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    • 1. 发明授权
    • P-I-N MOSFET for ULSI applications
    • P-I-N MOSFET用于ULSI应用
    • US5432366A
    • 1995-07-11
    • US70715
    • 1993-05-28
    • Sanjay K. BanerjeeSuryanarayana BhattacharyaWilliam T. Lynch
    • Sanjay K. BanerjeeSuryanarayana BhattacharyaWilliam T. Lynch
    • H01L21/336H01L29/10H01L29/78
    • H01L29/66477H01L29/1045H01L29/41783H01L29/66583H01L29/66537
    • A MOSFET device for ULSI circuits includes a semiconductor body having first and second spaced doped regions of a first conductivity type which function as source and drain regions, a third doped region between the first and second regions of a second conductivity type, and a first intrinsic region between the third doped region and the drain region, a channel of said MOSFET device including the third doped region and said first intrinsic region. Preferably the device further includes a second intrinsic region between the third doped region and the source region, the channel region of the MOSFET device including the third doped region, the first intrinsic region, and the second intrinsic region. The device further includes an insulating layer over the channel region and a gate electrode formed on the insulating layer over the channel region. A source electrode contact, the first doped region, and a drain electrode contact the second doped region. Several processes are described for fabricating the device.
    • 用于ULSI电路的MOSFET器件包括半导体本体,其具有第一和第二间隔的第一导电类型的掺杂区域,其作为源极和漏极区域,第二和第二导电类型的第一和第二区域之间的第三掺杂区域, 所述第三掺杂区域和所述漏极区域之间的区域,所述MOSFET器件的沟道包括所述第三掺杂区域和所述第一本征区域。 优选地,该器件还包括在第三掺杂区域和源极区域之间的第二本征区域,MOSFET器件的沟道区域包括第三掺杂区域,第一本征区域和第二本征区域。 该器件还包括在沟道区上的绝缘层和形成在沟道区上的绝缘层上的栅电极。 源电极接触,第一掺杂区和漏电极接触第二掺杂区。 描述了用于制造装置的几个过程。