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    • 5. 发明授权
    • Bipolar transistor and method of manufacturing the same
    • 双极晶体管及其制造方法
    • US4780427A
    • 1988-10-25
    • US104544
    • 1987-09-29
    • Tetsushi SakaiYoshiji Kobayashi
    • Tetsushi SakaiYoshiji Kobayashi
    • H01L29/73H01L21/033H01L21/225H01L21/331H01L23/532H01L29/417H01L29/732H01L29/70
    • H01L29/66272H01L21/033H01L21/2257H01L23/53271H01L29/41708H01L2924/0002
    • A bipolar transistor includes collector, base and emitter regions. The collector region consists of a first semiconductor region of a first conductivity type and formed in contact with a surface of a semiconductor layer. The base region consists of a second semiconductor region of a second conductivity type formed within the collector region to be in contact with the surface of the semiconductor layer. The emitter region consists of a third semiconductor region of the first conductivity type formed within the base region to be in contact with the surface of the semiconductor layer. The transistor also includes collector, base, and emitter electrodes. The collector and base electrodes are connected to the collector and base regions at opposite edges of a single opening formed in a field insulating film covering the surface of the semiconductor layer. The collector and base electrodes consist of a conductor. The emitter electrode is connected to the emitter region and consists of a conductor. The transistor further includes first and second insulating interlayers. The first insulating interlayer is formed between the collector and emitter electrodes. The second insulating interlayer is formed between the emitter and base electrodes. A distance between the collector and emitter electrodes on the surface of the semiconductor layer is substantially the same as that between the emitter and base electrodes.
    • 双极晶体管包括集电极,基极和发射极区域。 集电极区域由第一导电类型的第一半导体区域和半导体层的表面形成。 基极区域由形成在集电区域内的第二导电类型的第二半导体区域构成,以与半导体层的表面接触。 发射极区由第一导电类型的第三半导体区域形成在基极区内,以与半导体层的表面接触。 晶体管还包括集电极,基极和发射极。 集电体和基极电极在覆盖半导体层的表面的场绝缘膜中形成的单个开口的相对边缘处连接到集电极和基极区域。 集电极和基极由导体组成。 发射极电极连接到发射极区域,由导体组成。 晶体管还包括第一和第二绝缘夹层。 在集电极和发射极之间形成第一绝缘中间层。 第二绝缘中间层形成在发射极和基极之间。 半导体层表面上的集电极和发射极之间的距离基本上与发射极和基极之间的距离相同。
    • 7. 发明申请
    • Semiconductor substrate, semiconductor device and process for producing semiconductor substrate
    • 半导体衬底,半导体器件和用于制造半导体衬底的工艺
    • US20070126034A1
    • 2007-06-07
    • US10574835
    • 2004-10-04
    • Tetsushi SakaiShunichiro OhmiTakashi Yamazaki
    • Tetsushi SakaiShunichiro OhmiTakashi Yamazaki
    • H01L29/76
    • H01L29/78648H01L21/76283H01L21/823412H01L21/84H01L27/1203H01L29/78603H01L29/78606
    • An opening 35 is formed on an assembly having a silicon germanium layer 32, a silicon layer 33, and a silicon oxide layer 34 sequentially formed on a silicon basis material 31. An additional silicon oxide layer 36 is formed so as to cover the silicon oxide layer 34 and an inner surface of the opening 35. Then, the silicon germanium layer 32 is removed by etching, and a thermal oxidation treatment and an annealing treatment are sequentially performed on the silicon basis material 31 and the silicon layer 33 to form thermal oxidation layers 37 and 38. Then, a flat film 39 is formed for flat treatment to manufacture a semiconductor substrate 10 having an island part 12 made of silicon buried in an component 13 made of silicon oxide. This allows for easily forming a high-insulation integration CMOSLSI based on inter-element isolation, and sufficiently reducing the SOI layer and the BOX layer in thickness, thereby preventing the short channel effect as well as forming the SOI layer and the BOX layer in multi-layers.
    • 在硅基材31上依次形成有硅锗层32,硅层33和氧化硅层34的组件上形成开口35。 形成另外的氧化硅层36以覆盖氧化硅层34和开口35的内表面。 然后,通过蚀刻去除硅锗层32,并且在硅基材料31和硅层33上依次进行热氧化处理和退火处理,以形成热氧化层37和38。 然后,形成平坦的膜39,用于平坦处理,以制造半导体衬底10,该半导体衬底10具有埋入由氧化硅制成的部件13中的由硅制成的岛部分12。 这允许容易地形成基于元件间隔离的高绝缘集成CMOSLSI,并且使SOI层和BOX层的厚度充分降低,从而防止短沟道效应以及多层SOI层和BOX层的形成 地板