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1. 发明授权

US10770320B2 Universal chip batch-bonding apparatus and method 有权
公开(公告)号：US10770320B2
公开(公告)日：2020-09-08
申请号：US16338673
申请日：2017-09-26
申请人： SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
发明人： Song Guo , Yuebin Zhu , Feibiao Chen , Hai Xia
IPC分类号： H01L21/67 , H01L23/00
摘要： A universal chip batch-bonding apparatus and method. The apparatus comprises a material pick-and-place area and a transfer work area. The material pick-and-place area comprises a blue tape pick-and-place area (110) for providing a chip (113) and a substrate pick-and-place area (120) for placing a substrate (123), the blue tape pick-and-place area (110) and the substrate pick-and-place area (120) being separately arranged at two ends of the transfer work area. The transfer work area sequentially comprises a chip pickup and separation area (210), a chip alignment and fine-tuning area (220), and a chip batch-bonding area (230) in a direction running from the blue tape pick-and-place area (110) to the substrate pick-and-place area (120). A chip carrier transfer apparatus (300) is provided in the transfer work area, and the chip carrier transfer apparatus (300) passes through the transfer work area and is used to move and supply materials among the chip pickup and separation area (210), the chip alignment and fine-tuning area (220), and the chip batch-bonding area (230). By means of a compatible design, the apparatus is suitable for both die-up and die-down attachment modes, expanding the application scope of the apparatus. In addition, the modular design can be configured according to requirements, increasing market potential.

2. 发明授权

US10353297B2 Moving platform device, exposure device and lithography machine 有权
公开(公告)号：US10353297B2
公开(公告)日：2019-07-16
申请号：US16067302
申请日：2016-12-28
申请人： SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
发明人： Lili Ge , Yuebin Zhu
IPC分类号： G03F7/20 , H01L21/677
摘要： A motion stage device, an exposure device and a lithography machine are disclosed. The motion stage device includes: Y-direction motors (203), a mover of each Y-direction motor (203) movable in a horizontal Y-direction; X-direction motors provided on X-direction guide rails (105), the X-direction guide rails (105) is in connection with the movers of the Y-direction motors (203) and movable in the horizontal Y-direction under actuation of the Y-direction motors (203), the X-direction motors having movers (107b) movable in a horizontal X-direction; an inner frame (102), supporting the X-direction guide rails (105); and a motion stage (108, 106), disposed on the movers (107b) of the X-direction motor. This motion stage device possesses improved modal and vibration characteristics because of a reduced load on the Y-direction motors (203). Additionally, the X-direction guide rails (105) are in non-contact connection with the inner frame (102) and thus will not pose significant vibration-causing impacts on the inner frame (102). This allows stable movement and improved control accuracy.

3. 发明授权

US11037900B2 Chip bonding device and bonding method thereof 有权
公开(公告)号：US11037900B2
公开(公告)日：2021-06-15
申请号：US16312834
申请日：2017-06-22
申请人： SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
发明人： Song Guo , Jianqi Sun , Feibiao Chen , Yuebin Zhu , Tianming Wang , Hai Xia
IPC分类号： H01L21/677 , H01L23/00 , H01L21/67 , H01L21/68 , H01L21/687
摘要： A chip bonding apparatus and method are disclosed. The chip bonding apparatus includes: at least one separation module for separating chips; at least one bonding module for bonding the chips a substrate; a transportation device for transporting the chips between the separation module and the bonding module, the transportation device including one or more guide tracks and one or more transportation carriers for retaining the chips, each of the guide tracks is provided thereon with at least one of the transportation carriers; and a control device for individually controlling the separation module, the bonding module and the transportation device. The chip bonding apparatus and method allows pickup, transportation and chip-to-substrate bonding of chips in batches with increased chip bonding yield and improved chip bonding accuracy.

4. 发明授权

US10691025B2 Reaction force diversion mechanism, motor device and photolithography machine 有权
公开(公告)号：US10691025B2
公开(公告)日：2020-06-23
申请号：US16024200
申请日：2018-06-29
申请人： SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
发明人： Baoliang Wang , Fuqiang Yang , Yuebin Zhu
IPC分类号： G03B27/54 , G03F7/20
摘要： A reaction force diversion mechanism, a motor device and a photolithography machine are disclosed. The photolithography machine includes an illumination unit, a mask stage, a projection objective, a main baseplate, a wafer stage and a main carrier frame. The illumination unit and the mask stage are disposed above the main baseplate, and the main carrier frame is arranged above a ground base. Both of the wafer stage and the main baseplate are supported on the main carrier frame, and vibration dampers are deployed between the main carrier frame and the ground base. Reaction force diversion mechanisms are disposed between the wafer stage and the ground base and between the mask stage and the ground base. The reaction force diversion mechanisms can divert reaction forces generated from movement of the two motion stages onto the ground base while blocking vibration propagating from the ground base toward the motion stages.

5. 发明授权

US11081380B2 Chip bonding device 有权
公开(公告)号：US11081380B2
公开(公告)日：2021-08-03
申请号：US16489198
申请日：2018-02-27
申请人： SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
发明人： Feibiao Chen , Hai Xia , Yuebin Zhu , Hailin Cheng , Xiaoyu Jiang , Lili Zhao , Donghao Zhang
IPC分类号： H01L21/68 , B65G47/91 , H01L21/677 , H01L21/683 , H01L21/67
摘要： A chip bonding apparatus includes a chip separation unit, a chip alignment unit, a chip bonding unit and a bonding robotic arm unit. The bonding robotic arm unit includes a first bonding robotic arm unit and a second bonding robotic arm unit. The first bonding robotic arm unit includes a first motion stage, a first driver configured to drive the first motion stage and at least one first bonding robotic arm arranged on the first motion stage. The first bonding robotic arm is configured to suck up a chip from the chip separation unit and deliver it to the chip alignment unit. The second bonding robotic arm unit includes a second motion stage, a second driver configured to drive the second motion stage and at least one second bonding robotic arm arranged on the second motion stage.

6. 发明授权

US10748800B2 Chip bonding apparatus and method 有权
公开(公告)号：US10748800B2
公开(公告)日：2020-08-18
申请号：US16080376
申请日：2017-02-27
申请人： SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
发明人： Yuebin Zhu , Feibiao Chen , Hai Xia , Bin Yu , Song Guo , Yaping Ge
IPC分类号： H01L21/68 , H01L21/67 , H01L21/683 , H01L23/00 , H01L21/687
摘要： A chip bonding device is disclosed, including a first motion stage (110), a second motion stage (200), a chip pickup element (160), a transfer carrier (170), a chip adjustment system (1000), a bonding stage (420) and a control system (500). A chip bonding method is also disclosed, in which a set of chips are temporarily retained on the transfer carrier (170) and their positions on the transfer carrier (170) are accurately adjusted by using the chip adjustment system (1000), followed by bonding the chips on the transfer carrier (170) simultaneously onto the substrate (430). With this batch bonding approach, flip-chips can be bonded with greatly enhanced efficiency. Moreover, picking up and bonding chips in batches can balance times for chip picking up, fine chip position tuning and chip bonding, thereby ensuring high bonding accuracy while increasing the throughput.

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