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1. 发明授权

US07793610B2 Liquid processing apparatus 有权
标题翻译：液体处理设备
公开(公告)号：US07793610B2
公开(公告)日：2010-09-14
申请号：US11785352
申请日：2007-04-17
申请人： Masami Akimoto , Takayuki Toshima , Satoshi Kaneko , Kazuhisa Matsumoto , Norihiro Ito , Hiromitsu Nanba
发明人： Masami Akimoto , Takayuki Toshima , Satoshi Kaneko , Kazuhisa Matsumoto , Norihiro Ito , Hiromitsu Nanba
IPC分类号： B05C13/02
CPC分类号： H01L21/67051 , H01L21/6715 , H01L21/68728
摘要： A liquid processing apparatus includes: a substrate holding member configured to rotate along with a substrate held thereon in a horizontal state; a rotary cup configured to surround the substrate held on the substrate holding member and to rotate along with the substrate; a rotation mechanism configured to integratedly rotate the rotary cup and the substrate holding member; a liquid supply mechanism configured to supply a process liquid onto the substrate; and an exhaust/drain section configured to perform gas-exhausting and liquid-draining of the rotary cup. The exhaust/drain section includes an annular drain cup configured to mainly collect and discharge a process liquid thrown off from the substrate, and an exhaust cup surrounding the drain cup and configured to mainly collect and discharge a gas component from inside and around the rotary cup. Liquid-draining from the drain cup and gas-exhausting from the exhaust cup are performed independently of each other.
摘要翻译：一种液体处理装置，包括：基板保持部件，其构造成与水平状态下保持的基板一起旋转; 旋转杯，其构造成围绕保持在所述基板保持构件上并与所述基板一起旋转的所述基板; 旋转机构，其构造成使所述旋转杯和所述基板保持部件一体地旋转; 液体供给机构，其构造成将处理液体供给到所述基板上; 以及排气/排出部，其构造成进行所述旋转杯的排气和排液。排气/排放部分包括环形排水杯，其构造成主要收集和排出从基板排出的处理液体，以及围绕排水杯的排气杯，并且构造成主要从旋转杯内部和周围收集和排出气体成分。从排水杯排出液体并从排气杯排出气体彼此独立地进行。

2. 发明申请

US20070240638A1 Liquid processing apparatus 有权
标题翻译：液体处理设备
公开(公告)号：US20070240638A1
公开(公告)日：2007-10-18
申请号：US11785352
申请日：2007-04-17
申请人： Masami Akimoto , Takayuki Toshima , Satoshi Kaneko , Kazuhisa Matsumoto , Norihiro Ito , Hiromitsu Nanba
发明人： Masami Akimoto , Takayuki Toshima , Satoshi Kaneko , Kazuhisa Matsumoto , Norihiro Ito , Hiromitsu Nanba
IPC分类号： B05C11/02 , B05C5/00 , B05B1/28
CPC分类号： H01L21/67051 , H01L21/6715 , H01L21/68728
摘要： A liquid processing apparatus includes: a substrate holding member configured to rotate along with a substrate held thereon in a horizontal state; a rotary cup configured to surround the substrate held on the substrate holding member and to rotate along with the substrate; a rotation mechanism configured to integratedly rotate the rotary cup and the substrate holding member; a liquid supply mechanism configured to supply a process liquid onto the substrate; and an exhaust/drain section configured to perform gas-exhausting and liquid-draining of the rotary cup. The exhaust/drain section includes an annular drain cup configured to mainly collect and discharge a process liquid thrown off from the substrate, and an exhaust cup surrounding the drain cup and configured to mainly collect and discharge a gas component from inside and around the rotary cup. Liquid-draining from the drain cup and gas-exhausting from the exhaust cup are performed independently of each other.
摘要翻译：一种液体处理装置，包括：基板保持部件，其构造成与水平状态下保持的基板一起旋转; 旋转杯，其构造成围绕保持在所述基板保持构件上并与所述基板一起旋转的所述基板; 旋转机构，其构造成使所述旋转杯和所述基板保持部件一体地旋转; 液体供给机构，其构造成将处理液体供给到所述基板上; 以及排气/排出部，其构造成进行所述旋转杯的排气和排液。排气/排放部分包括环形排水杯，其构造成主要收集和排出从基板排出的处理液体，以及围绕排水杯的排气杯，并且构造成主要从旋转杯内部和周围收集和排出气体成分。从排水杯排出液体并从排气杯排出气体彼此独立地进行。

