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    • 4. 发明授权
    • Integrated circuit substrate that accommodates lattice mismatch stress
    • 集成电路基板,适应晶格失配应力
    • US06429466B2
    • 2002-08-06
    • US09774199
    • 2001-01-29
    • Yong ChenScott W. CorzineTheodore I. KaminsMichael J. LudowisePierre H. MertzShih-Yuan Wang
    • Yong ChenScott W. CorzineTheodore I. KaminsMichael J. LudowisePierre H. MertzShih-Yuan Wang
    • H01L31072
    • H01L21/7624H01L21/02381H01L21/0245H01L21/02488H01L21/02502H01L21/02538H01L21/0254H01L21/02658H01L21/26533
    • A method for growing a crystalline layer that includes a first material on a growth surface of a crystalline substrate of a second material, wherein the first material and the second material have different lattice constants. A buried layer is generated in the substrate such that the buried layer isolates a layer of the substrate that includes the growth surface from the remainder of the substrate. The second material is then deposited on the growth surface at a growth temperature. The isolated layer of the substrate has a thickness that is less than the thickness at which defects are caused in the crystalline lattice of the first material by the second material crystallizing thereon. The buried layer is sufficiently malleable at the growth temperature to allow the deformation of the lattice of the isolated layer without deforming the remainder of the substrate. The present invention may be utilized for growing III-V semiconducting material layers on silicon substrates. In the case of silicon-based substrates, the buried layer is preferably SiO2 that is sufficiently malleable at the growth temperature to allow the deformation of the isolated substrate layer.
    • 一种用于生长晶体层的方法,其包括在第二材料的晶体衬底的生长表面上的第一材料,其中第一材料和第二材料具有不同的晶格常数。 在衬底中产生掩埋层,使得掩埋层将衬底的包含生长表面的衬底与衬底的其余部分隔离。 然后将第二种材料在生长温度下沉积在生长表面上。 衬底的隔离层的厚度小于在其上结晶第二材料时在第一材料的晶格中产生缺陷的厚度。 掩埋层在生长温度下具有足够的延展性,以允许隔离层的晶格变形,而不使基底的其余部分变形。 本发明可用于在硅衬底上生长III-V半导体材料层。 在硅基基板的情况下,掩埋层优选是在生长温度下足够有韧性的SiO 2,以允许隔离的基底层的变形。
    • 8. 发明授权
    • Nitride semiconductor vertical cavity surface emitting laser
    • 氮化物半导体垂直腔表面发射激光器
    • US07352788B2
    • 2008-04-01
    • US11203699
    • 2005-08-15
    • Scott W. CorzineDavid P. Bour
    • Scott W. CorzineDavid P. Bour
    • H01S5/00
    • H01S5/0424B82Y20/00H01S5/18341H01S5/18369H01S5/18383H01S5/20H01S5/34333H01S2304/12
    • In one aspect, a VCSEL includes a base region that has a vertical growth part laterally adjacent a first optical reflector and a lateral growth part that includes nitride semiconductor material vertically over at least a portion of the first optical reflector. An active region has at least one nitride semiconductor quantum well vertically over at least a portion of the lateral growth part of the base region and includes a first dopant of a first electrical conductivity type. A contact region includes a nitride semiconductor material laterally adjacent the active region and a second dopant of a second electrical conductivity type opposite the first electrical conductivity type. A second optical reflector is vertically over the active region and forms with the first optical reflector a vertical optical cavity overlapping at least a portion of the at least one quantum well of the active region. A method of fabricating a VCSEL also is described.
    • 在一个方面,VCSEL包括具有垂直生长部分的横向邻近于第一光学反射器的基底区域和在第一光学反射体的至少一部分上方垂直包括氮化物半导体材料的横向生长部分。 有源区域在基极区域的横向生长部分的至少一部分上垂直地具有至少一个氮化物半导体量子阱,并且包括第一导电类型的第一掺杂物。 接触区域包括横向邻近有源区的氮化物半导体材料和与第一导电类型相反的第二导电类型的第二掺杂剂。 第二光学反射器垂直于有源区域并且与第一光学反射器形成垂直的光学腔,其与有源区的至少一个量子阱的至少一部分重叠。 还描述了制造VCSEL的方法。
    • 9. 发明授权
    • Electroabsorption modulator
    • 电吸收调制器
    • US07142342B2
    • 2006-11-28
    • US10453376
    • 2003-06-02
    • David P. BourAshish TandonScott W. CorzineChaokun Lin
    • David P. BourAshish TandonScott W. CorzineChaokun Lin
    • G02F1/03G02F1/07
    • B82Y20/00G02F1/01708G02F2001/0157
    • The electroabsorption modulator comprises a p-i-n junction structure that includes an active layer, a p-type cladding layer and an n-type cladding layer with the active layer sandwiched between the cladding layers. The electroabsorption modulator additionally comprises a quantum well structure located within the active layer. The p-type cladding layer comprises a layer of heavily-doped low-diffusivity p-type semiconductor material located adjacent the active layer that reduces the extension of the depletion region into the p-type cladding layer when a reverse bias is applied to the electroabsorption modulator. The reduced extension increases the strength of the electric field applied to the quantum well structure by a given reverse bias voltage. The increased field strength increases the extinction ratio of the electroabsorption modulator.
    • 电吸收调制器包括p-i-n结结构,其包括有源层,p型包层和n型包覆层,活性层夹在包层之间。 电吸收调制器还包括位于有源层内的量子阱结构。 p型包覆层包括位于有源层附近的重掺杂低扩散性p型半导体材料层,当将反向偏压施加到电吸收时减少耗尽区的扩展到p型覆层 调制器。 缩小的延伸通过给定的反向偏置电压增加施加到量子阱结构的电场的强度。 增加的场强提高了电吸收调制器的消光比。