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    • 1. 发明授权
    • Connector
    • 连接器
    • US5336540A
    • 1994-08-09
    • US997318
    • 1992-12-28
    • Tetsuo KatoMasahiro KandaTatsuo TsumiyamaSatoru Nakamoto
    • Tetsuo KatoMasahiro KandaTatsuo TsumiyamaSatoru Nakamoto
    • C08L23/26C08L51/06C08L77/00C08L77/06H01R13/46H01R13/533C09L77/10
    • H01R13/46C08L51/06C08L77/00C08L77/06Y10T428/1397
    • A connector comprising a housing comprising a resin composition comprising:(A) from 50 to 95 parts by weight of a semi-aromatic polyamide comprising (A1) an adipate of hexamethylenediamine and (A2) a terephthalate of hexamethylenediamine, where the weight ratio of the adipate of hexamethylenediamine (A1) to the terephthalate of hexamethylenediamine (A2) is from 80/20 to 50/50; and(B) from 5 to 50 parts by weight of a modified polyolefin comprising (B1) a polyolefin copolymer comprising (B11) propylene and (B12) ethylene where the molar ratio of propylene (B11) to ethylene (B12) is from 90/10 to 99/1, the polyolefin copolymer (B1) being graft-modified with (B2) from 0.05 to 5 parts by weight of an .alpha.,.beta.-unsaturated carboxylic acid, an anhydride thereof, or a derivative thereof per 100 parts by weight of the polyolefin copolymer (B1).
    • 一种连接器,包括包含树脂组合物的壳体,所述树脂组合物包含:(A)50至95重量份的半芳族聚酰胺,其包含(A1)己二胺的己二酸酯和(A2)六亚甲基二胺的对苯二甲酸酯,其中重量比 六亚甲基二胺(A1)的己二酸酯与己二胺(A2)的对苯二甲酸酯的摩尔比为80/20〜50/50; 和(B)5至50重量份的改性聚烯烃,其包含(B1)包含(B11)丙烯和(B12)乙烯的聚烯烃共聚物,其中丙烯(B11)与乙烯(B12)的摩尔比为90 / 10〜99/1,聚烯烃共聚物(B1)用(B2)接枝改性为0.05〜5重量份的α,β-不饱和羧酸,其酸酐或其衍生物,每100重量份 的聚烯烃共聚物(B1)。
    • 4. 发明授权
    • Thermoplastic resin composition and use thereof
    • 热塑性树脂组合物及其用途
    • US5424104A
    • 1995-06-13
    • US178616
    • 1994-01-07
    • Yoshikatsu AmimotoFumitoshi IkejiriSanehiro YamamotoAkinori ToyotaKatunari NishimuraMasahiro KandaTetsuo Kato
    • Yoshikatsu AmimotoFumitoshi IkejiriSanehiro YamamotoAkinori ToyotaKatunari NishimuraMasahiro KandaTetsuo Kato
    • C08L51/06C08K5/49C08K5/524C08L77/00C08L77/06H01R13/46B29D22/00B29D23/00
    • C08L77/00
    • Disclosed is a thermoplastic resin composition comprising(A) an aromatic polyamide comprisingdicarboxylic acid units comprising 50-100 mol % of units derived from terephthalic acid, and 0-50 mol % of units derived from an aromatic dicarboxylic acid other than terephthalic acid and/or an aliphatic-dicarboxylic acid having 4-20 carbon atoms, anddiamine units derived from an aliphatic diamine and/or an alicyclic diamine,said aromatic polyamide having an intrinsic viscosity of 0.5-3.0 dl/g as measured in conc. sulfuric acid at 30.degree. C. and a melting point of higher than 300.degree. C.,(B) a graft modified .alpha.-olefin polymer, and/or a graft modified aromatic vinyl hydrocarbon/conjugated diene copolymer or hydrogenated product thereof, and(C) an aliphatic polyamide,wherein said thermoplastic resin composition comprises 10-80 parts by weight of the graft modified .alpha.-olefin polymer, and/or the graft modified aromatic vinyl hydrocarbon/conjugated diene copolymer or hydrogenated product thereof (B) and 5-80 parts by weight of the aliphatic polyamide (C), based on 100 parts by weight of the aromatic polyamide (A).
