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1. 发明授权

US11037900B2 Chip bonding device and bonding method thereof 有权
公开(公告)号：US11037900B2
公开(公告)日：2021-06-15
申请号：US16312834
申请日：2017-06-22
申请人： SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
发明人： Song Guo , Jianqi Sun , Feibiao Chen , Yuebin Zhu , Tianming Wang , Hai Xia
IPC分类号： H01L21/677 , H01L23/00 , H01L21/67 , H01L21/68 , H01L21/687
摘要： A chip bonding apparatus and method are disclosed. The chip bonding apparatus includes: at least one separation module for separating chips; at least one bonding module for bonding the chips a substrate; a transportation device for transporting the chips between the separation module and the bonding module, the transportation device including one or more guide tracks and one or more transportation carriers for retaining the chips, each of the guide tracks is provided thereon with at least one of the transportation carriers; and a control device for individually controlling the separation module, the bonding module and the transportation device. The chip bonding apparatus and method allows pickup, transportation and chip-to-substrate bonding of chips in batches with increased chip bonding yield and improved chip bonding accuracy.

2. 发明授权

US10658327B1 Chip bonding apparatus and bonding method 有权
公开(公告)号：US10658327B1
公开(公告)日：2020-05-19
申请号：US16338260
申请日：2017-09-26
申请人： SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
发明人： Tianming Wang , Xiaoyu Jiang , Hai Xia , Feibiao Chen
IPC分类号： H01L23/00
摘要： Provided are a chip bonding apparatus and bonding method. The apparatus comprises: a chip supply unit (10); a substrate supply unit (20); a first pick-up assembly (30) arranged between the chip supply unit (10) and the substrate supply unit (20), comprising a first rotating component and a first pick-up head arranged on the first rotating component; a second pick-up assembly (40) comprising a second rotating component and a second pick-up head arranged on the second rotating component, wherein the first pick-up assembly (30) picks up a chip (60) from the chip supply unit (10) or the second pick-up assembly (40), and delivers the chip (60) onto a substrate of the substrate supply unit (20) to complete the bonding; and a vision unit (50) for realizing the alignment of the chip (60) and the substrate on the first pick-up assembly (30), wherein the chip supply unit (10), the substrate supply unit (20), the second pick-up assembly (40) and the vision unit (50) are respectively located on four work positions of the first pick-up head. The chip (60) is transported through rotation, improving the productivity of chip (60) bonding; and the chip (60) is reversed by utilizing the second pick-up assembly (40), which is compatible with two ways of bonding, i.e. a mark face of the chip (60) facing upwards and downwards.

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