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    • 3. 发明申请
    • METHOD FOR MANUFACTURING A MAGNETIC TAPE HEAD USING A TMR SENSOR
    • 使用TMR传感器制造磁带头的方法
    • US20120152891A1
    • 2012-06-21
    • US12973791
    • 2010-12-20
    • Diane L. BrownQuang LeChang-Man ParkDavid J. SeagleEileen Yan
    • Diane L. BrownQuang LeChang-Man ParkDavid J. SeagleEileen Yan
    • G11B5/187
    • G11B5/00826G11B5/3163G11B5/3909G11B5/3977
    • A method for manufacturing a magnetic tape head having a data sensor and a servo sensor. The data sensor and servo sensor are each separated from first and second magnetic shields by a non-magnetic gap layer, and the gap thickness for the servo sensor is larger than the gap thickness for the data sensor. The method involves depositing a first gap layer over shield structures, then depositing a second gap layer using a liftoff process to remove the second gap layer over the data sensor region. A plurality of sensor layers are then deposited, and a stripe height defining mask structure is formed over the data and servo sensor regions, the mask having a back edge that is configured to define a stripe height of the data and servo sensors. An ion milling is then performed to define the stripe height and to remove gap material from the field.
    • 一种具有数据传感器和伺服传感器的磁带头的制造方法。 数据传感器和伺服传感器通过非磁隙层与第一和第二磁屏蔽分开,伺服传感器的间隙厚度大于数据传感器的间隙厚度。 该方法包括在屏蔽结构上沉积第一间隙层,然后使用提升过程沉积第二间隙层以去除数据传感器区域上的第二间隙层。 然后沉积多个传感器层,并且在数据和伺服传感器区域上形成条纹高度限定掩模结构,掩模具有配置为限定数据和伺服传感器的条带高度的后边缘。 然后进行离子铣削以限定条带高度并从场中移除间隙材料。
    • 5. 发明授权
    • Method for manufacturing a magnetic tape head using a TMR sensor
    • 使用TMR传感器制造磁带头的方法
    • US08333898B2
    • 2012-12-18
    • US12973791
    • 2010-12-20
    • Diane L. BrownQuang LeChang-Man ParkDavid J. SeagleEileen Yan
    • Diane L. BrownQuang LeChang-Man ParkDavid J. SeagleEileen Yan
    • B44C1/22
    • G11B5/00826G11B5/3163G11B5/3909G11B5/3977
    • A method for manufacturing a magnetic tape head having a data sensor and a servo sensor. The data sensor and servo sensor are each separated from first and second magnetic shields by a non-magnetic gap layer, and the gap thickness for the servo sensor is larger than the gap thickness for the data sensor. The method involves depositing a first gap layer over shield structures, then depositing a second gap layer using a liftoff process to remove the second gap layer over the data sensor region. A plurality of sensor layers are then deposited, and a stripe height defining mask structure is formed over the data and servo sensor regions, the mask having a back edge that is configured to define a stripe height of the data and servo sensors. An ion milling is then performed to define the stripe height and to remove gap material from the field.
    • 一种具有数据传感器和伺服传感器的磁带头的制造方法。 数据传感器和伺服传感器通过非磁隙层与第一和第二磁屏蔽分开,伺服传感器的间隙厚度大于数据传感器的间隙厚度。 该方法包括在屏蔽结构上沉积第一间隙层,然后使用提升过程沉积第二间隙层以去除数据传感器区域上的第二间隙层。 然后沉积多个传感器层,并且在数据和伺服传感器区域上形成条纹高度限定掩模结构,掩模具有配置为限定数据和伺服传感器的条带高度的后边缘。 然后进行离子铣削以限定条带高度并从场中移除间隙材料。
    • 9. 发明授权
    • Method for detecting defects that exhibit repetitive patterns
    • 检测显示重复图案的缺陷的方法
    • US07095239B2
    • 2006-08-22
    • US10985313
    • 2004-11-09
    • Diane L. BrownWolfgang Goubau
    • Diane L. BrownWolfgang Goubau
    • G01R31/08G01R31/26
    • G01R31/2831
    • A method for detecting defects in devices that are fabricated in repetitive patterns upon the surface of a substrate by the, repetitive utilization of masks and similar devices. A mask flaw will become manifest in a series of defective devices as the mask is successively utilized. The detection of repetitive defects is undertaken by determining the electrical resistance of devices in a group, such as a column, fabricated upon the wafer surface, where the repetitive defect will occur multiple times. The mean electrical resistance of the group is determined and a percent deviation of each device from the mean is then determined. The percent deviation of all of the devices in the group are multiplied together to create a multiplied percent deviation number and the multiplied percent deviation number is then compared with a figure of merit value to make a determination of whether defective devices exist within the group.
    • 一种用于通过重复使用掩模和类似装置来检测在衬底表面上以重复图案制造的器件中的缺陷的方法。 当连续使用掩模时,掩模缺陷将在一系列有缺陷的装置中变得显现。 通过确定在晶片表面上制造的诸如柱的组中的器件的电阻,其中重复缺陷将发生多次,来进行重复缺陷的检测。 确定组的平均电阻,然后确定每个装置与平均值的百分比偏差。 将组中所有设备的百分比偏差相乘以产生相乘百分比偏差数,然后将乘法百分比偏差数与品质因数值进行比较,以确定组内是否存在缺陷设备。