3. 发明申请

US20070240824A1 Liquid processing apparatus 有权
标题翻译：液体处理设备
公开(公告)号：US20070240824A1
公开(公告)日：2007-10-18
申请号：US11785351
申请日：2007-04-17
申请人： Satoshi Kaneko , Kazuhisa Matsumoto , Norihiro Ito , Masami Akimoto , Takayuki Toshima , Hiromitsu Nanba
发明人： Satoshi Kaneko , Kazuhisa Matsumoto , Norihiro Ito , Masami Akimoto , Takayuki Toshima , Hiromitsu Nanba
IPC分类号： B05C13/02 , B08B3/00 , H01L21/306
CPC分类号： H01L21/67051 , H01L21/6715 , H01L21/68728 , Y10S134/902
摘要： A liquid processing apparatus includes a substrate holding member configured to rotate along with a substrate held thereon in a horizontal state; a rotary cup configured to surround the substrate and to rotate along with the substrate; a liquid supply mechanism configured to supply a process liquid onto at least a front surface of the substrate; and an exhaust/drain section configured to perform gas-exhausting and liquid-draining out of the rotary cup; and a guide member disposed to surround the substrate, having an upper surface to be substantially continued to the front surface of the substrate, and configured to rotate along with the substrate holding member and the rotary cup, such that a process liquid supplied onto the front surface of the substrate and thrown off from the substrate is guided by the upper surface of the guide member from the rotary cup to the exhaust/drain section.
摘要翻译：一种液体处理装置，包括：基板保持部件，其被构造成与水平状态下保持的基板一起旋转; 旋转杯，其构造成围绕所述基底并与所述基底一起旋转; 液体供给机构，其构造成将处理液体供给到所述基板的至少前表面上; 以及排气/排出部，其构造成从所述旋转杯中排出并排出液体; 以及引导构件，其设置成围绕所述基板，具有基本上连续到所述基板的前表面的上表面，并且被构造成与所述基板保持构件和所述旋转杯一起旋转，使得提供到所述前面的处理液基板的表面从基板被甩出，由引导构件的上表面从旋转杯引导到排气/排出部。

4. 发明授权

US07998308B2 Liquid processing apparatus 有权
标题翻译：液体处理设备
公开(公告)号：US07998308B2
公开(公告)日：2011-08-16
申请号：US11785351
申请日：2007-04-17
申请人： Satoshi Kaneko , Kazuhisa Matsumoto , Norihiro Ito , Masami Akimoto , Takayuki Toshima , Hiromitsu Nanba
发明人： Satoshi Kaneko , Kazuhisa Matsumoto , Norihiro Ito , Masami Akimoto , Takayuki Toshima , Hiromitsu Nanba
IPC分类号： H01L21/00 , H01L21/30
CPC分类号： H01L21/67051 , H01L21/6715 , H01L21/68728 , Y10S134/902
摘要： A liquid processing apparatus includes a substrate holding member configured to rotate along with a substrate held thereon in a horizontal state; a rotary cup configured to surround the substrate and to rotate along with the substrate; a liquid supply mechanism configured to supply a process liquid onto at least a front surface of the substrate; and an exhaust/drain section configured to perform gas-exhausting and liquid-draining out of the rotary cup; and a guide member disposed to surround the substrate, having an upper surface to be substantially continued to the front surface of the substrate, and configured to rotate along with the substrate holding member and the rotary cup, such that a process liquid supplied onto the front surface of the substrate and thrown off from the substrate is guided by the upper surface of the guide member from the rotary cup to the exhaust/drain section.
摘要翻译：一种液体处理装置，包括：基板保持部件，其被构造成与水平状态下保持的基板一起旋转; 旋转杯，其构造成围绕所述基底并与所述基底一起旋转; 液体供给机构，其构造成将处理液体供给到所述基板的至少前表面上; 以及排气/排出部，其构造成从所述旋转杯中排出并排出液体; 以及引导构件，其设置成围绕所述基板，具有基本上连续到所述基板的前表面的上表面，并且被构造成与所述基板保持构件和所述旋转杯一起旋转，使得提供到所述前面的处理液基板的表面从基板被甩出，由引导构件的上表面从旋转杯引导到排气/排出部。

