cable and the above described interposer between the multilayer substrate and the coaxial board.
摘要翻译：插入器可以包括第一基极，第一基极中的至少一个第一信号线和第一基极中的至少一个第一接地线，其中接地线包围至少一个第一信号线。所述至少一个第一信号线和所述至少一个第一接地线可以通过所述第一基座的上表面暴露。所述至少一个第一信号线可以被配置为进行穿过所述第一基座的测试电流。插入器还可以包括位于第一基座下方的第二基座，并且可以包括在第一基座和第二基座之间的印刷电路板。探针卡可以包括具有至少一个接触针的多层衬底，具有至少一个同轴信号电缆的同轴板以及多层衬底和同轴板之间的上述插入器。

8. 发明授权

US08139949B2 Electrical signal transmission module, method of transmitting electric signals and electrical inspection apparatus having the same 有权
标题翻译：电信号传输模块，发送电信号的方法和具有该信号的电气检查装置
公开(公告)号：US08139949B2
公开(公告)日：2012-03-20
申请号：US12179015
申请日：2008-07-24
申请人： Sang-Hoon Lee , Ho-Jeong Choi , Se-Jang Oh , Young-Soo An , Gyu-Yeol Kim
发明人： Sang-Hoon Lee , Ho-Jeong Choi , Se-Jang Oh , Young-Soo An , Gyu-Yeol Kim
IPC分类号： H04B10/12
CPC分类号： H04B10/2504 , G01R31/2889 , H04B10/801
摘要： An electrical signal transmission module includes a plurality of optical signal lines and a plurality of electrical signal lines. The plurality of optical signal lines converting a first externally input electrical signal into an optical signal, transmitting the optical signal, converting the optical signal back into the first electrical signal, and outputting the first electrical signal. The plurality of electrical signal lines transmitting a second externally input electrical signal and outputting the second electrical signal.
摘要翻译：电信号传输模块包括多个光信号线和多个电信号线。多个光信号线将第一外部输入的电信号转换为光信号，发送光信号，将光信号转换回第一电信号，并输出第一电信号。多个电信号线发送第二外部输入电信号并输出第二电信号。

9. 发明申请

US20090028571A1 ELECTRICAL SIGNAL TRANSMISSION MODULE, METHOD OF TRANSMITTING ELECTRIC SIGNALS AND ELECTRICAL INSPECTION APPARATUS HAVING THE SAME 有权
标题翻译：电子信号传输模块，发送电信号的方法和具有该信号的电子检测装置
公开(公告)号：US20090028571A1
公开(公告)日：2009-01-29
申请号：US12179015
申请日：2008-07-24
申请人： Sang-Hoon Lee , Ho-Jeong Choi , Se-Jang Oh , Young-Soo An , Gyu-Yeol Kim
发明人： Sang-Hoon Lee , Ho-Jeong Choi , Se-Jang Oh , Young-Soo An , Gyu-Yeol Kim
IPC分类号： H04B10/00
CPC分类号： H04B10/2504 , G01R31/2889 , H04B10/801
摘要： An electrical signal transmission module includes a plurality of optical signal lines and a plurality of electrical signal lines. The plurality of optical signal lines converting a first externally input electrical signal into an optical signal, transmitting the optical signal, converting the optical signal back into the first electrical signal, and outputting the first electrical signal. The plurality of electrical signal lines transmitting a second externally input electrical signal and outputting the second electrical signal.
摘要翻译：电信号传输模块包括多个光信号线和多个电信号线。多个光信号线将第一外部输入的电信号转换为光信号，发送光信号，将光信号转换回第一电信号，并输出第一电信号。多个电信号线发送第二外部输入电信号并输出第二电信号。

10. 发明授权

US07884628B2 Interposer and probe card having the same 有权
标题翻译：内插器和探针卡具有相同的功能
公开(公告)号：US07884628B2
公开(公告)日：2011-02-08
申请号：US12285962
申请日：2008-10-17
申请人： Young-Soo An , Sang-Hoon Lee , Se-Jang Oh
发明人： Young-Soo An , Sang-Hoon Lee , Se-Jang Oh
IPC分类号： G01R31/02
CPC分类号： G01R31/2889 , H01R12/714
摘要： An interposer may include a first base, at least one first signal line in the first base, and at least one first ground line in the first base, wherein the ground line surrounds the at least one first signal line. The at least one first signal line and the at least one first ground line may be exposed through an upper surface of the first base. The at least one first signal line may be configured to conduct a test current through the first base. An interposer may also include a second base below the first base and may include a printed circuit board between the first base and the second base. A probe card may include a multilayer substrate having at least one contact needle, a coaxial board having at least one coaxial signal cable and the above described interposer between the multilayer substrate and the coaxial board.
摘要翻译：插入器可以包括第一基极，第一基极中的至少一个第一信号线和第一基极中的至少一个第一接地线，其中接地线包围至少一个第一信号线。所述至少一个第一信号线和所述至少一个第一接地线可以通过所述第一基座的上表面暴露。所述至少一个第一信号线可以被配置为进行穿过所述第一基座的测试电流。插入器还可以包括位于第一基座下方的第二基座，并且可以包括在第一基座和第二基座之间的印刷电路板。探针卡可以包括具有至少一个接触针的多层衬底，具有至少一个同轴信号电缆的同轴板以及多层衬底和同轴板之间的上述插入器。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式