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    • 1. 发明申请
    • METHOD FOR MANUFACTURING A MAGNETIC TAPE HEAD USING A TMR SENSOR
    • 使用TMR传感器制造磁带头的方法
    • US20120152891A1
    • 2012-06-21
    • US12973791
    • 2010-12-20
    • Diane L. BrownQuang LeChang-Man ParkDavid J. SeagleEileen Yan
    • Diane L. BrownQuang LeChang-Man ParkDavid J. SeagleEileen Yan
    • G11B5/187
    • G11B5/00826G11B5/3163G11B5/3909G11B5/3977
    • A method for manufacturing a magnetic tape head having a data sensor and a servo sensor. The data sensor and servo sensor are each separated from first and second magnetic shields by a non-magnetic gap layer, and the gap thickness for the servo sensor is larger than the gap thickness for the data sensor. The method involves depositing a first gap layer over shield structures, then depositing a second gap layer using a liftoff process to remove the second gap layer over the data sensor region. A plurality of sensor layers are then deposited, and a stripe height defining mask structure is formed over the data and servo sensor regions, the mask having a back edge that is configured to define a stripe height of the data and servo sensors. An ion milling is then performed to define the stripe height and to remove gap material from the field.
    • 一种具有数据传感器和伺服传感器的磁带头的制造方法。 数据传感器和伺服传感器通过非磁隙层与第一和第二磁屏蔽分开,伺服传感器的间隙厚度大于数据传感器的间隙厚度。 该方法包括在屏蔽结构上沉积第一间隙层,然后使用提升过程沉积第二间隙层以去除数据传感器区域上的第二间隙层。 然后沉积多个传感器层,并且在数据和伺服传感器区域上形成条纹高度限定掩模结构,掩模具有配置为限定数据和伺服传感器的条带高度的后边缘。 然后进行离子铣削以限定条带高度并从场中移除间隙材料。
    • 5. 发明授权
    • Method for manufacturing a magnetic tape head using a TMR sensor
    • 使用TMR传感器制造磁带头的方法
    • US08333898B2
    • 2012-12-18
    • US12973791
    • 2010-12-20
    • Diane L. BrownQuang LeChang-Man ParkDavid J. SeagleEileen Yan
    • Diane L. BrownQuang LeChang-Man ParkDavid J. SeagleEileen Yan
    • B44C1/22
    • G11B5/00826G11B5/3163G11B5/3909G11B5/3977
    • A method for manufacturing a magnetic tape head having a data sensor and a servo sensor. The data sensor and servo sensor are each separated from first and second magnetic shields by a non-magnetic gap layer, and the gap thickness for the servo sensor is larger than the gap thickness for the data sensor. The method involves depositing a first gap layer over shield structures, then depositing a second gap layer using a liftoff process to remove the second gap layer over the data sensor region. A plurality of sensor layers are then deposited, and a stripe height defining mask structure is formed over the data and servo sensor regions, the mask having a back edge that is configured to define a stripe height of the data and servo sensors. An ion milling is then performed to define the stripe height and to remove gap material from the field.
    • 一种具有数据传感器和伺服传感器的磁带头的制造方法。 数据传感器和伺服传感器通过非磁隙层与第一和第二磁屏蔽分开,伺服传感器的间隙厚度大于数据传感器的间隙厚度。 该方法包括在屏蔽结构上沉积第一间隙层,然后使用提升过程沉积第二间隙层以去除数据传感器区域上的第二间隙层。 然后沉积多个传感器层,并且在数据和伺服传感器区域上形成条纹高度限定掩模结构,掩模具有配置为限定数据和伺服传感器的条带高度的后边缘。 然后进行离子铣削以限定条带高度并从场中移除间隙材料。
    • 8. 发明授权
    • Test components fabricated with large area sensors used for determining the resistance of an MR sensor
    • 用大面积传感器制造的测试部件用于确定MR传感器的电阻
    • US07855553B2
    • 2010-12-21
    • US11965587
    • 2007-12-27
    • Robert S. BeachMary K. GutberletDavid J. Seagle
    • Robert S. BeachMary K. GutberletDavid J. Seagle
    • G01R33/12
    • G11B20/1816G11B5/3166G11B5/3173G11B5/3193G11B5/3903G11B2220/2516
    • Test methods and components are disclosed for testing resistances of magnetoresistance (MR) sensors in read elements. Test components are fabricated on a wafer with a first test lead, a test MR sensor, and a second test lead. The test leads and test MR sensor are fabricated with similar processes as first shields, MR sensors, and second shields of read elements on tie wafer. However, the test MR sensor is fabricated with an area that is larger than areas of the MR sensors in the read elements. The larger area of the test MR sensor causes the resistance of the test MR sensor to be insignificant compared to the lead resistance. Thus, a resistance measurement of the test component represents the lead resistance of a read element. An accurate resistance measurement of an MR sensor in a read element may then be determined by subtracting the lead resistance.
    • 公开了用于测试读取元件中的磁阻(MR)传感器的电阻的测试方法和组件。 在具有第一测试导线,测试MR传感器和第二测试导线的晶片上制造测试部件。 测试引线和测试MR传感器采用与晶片上的读取元件的第一屏蔽,MR传感器和第二屏蔽类似的工艺制造。 然而,测试MR传感器的制造面积大于读取元件中MR传感器的面积。 测试MR传感器的较大面积导致测试MR传感器的电阻与引线电阻相比不显着。 因此,测试部件的电阻测量表示读取元件的引线电阻。 然后可以通过减去引线电阻来确定读取元件中的MR传感器的精确电阻测量。