5. 发明申请

US20080023049A1 Liquid processing system 有权
标题翻译：液体处理系统
公开(公告)号：US20080023049A1
公开(公告)日：2008-01-31
申请号：US11878385
申请日：2007-07-24
申请人： Kazuhisa Matsumoto , Satoshi Kaneko , Masami Akimoto , Takayuki Toshima , Norihiro Ito
发明人： Kazuhisa Matsumoto , Satoshi Kaneko , Masami Akimoto , Takayuki Toshima , Norihiro Ito
IPC分类号： B08B3/04
CPC分类号： H01L21/67051 , H01L21/67017 , H01L21/6708 , H01L21/67173
摘要： A liquid processing system includes a liquid processing section including liquid processing units horizontally disposed therein and each configured to perform a liquid process while supplying a process liquid onto a substrate; a process liquid storing section that stores the process liquid to be supplied to the liquid processing units of the liquid processing section; and a piping unit including a supply pipe configured to guide the process liquid from the process liquid storing section to the liquid processing units. The process liquid storing section, the piping unit, and the liquid processing section are disposed inside a common casing in this order from below. The supply pipe of the piping unit has a horizontal pipe portion horizontally extending along an array direction of the liquid processing units, such that the process liquid is supplied from the horizontal pipe portion to the liquid processing units individually.
摘要翻译：液体处理系统包括液体处理部分，其包括水平地设置在其中的液体处理单元，并且每个液体处理部件被配置为在将处理液体供应到基板上时进行液体处理; 处理液体存储部，其存储要供给到液体处理部的液体处理单元的处理液; 以及管道单元，其包括供给管，其构造成将处理液从所述处理液储存部引导到所述液体处理单元。处理液收容部，配管部和液处理部从下方依次配置在公共壳体的内部。管道单元的供给管具有沿着液体处理单元的排列方向水平延伸的水平管部分，使得处理液体从水平管部分分别供应到液体处理单元。

6. 发明授权

US07849864B2 Liquid processing system 有权
标题翻译：液体处理系统
公开(公告)号：US07849864B2
公开(公告)日：2010-12-14
申请号：US11878385
申请日：2007-07-24
申请人： Kazuhisa Matsumoto , Satoshi Kaneko , Masami Akimoto , Takayuki Toshima , Norihiro Ito
发明人： Kazuhisa Matsumoto , Satoshi Kaneko , Masami Akimoto , Takayuki Toshima , Norihiro Ito
IPC分类号： B08B3/00
CPC分类号： H01L21/67051 , H01L21/67017 , H01L21/6708 , H01L21/67173
摘要： A liquid processing system includes a liquid processing section including liquid processing units horizontally disposed therein and each configured to perform a liquid process while supplying a process liquid onto a substrate; a process liquid storing section that stores the process liquid to be supplied to the liquid processing units of the liquid processing section; and a piping unit including a supply pipe configured to guide the process liquid from the process liquid storing section to the liquid processing units. The process liquid storing section, the piping unit, and the liquid processing section are disposed inside a common casing in this order from below. The supply pipe of the piping unit has a horizontal pipe portion horizontally extending along an array direction of the liquid processing units, such that the process liquid is supplied from the horizontal pipe portion to the liquid processing units individually.
摘要翻译：液体处理系统包括液体处理部分，其包括水平地设置在其中的液体处理单元，并且每个液体处理部件被配置为在将处理液体供应到基板上时进行液体处理; 处理液体存储部，其存储要供给到液体处理部的液体处理单元的处理液; 以及管道单元，其包括供给管，其构造成将处理液从所述处理液储存部引导到所述液体处理单元。处理液收容部，配管部和液处理部从下方依次配置在公共壳体的内部。管道单元的供给管具有沿着液体处理单元的排列方向水平延伸的水平管部分，使得处理液体从水平管部分分别供应到液体处理单元。

