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    • 2. 发明授权
    • Thermoplastic resin composition and use thereof
    • 热塑性树脂组合物及其用途
    • US5424104A
    • 1995-06-13
    • US178616
    • 1994-01-07
    • Yoshikatsu AmimotoFumitoshi IkejiriSanehiro YamamotoAkinori ToyotaKatunari NishimuraMasahiro KandaTetsuo Kato
    • Yoshikatsu AmimotoFumitoshi IkejiriSanehiro YamamotoAkinori ToyotaKatunari NishimuraMasahiro KandaTetsuo Kato
    • C08L51/06C08K5/49C08K5/524C08L77/00C08L77/06H01R13/46B29D22/00B29D23/00
    • C08L77/00
    • Disclosed is a thermoplastic resin composition comprising(A) an aromatic polyamide comprisingdicarboxylic acid units comprising 50-100 mol % of units derived from terephthalic acid, and 0-50 mol % of units derived from an aromatic dicarboxylic acid other than terephthalic acid and/or an aliphatic-dicarboxylic acid having 4-20 carbon atoms, anddiamine units derived from an aliphatic diamine and/or an alicyclic diamine,said aromatic polyamide having an intrinsic viscosity of 0.5-3.0 dl/g as measured in conc. sulfuric acid at 30.degree. C. and a melting point of higher than 300.degree. C.,(B) a graft modified .alpha.-olefin polymer, and/or a graft modified aromatic vinyl hydrocarbon/conjugated diene copolymer or hydrogenated product thereof, and(C) an aliphatic polyamide,wherein said thermoplastic resin composition comprises 10-80 parts by weight of the graft modified .alpha.-olefin polymer, and/or the graft modified aromatic vinyl hydrocarbon/conjugated diene copolymer or hydrogenated product thereof (B) and 5-80 parts by weight of the aliphatic polyamide (C), based on 100 parts by weight of the aromatic polyamide (A).
    • 公开了一种热塑性树脂组合物,其包含(A)包含二羧酸单元的芳族聚酰胺,所述二羧酸单元包含50-100摩尔%的由对苯二甲酸衍生的单元,以及0-50摩尔%的衍生自除对苯二甲酸之外的芳族二羧酸的单元和/ 或具有4-20个碳原子的脂族二羧酸,以及衍生自脂族二胺和/或脂环族二胺的二胺单元,所述芳族聚酰胺的特性粘度为浓度为0.5-3.0dl / g。 硫酸在30℃,熔点高于300℃,(B)接枝改性的α-烯烃聚合物和/或接枝改性的芳族乙烯基烃/共轭二烯共聚物或其氢化产物和( C)脂肪族聚酰胺,其中所述热塑性树脂组合物包含10-80重量份的接枝改性的α-烯烃聚合物和/或接枝改性的芳族乙烯基烃/共轭二烯共聚物或其氢化产物(B)和5- 基于100重量份的芳族聚酰胺(A),80重量份的脂肪族聚酰胺(C)。
    • 3. 发明授权
    • Connector molding composition comprising an impact modified and
stabilized polyester
    • 连接器成型组合物包含冲击改性和稳定的聚酯
    • US5442000A
    • 1995-08-15
    • US155695
    • 1993-11-23
    • Tetsuo KatoMasahiro Kanda
    • Tetsuo KatoMasahiro Kanda
    • C08K5/13C08K5/37C08L25/12C08L51/00C08L67/00C08L67/02H01B3/42H01R13/46C08L51/06C08L55/00
    • H01B3/422C08L67/02C08L25/12C08L51/003H01R13/46
    • A connector comprising a housing comprising a polybutylene terephthalate resin composition comprising:(A) 100 parts by weight of a polybutylene terephthalate resin having an intrinsic viscosity of from 1.10 to 1.30 dl/g as measured in o-chlorophenol at 25.degree. C.;(B) from 40 to 60 parts by weight of a copolymer of acrylonitrile and styrene;(C) from 10 to 20 parts by weight of a graft copolymer comprising:(C1) from 65 to 75% by weight of copolymer comprising from 75 to 85% by weight of ethylene and from 25 to 15% by weight of glycidyl methacrylate, and(C2) from 25 to 35% by weight of a copolymer of acrylonitrile and styrene;(D) from 0.05 to 0.5 part by weight of a hindered phenol compound represented by formula (I): ##STR1## (E) from 0.05 to 0.5 part by weight of a thioether compound represented by the following formula (II):(R.sub.3 SR.sub.4 COOCH.sub.2).sub.m C(CH.sub.2 OH).sub.4-m (II)wherein the variables are defined in the specification.
