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1. 发明申请

US20190115224A1 SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD 审中-公开
公开(公告)号：US20190115224A1
公开(公告)日：2019-04-18
申请号：US16158728
申请日：2018-10-12
申请人： SEMES CO., LTD.
发明人： Youngil LEE , Jungbong CHOI , Seungho LEE , Gui Su PARK , Gil Hun SONG , Seung Hoon OH , Jonghan KIM
IPC分类号： H01L21/311 , H01L21/306 , H01L21/02 , H01L21/67
摘要： A substrate treating apparatus and a substrate treating method are provided. The substrate treating apparatus includes a support member to support a substrate, a treatment liquid nozzle to supply a treatment liquid to the substrate positioned on the support member, and a controller to control the treatment liquid nozzle such that the treatment liquid supplied to the substrate is differently discharged in a low-flow-supply section and a high-flow-supply section in which an average discharge amount per hour is more than an average discharge amount per hour in the low-flow-supply section.

2. 发明公开

US20240216940A1 APPARATUS AND METHOD FOR TREATING SUBSTRATE 审中-公开
公开(公告)号：US20240216940A1
公开(公告)日：2024-07-04
申请号：US18342797
申请日：2023-06-28
申请人： SEMES CO., LTD.
发明人： Jun Young CHOI , Gui Su PARK , Young Jin JANG , Eun Jung LEE , Jun Hyun LIM
IPC分类号： B05C9/06 , B05C11/10 , B05C13/02 , B05D1/22
CPC分类号： B05C9/06 , B05C11/1042 , B05C13/02 , B05D1/22
摘要： The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a liquid treating chamber; a support configured to support a substrate within the liquid treating chamber; a first treating liquid supply unit configured to supply a first treating liquid to the liquid treating chamber to treat the substrate with the first treating liquid; and a second treating liquid supply unit configured to supply a second treating liquid to the liquid treating chamber to treat the substrate with the second treating liquid, and wherein the second treating liquid supply unit includes a cooler for cooling the second treating liquid.

3. 发明申请

US20210050235A1 SUPPORT UNIT, SUBSTRATE TREATING APPARATUS INCLUDING THE SAME, AND SUBSTRATE TREATING METHOD 有权
公开(公告)号：US20210050235A1
公开(公告)日：2021-02-18
申请号：US16986418
申请日：2020-08-06
申请人： SEMES CO., LTD.
发明人： Kangseop YUN , Seung Hoon OH , Ye Jin CHOI , Youngil LEE , Byungsun BANG , Jungbong CHOI , Gui Su PARK
IPC分类号： H01L21/67 , H01L21/687
摘要： The inventive concept provides a support unit for supporting a substrate. The support unit includes a support plate that has an interior space and on which the substrate is placed, a heating member that is provided in the interior space and that heats the substrate placed on the support plate, a heat insulating plate provided in the interior space and disposed under the heating member, a reflective plate provided in the interior space and disposed under the heat insulating plate, and a heat dissipation plate provided in the interior space and disposed under the a reflective plate.

4. 发明申请

US20210008606A1 FLUID SUPPLY UNIT AND SUBSTRATE TREATING APPARATUS HAVING THE SAME 有权
公开(公告)号：US20210008606A1
公开(公告)日：2021-01-14
申请号：US16924633
申请日：2020-07-09
申请人： SEMES CO., LTD.
发明人： Inhwang PARK , Gui Su PARK , Young Hun LEE , Youngseop CHOI , Seung Hoon OH , Jonghyeon WOO , Jin Mo JAE
IPC分类号： B08B7/00 , H01L21/67
摘要： An apparatus for treating a substrate includes a process chamber having a treatment space for treating the substrate; a fluid supply unit for supplying fluid to the treatment space, wherein the fluid supply unit includes: a supply pipe connected to the treatment space to supply the fluid to the treatment space; a pump installed in the supply pipe to provide flow pressure to the fluid; a vent line installed between the pump and the process chamber to discharge pressure in the fluid to an outside; a relief valve installed in the vent line to open and close the vent line; and a reservoir installed between the pump and a branch point wherein the vent line branches from the supply pipe, wherein the reservoir has a cross-sectional area larger than a cross-sectional area of a portion of the supply pipe located between the pump and the branch point.

5. 发明公开

US20240222174A1 SUBSTRATE TRANSFERRING APPARATUS, AND LIQUID PROCESSING APPARATUS AND SUBSTRATE PROCESSING EQUIPMENT INCLUDING SAME 审中-公开
公开(公告)号：US20240222174A1
公开(公告)日：2024-07-04
申请号：US18395570
申请日：2023-12-24
申请人： SEMES CO., LTD.
发明人： Seul Gi CHOI , Jun Hyun LIM , Young Jin JANG , Eun Jung LEE , Hee Jun YOUN , Gui Su PARK
IPC分类号： H01L21/677 , H01L21/67
CPC分类号： H01L21/67712 , H01L21/67057 , H01L21/67706
摘要： Proposed is a substrate transferring apparatus, and a liquid processing apparatus and substrate processing equipment including the same, which prevent a pattern leaning phenomenon during a substrate processing process. The substrate transferring apparatus that transfers substrates between cleaning tanks in the batch-type liquid processing apparatus includes a rail extended on a ceiling of a first cleaning tank in which a first processing liquid is stored and a second cleaning tank in which a second processing liquid is stored, a crane moving along the rail, and a vessel configured to be moved vertically by the crane. The vessel may include a first sub vessel and a second sub vessel that combine with each other to form a space for accommodating a substrate immersed in the first processing liquid.