7. 发明授权

US5928390A Vertical processing apparatus 失效
标题翻译：垂直加工设备
公开(公告)号：US5928390A
公开(公告)日：1999-07-27
申请号：US787862
申请日：1997-01-23
申请人： Hidetami Yaegashi , Takayuki Toshima , Masami Akimoto , Eiji Yamaguchi , Junichi Kitano , Takayuki Katano , Hiroshi Shinya , Naruaki Iida
发明人： Hidetami Yaegashi , Takayuki Toshima , Masami Akimoto , Eiji Yamaguchi , Junichi Kitano , Takayuki Katano , Hiroshi Shinya , Naruaki Iida
IPC分类号： H01L21/00 , H01L21/68 , B23P21/00 , B65G49/07 , H01L21/027
CPC分类号： H01L21/67178 , H01L21/67196 , H01L21/67225 , H01L21/67742 , Y10T29/41
摘要： A processing apparatus comprises a plurality of process unit groups each including a plurality of process units for subjecting an object to a series of processes, the process units being arranged vertically in multiple stages, an object transfer space being defined among the process unit groups, and a transfer mechanism for transferring the object, the transfer mechanism having a transfer member vertically movable in the object transfer space, the transfer member being capable of transferring the object to each of the process units. The processing apparatus further comprises a mechanism for forming a downward air flow in the object transfer space, a mechanism for controlling the quantity of the downward air flow, and a mechanism for controlling the pressure in the object transfer space. Thus, a variation in condition of the object transfer space is reduced.
摘要翻译：处理装置包括多个处理单元组，每个处理单元组包括用于对象进行一系列处理的多个处理单元，处理单元以多级垂直排列，在处理单元组之间定义对象传送空间，以及用于传送物体的传送机构，传送机构具有可在物体传送空间中垂直移动的传送部件，传送部件能够将物体传送到每个处理单元。处理装置还包括用于在物体传送空间中形成向下的空气流的机构，用于控制向下的空气流量的机构，以及用于控制物体传送空间中的压力的机构。因此，物体传送空间的状态的变化减小。

8. 发明授权

US07838801B2 Heating apparatus, heating method, coating apparatus, and storage medium 失效
标题翻译：加热装置，加热方法，涂布装置和存储介质
公开(公告)号：US07838801B2
公开(公告)日：2010-11-23
申请号：US11707061
申请日：2007-02-16
申请人： Osamu Hirakawa , Masami Akimoto , Shinichi Hayashi
发明人： Osamu Hirakawa , Masami Akimoto , Shinichi Hayashi
IPC分类号： H01L21/68 , B65G15/10 , B65H5/02 , F27B5/06 , F27B5/12
CPC分类号： H01L21/67109 , H01L21/67748 , Y10S198/952
摘要： A heating apparatus cooling a substrate heated by a hot plate at a cooling position adjacent to the hot plate, capable of achieving a smaller height and reducing an operation time in the apparatus, in which contamination of the substrate by particles or the like is less likely, and the like, are provided. The heating apparatus includes a hot plate for heating a wafer representing a substrate from below, in a heating chamber having a wafer load/unload port. In addition, a wire for transferring the wafer between a cooling position of the substrate adjacent to the load/unload port of the heating chamber (position above a cooling plate) and a position above the hot plate is provided and extends. The wafer is mounted on a gap forming member provided on the wire, and thereafter loaded into the heating chamber.
摘要翻译：一种加热装置，用于在与热板相邻的冷却位置处冷却由热板加热的基板，能够实现较小的高度，并且减少了由于颗粒等引起的基板污染的装置中的操作时间。，等等。加热装置包括用于在具有晶片装载/卸载端口的加热室中从下方加热表示基板的晶片的热板。此外，提供并延伸用于将晶片在与加热室的加载/卸载端口相邻的冷却位置（位于冷却板的上方）之间传送晶片的导线和热板上方的位置。将晶片安装在设置在线材上的间隙形成部件上，然后装入加热室。