    • 一种连接器,包括包含聚对苯二甲酸丁二醇酯树脂组合物的壳体,其包含:(A)在邻氯代苯酚中在25℃下测量的100重量份的特性粘度为1.10至1.30dl / g的聚对苯二甲酸丁二醇酯树脂。 (B)40〜60重量份的丙烯腈和苯乙烯的共聚物; (C)10至20重量份的接枝共聚物,其包含:(C1)65至75重量%的共聚物,其包含75至85重量%的乙烯和25至15重量%的甲基丙烯酸缩水甘油酯, 和(C2)25至35重量%的丙烯腈和苯乙烯的共聚物; (D)0.05至0.5重量份由式(I)表示的受阻酚化合物:(I)(E)0.05至0.5重量份由下式(II)表示的硫醚化合物 :(R3SR4​​COOCH2)mC(CH2OH)4-m(II)其中变量在说明书中定义。
    • 4. 发明授权
    • Connector
    • 连接器
    • US5336540A
    • 1994-08-09
    • US997318
    • 1992-12-28
    • Tetsuo KatoMasahiro KandaTatsuo TsumiyamaSatoru Nakamoto
    • Tetsuo KatoMasahiro KandaTatsuo TsumiyamaSatoru Nakamoto
    • C08L23/26C08L51/06C08L77/00C08L77/06H01R13/46H01R13/533C09L77/10
    • H01R13/46C08L51/06C08L77/00C08L77/06Y10T428/1397
    • A connector comprising a housing comprising a resin composition comprising:(A) from 50 to 95 parts by weight of a semi-aromatic polyamide comprising (A1) an adipate of hexamethylenediamine and (A2) a terephthalate of hexamethylenediamine, where the weight ratio of the adipate of hexamethylenediamine (A1) to the terephthalate of hexamethylenediamine (A2) is from 80/20 to 50/50; and(B) from 5 to 50 parts by weight of a modified polyolefin comprising (B1) a polyolefin copolymer comprising (B11) propylene and (B12) ethylene where the molar ratio of propylene (B11) to ethylene (B12) is from 90/10 to 99/1, the polyolefin copolymer (B1) being graft-modified with (B2) from 0.05 to 5 parts by weight of an .alpha.,.beta.-unsaturated carboxylic acid, an anhydride thereof, or a derivative thereof per 100 parts by weight of the polyolefin copolymer (B1).
    • 一种连接器,包括包含树脂组合物的壳体,所述树脂组合物包含:(A)50至95重量份的半芳族聚酰胺,其包含(A1)己二胺的己二酸酯和(A2)六亚甲基二胺的对苯二甲酸酯,其中重量比 六亚甲基二胺(A1)的己二酸酯与己二胺(A2)的对苯二甲酸酯的摩尔比为80/20〜50/50; 和(B)5至50重量份的改性聚烯烃,其包含(B1)包含(B11)丙烯和(B12)乙烯的聚烯烃共聚物,其中丙烯(B11)与乙烯(B12)的摩尔比为90 / 10〜99/1,聚烯烃共聚物(B1)用(B2)接枝改性为0.05〜5重量份的α,β-不饱和羧酸,其酸酐或其衍生物,每100重量份 的聚烯烃共聚物(B1)。
    • 9. 发明授权
    • Semiconductor laser module
    • 半导体激光模块
    • US5974065A
    • 1999-10-26
    • US819009
    • 1997-03-17
    • Masahiro Kanda
    • Masahiro Kanda
    • G02B6/32G02B6/42H01S5/00H01S5/022H01S5/024H01S3/18G02B6/36H01S3/04
    • H01S5/02284G02B6/4245G02B6/4271G02B6/4204G02B6/4237H01S5/02415
    • A semiconductor laser module includes a flat board, a semiconductor laser, a lens, an optical fiber, a lens holder, an electronic cooling element, and support rods. The semiconductor laser is mounted on the board, and the laser emit a laser beam. The lens focuses the laser beam from the semiconductor laser. The optical fiber is optically coupled to the lens to receive the laser beam emitted from the semiconductor laser and focused by the lens. The lens holder holds the lens on the optical axis of the semiconductor laser. The electronic cooling element adjusts the temperature of the semiconductor laser, and the board is fixed to the upper surface of the electronic cooling element. The support rods support the lens holder at a position opposing a light-exit end face of the board.
    • 半导体激光器模块包括平板,半导体激光器,透镜,光纤,透镜架,电子冷却元件和支撑杆。 半导体激光器安装在板上,激光器发射激光束。 透镜对来自半导体激光器的激光束进行聚焦。 光纤光学耦合到透镜以接收从半导体激光器发射并由透镜聚焦的激光束。 透镜架将透镜保持在半导体激光器的光轴上。 电子冷却元件调节半导体激光器的温度,并且板固定到电子冷却元件的上表面。 支撑杆将透镜架支撑在与板的光出射端面相对的位置。