    • 公开了一种热塑性树脂组合物,其包含(A)包含二羧酸单元的芳族聚酰胺,所述二羧酸单元包含50-100摩尔%的由对苯二甲酸衍生的单元,以及0-50摩尔%的衍生自除对苯二甲酸之外的芳族二羧酸的单元和/ 或具有4-20个碳原子的脂族二羧酸,以及衍生自脂族二胺和/或脂环族二胺的二胺单元,所述芳族聚酰胺的特性粘度为浓度为0.5-3.0dl / g。 硫酸在30℃,熔点高于300℃,(B)接枝改性的α-烯烃聚合物和/或接枝改性的芳族乙烯基烃/共轭二烯共聚物或其氢化产物和( C)脂肪族聚酰胺,其中所述热塑性树脂组合物包含10-80重量份的接枝改性的α-烯烃聚合物和/或接枝改性的芳族乙烯基烃/共轭二烯共聚物或其氢化产物(B)和5- 基于100重量份的芳族聚酰胺(A),80重量份的脂肪族聚酰胺(C)。
    • 6. 发明授权
    • Connector molding composition comprising an impact modified and
stabilized polyester
    • 连接器成型组合物包含冲击改性和稳定的聚酯
    • US5442000A
    • 1995-08-15
    • US155695
    • 1993-11-23
    • Tetsuo KatoMasahiro Kanda
    • Tetsuo KatoMasahiro Kanda
    • C08K5/13C08K5/37C08L25/12C08L51/00C08L67/00C08L67/02H01B3/42H01R13/46C08L51/06C08L55/00
    • H01B3/422C08L67/02C08L25/12C08L51/003H01R13/46
    • A connector comprising a housing comprising a polybutylene terephthalate resin composition comprising:(A) 100 parts by weight of a polybutylene terephthalate resin having an intrinsic viscosity of from 1.10 to 1.30 dl/g as measured in o-chlorophenol at 25.degree. C.;(B) from 40 to 60 parts by weight of a copolymer of acrylonitrile and styrene;(C) from 10 to 20 parts by weight of a graft copolymer comprising:(C1) from 65 to 75% by weight of copolymer comprising from 75 to 85% by weight of ethylene and from 25 to 15% by weight of glycidyl methacrylate, and(C2) from 25 to 35% by weight of a copolymer of acrylonitrile and styrene;(D) from 0.05 to 0.5 part by weight of a hindered phenol compound represented by formula (I): ##STR1## (E) from 0.05 to 0.5 part by weight of a thioether compound represented by the following formula (II):(R.sub.3 SR.sub.4 COOCH.sub.2).sub.m C(CH.sub.2 OH).sub.4-m (II)wherein the variables are defined in the specification.
    • 一种连接器,包括包含聚对苯二甲酸丁二醇酯树脂组合物的壳体,其包含:(A)在邻氯代苯酚中在25℃下测量的100重量份的特性粘度为1.10至1.30dl / g的聚对苯二甲酸丁二醇酯树脂。 (B)40〜60重量份的丙烯腈和苯乙烯的共聚物; (C)10至20重量份的接枝共聚物,其包含:(C1)65至75重量%的共聚物,其包含75至85重量%的乙烯和25至15重量%的甲基丙烯酸缩水甘油酯, 和(C2)25至35重量%的丙烯腈和苯乙烯的共聚物; (D)0.05至0.5重量份由式(I)表示的受阻酚化合物:(I)(E)0.05至0.5重量份由下式(II)表示的硫醚化合物 :(R3SR4​​COOCH2)mC(CH2OH)4-m(II)其中变量在说明书中定义。
    • 8. 发明申请
    • Waterproof packing, waterproof connector using the same and process for producing waterproof connector
    • 防水包装,使用相同的防水连接器和生产防水连接器的工艺
    • US20060240710A1
    • 2006-10-26
    • US11399475
    • 2006-04-07
    • Tetsuo KatoKazuki Zaitsu
    • Tetsuo KatoKazuki Zaitsu
    • H01R13/40
    • H01R13/5205
    • A waterproof packing includes: a core member including an electric wire passing part inside and a contacting part for fitting to a mounting side outside; and thermoplastic adhesive adhering to at least the electric wire passing part and the contacting part, wherein the waterproof packing adheres to an electric wire with the thermoplastic adhesive of the electric wire passing part and the waterproof packing adheres to the mounting side with the thermoplastic adhesive of the contacting part by heating. A waterproof connector includes: the waterproof packing; a connector housing for inserting an electric wire having a terminal therein; and a packing receiving part of the connector housing, wherein the waterproof packing is inserted in the packing receiving part as the mounting side.
    • 防水包装包括:包括电线通过部分的芯部件和用于装配到安装侧的接触部分; 以及至少粘附在电线通过部分和接触部分上的热塑性粘合剂,其中防水填料与电线通过部分的热塑性粘合剂和防水填料粘合到电线上,其中热塑性粘合剂 接触部分通过加热。 防水接头包括:防水包装; 用于将具有端子的电线插入其中的连接器壳体; 以及连接器壳体的填料接收部分,其中防水密封件作为安装侧插入到填料接收部分中。
    • 10. 发明授权
    • Semiconductor memory device capable of adjusting internal parameter
    • 半导体存储器能够调整内部参数
    • US06424593B1
    • 2002-07-23
    • US09811580
    • 2001-03-20
    • Shigehiro KugeTetsuo Kato
    • Shigehiro KugeTetsuo Kato
    • G11C800
    • G11C7/109G11C7/1078G11C11/4093G11C2207/2254
    • Internal parameter control signal generating units generate internal parameter control signals for adjusting internal parameters of a semiconductor memory device. Each internal parameter control signal generating unit includes an anti-fuse element formed with a data holding capacitor of a memory cell. The anti-fuse element is blown with application of a high voltage according to a parameter adjustment signal to break down a dielectric film and then, act as a resistance element. The internal parameter control signal generating unit sets a signal level of a corresponding internal parameter control signal in a non-volatile manner according to the presence or absence of a blowing input to the anti-fuse element.
    • 内部参数控制信号发生单元产生用于调整半导体存储器件的内部参数的内部参数控制信号。 每个内部参数控制信号产生单元包括由存储单元的数据保持电容器形成的反熔丝元件。 根据参数调整信号,通过施加高电压来对抗熔丝元件进行熔断,分解电介质膜,然后作为电阻元件。 内部参数控制信号生成部,根据是否存在向反熔丝元件的吹入输入,以非易失的方式设定相应的内部参数控制信号的信号电平。