9. 发明授权

US07245348B2 Coating and developing system and coating and developing method with antireflection film and an auxiliary block for inspection and cleaning 有权
标题翻译：涂层和显影系统以及具有防反射膜和辅助块的检测和清洁的涂层和显影方法
公开(公告)号：US07245348B2
公开(公告)日：2007-07-17
申请号：US11117566
申请日：2005-04-29
申请人： Masami Akimoto , Shinichi Hayashi , Yasushi Hayashida , Nobuaki Matsuoka , Yoshio Kimura , Issei Ueda , Hikaru Ito
发明人： Masami Akimoto , Shinichi Hayashi , Yasushi Hayashida , Nobuaki Matsuoka , Yoshio Kimura , Issei Ueda , Hikaru Ito
IPC分类号： G03B27/52
CPC分类号： H01L21/67184 , H01L21/6715 , H01L21/67178 , H01L21/6719
摘要： A coating and developing system includes an auxiliary block, a resist film forming unit block and antireflection film forming unit blocks stacked up in layers to form a resist film and an antireflection film underlying the resist film and an antireflection film overlying the resist film in a small space. The coating and developing system can cope with either a case where antireflection films are formed or a case where no antireflection film is formed. Film forming unit blocks, namely, a TCT layer, a COT layer and a BCT layer, and developing unit blocks, namely, DEV layers, are stacked up in layers in a processing block S2. The TCT layer, the COT layer and the BCT layer are used selectively in the case where antireflection films are formed and the case where any antireflection film is not formed. The coating and developing system is controlled by a carrying program.
摘要翻译：涂覆显影系统包括辅助块，抗蚀剂膜形成单元块和层叠的抗反射膜形成单元块，以形成抗蚀剂膜和抗蚀剂膜下面的抗反射膜，以及抗反射膜，覆盖抗蚀剂膜空间。涂覆和显影系统可以应对形成防反射膜的情况或不形成抗反射膜的情况。成膜单位块，即TCT层，COT层和BCT层，以及显影单元块，即DEV层，在处理块S2中层叠。在形成防反射膜的情况下选择性地使用TCT层，COT层和BCT层以及未形成任何抗反射膜的情况。涂层和显影系统由携带程序控制。

10. 发明申请

US20070056514A1 Coating and developing apparatus 有权
标题翻译：涂装显影装置
公开(公告)号：US20070056514A1
公开(公告)日：2007-03-15
申请号：US11342616
申请日：2006-01-31
申请人： Masami Akimoto , Shinichi Hayashi , Yasushi Hayashida , Nobuaki Matsuoka , Yoshio Kimura , Issei Ueda , Hikaru Ito
发明人： Masami Akimoto , Shinichi Hayashi , Yasushi Hayashida , Nobuaki Matsuoka , Yoshio Kimura , Issei Ueda , Hikaru Ito
IPC分类号： C23C16/00
CPC分类号： H01L21/67184 , H01L21/67173 , H01L21/67178 , H01L21/67207 , H01L21/67745
摘要： Provided is a coating and developing apparatus composed of an assembly of plural unit blocks. A first unit-block stack and a second unit-block stack are arranged at different positions with respect to front-and-rear direction. Unit blocks for development, each of which comprises plural processing units including a developing unit that performs developing process after exposure and a transfer device that transfers a substrate among the processing units, are arranged at the lowermost level. Unit blocks for application, or coating, each of which comprises plural processing units including a coating unit that performs application process before exposure and a transfer device that transfers a substrate among the processing units, are arranged above the unit blocks for development. Unit blocks for application are arranged in both the first and second unit-block stacks. Unit blocks for application which a wafer goes through are determined depending on the layering positional relationship between an antireflective film and a resist film. An exposed wafer goes only through the unit block for development without going through any one of the unit blocks for application.
摘要翻译：提供一种由多个单元块组成的涂层显影装置。第一单位块堆叠和第二单位块堆叠被布置在相对于前后方向的不同位置。用于显影的单元块，每个包括多个处理单元，包括执行曝光之后的显影处理的显影单元和在处理单元之间传送基板的转印装置布置在最下层。用于应用或涂布的单元块包括多个处理单元，包括在曝光之前进行施加处理的涂布单元和在处理单元之间传送基板的转印装置，布置在用于显影的单位块上方。用于应用的单元块被布置在第一和第二单元块堆叠中。根据防反射膜和抗蚀剂膜之间的层叠位置关系确定晶片通过的应用单元块。暴露的晶片仅通过单元块进行开发，而不经过用于应用的单元块中的任何一个。

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