6. 发明申请

US20210022213A1 SUBSTRATE TREATING APPARATUS 有权
公开(公告)号：US20210022213A1
公开(公告)日：2021-01-21
申请号：US16932286
申请日：2020-07-17
申请人： SEMES CO., LTD.
发明人： Muhyeon LEE , Gui Su PARK , Byungsun BANG , Jungbong CHOI , Youngil LEE , Kangseop YUN , Seung Eun NA , Ye Jin CHOI , Kyounghwan KIM
IPC分类号： H05B3/00 , H05B3/06
摘要： An apparatus for treating a substrate includes a process chamber having a treatment space defined therein, a support unit for supporting the substrate in the treatment space, a liquid supply unit for supplying treating liquid to the substrate supported on the support unit, and a heating unit disposed in the support unit for heating the substrate supported on the support unit, wherein the heating unit includes a plurality of lamps to heat the substrate, and a window disposed above the lamps to transmit light emitted from the lamps, wherein the window includes a base in a form of a plate, and light adjustment means formed on the base to spread or converge light emitted from the lamps.

7. 发明申请

US20210013047A1 SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD 有权
公开(公告)号：US20210013047A1
公开(公告)日：2021-01-14
申请号：US17030514
申请日：2020-09-24
申请人： SEMES CO., LTD.
发明人： Youngil LEE , Jungbong CHOI , Seungho LEE , Gui Su PARK , Gil Hun SONG , Seung Hoon OH , Jonghan KIM
IPC分类号： H01L21/311 , H01L21/67 , H01L21/02 , H01L21/306 , H01L21/687
摘要： A substrate treating apparatus and a substrate treating method are provided. The substrate treating apparatus includes a support member to support a substrate, a treatment liquid nozzle to supply a treatment liquid to the substrate positioned on the support member, and a controller to control the treatment liquid nozzle such that the treatment liquid supplied to the substrate is differently discharged in a low-flow-supply section and a high-flow-supply section in which an average discharge amount per hour is more than an average discharge amount per hour in the low-flow-supply section.

8. 发明申请

US20160351430A1 APPARATUS FOR PROCESSING SUBSTRATE 审中-公开
标题翻译：加工基材的装置
公开(公告)号：US20160351430A1
公开(公告)日：2016-12-01
申请号：US15167414
申请日：2016-05-27
申请人： Semes Co., Ltd.
发明人： Daehun KIM , Gui Su PARK
IPC分类号： H01L21/677 , H01L21/67
CPC分类号： H01L21/67196 , H01L21/67173 , H01L21/67178 , H01L21/67742
摘要： An apparatus for processing a substrate includes a load port on that a substrate transfer container accommodating a substrate is laid, a processing part configured to process a substrate, and an index part including an index robot configured to carry a substrate between the substrate transfer container and the processing part, wherein the processing part includes a first transfer chamber configured to have a first main carrying robot carrying a substrate and disposed adjacent to the index part, a second transfer chamber configured to have a second main carrying robot carrying a substrate and disposed adjacent to the first transfer chamber, and a shuttle buffer part configured to move between the first transfer chamber and the second transfer chamber for transferring a substrate between the second main carrying robot and the index robot.
摘要翻译：一种用于处理衬底的装置包括：放置容纳衬底的衬底转移容器的负载端口，被配置为处理衬底的处理部分和包括索引机器人的指标部分，所述指标机构被配置为在衬底转移容器和处理部分，其中所述处理部分包括第一传送室，所述第一传送室被配置为具有携带基板的第一主携带机器人并且邻近所述索引部分设置;第二传送室，被配置为具有携带基板的第二主携带机器人并且邻近以及穿梭缓冲部分，其构造成在第一传送室和第二传送室之间移动，用于在第二主携带机器人和索引机器人之间传送基板。

9. 发明公开

US20240203761A1 SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING SYSTEM INCLUDING THE SAME 审中-公开
公开(公告)号：US20240203761A1
公开(公告)日：2024-06-20
申请号：US18391599
申请日：2023-12-20
申请人： SEMES CO., LTD.
发明人： Jun Young CHOI , Gui Su PARK , Young Jin JANG , Eun Jung LEE , Hee Jun YOUN
IPC分类号： H01L21/67
CPC分类号： H01L21/67086 , H01L21/67057
摘要： There are provided a substrate treating apparatus and method for etch rate deviation improvement. The substrate treating apparatus includes: a treating bath providing space for receiving a substrate treating solution for treating substrates; a treating solution source providing the substrate treating solution into the treating bath such that the substrates are immersed and treated in the substrate treating solution; and a bubble generation module connected to the treating bath and generating bubbles in the substrate treating solution by injecting gas.

10. 发明公开

US20230147919A1 APPARATUS FOR TREATING SUBSTRATE AND METHOD FOR TREATING SUBSTRATE 审中-公开
公开(公告)号：US20230147919A1
公开(公告)日：2023-05-11
申请号：US17980995
申请日：2022-11-04
申请人： SEMES CO., LTD.
发明人： Gui Su PARK , Jun Young CHOI , Young Jin JANG , Yong Sun KO , Kyu Hwan CHANG , Jun Hyun LIM
IPC分类号： H01L21/677 , H01L21/687 , B08B3/08 , B08B13/00 , G03F7/20 , F26B5/00
CPC分类号： H01L21/67718 , H01L21/68707 , B08B3/08 , B08B13/00 , G03F7/2043 , F26B5/005 , B25J11/0095
摘要： The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a first process treating unit configured to treat a substrate in a single-type method; a second process treating unit configured to treat a substrate in a batch-type method; and a posture changing unit provided between the first process treating unit and the second process treating unit and configured to change a posture of the substrate between a vertical posture and a horizontal posture, and wherein the substrate is loaded to and unloaded from the first process treating unit.

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