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    • 1. 发明授权
    • Semiconductor device and its manufacture method
    • 半导体器件及其制造方法
    • US06900088B2
    • 2005-05-31
    • US10084367
    • 2002-02-28
    • Ryota NanjoShinji SugataniSatoshi Nakai
    • Ryota NanjoShinji SugataniSatoshi Nakai
    • H01L21/8234H01L21/265H01L21/8238H01L27/088H01L27/092H01L29/78H01L21/8232
    • H01L21/823814H01L21/823842H01L21/82385
    • First and second gate electrodes are formed on first and second regions of a semiconductor substrate. Second conductivity type impurities are implanted into the second region to form first impurity diffusion regions. Spacer films are formed on the side surfaces of the first and second gate electrodes. Second conductivity type impurities are implanted into the first and second regions to form second impurity diffusion regions. After the spacer films are removed, second conductivity type impurities are implanted into the first region to form third impurity diffusion regions. The third activation process is performed so that the gradient of impurity concentration distribution around the third impurity diffusion region becomes steeper than the gradient of impurity concentration distribution around the first impurity diffusion region.
    • 第一和第二栅电极形成在半导体衬底的第一和第二区上。 将第二导电型杂质注入到第二区域中以形成第一杂质扩散区。 间隔膜形成在第一和第二栅电极的侧表面上。 将第二导电型杂质注入第一和第二区域以形成第二杂质扩散区。 在去除间隔膜之后,将第二导电型杂质注入第一区域以形成第三杂质扩散区。 执行第三激活处理,使得第三杂质扩散区周围的杂质浓度分布的梯度比第一杂质扩散区周围的杂质浓度分布的梯度变得更陡。
    • 4. 发明申请
    • CATALYST PRECURSOR SUBSTANCE, AND CATALYST USING THE SAME
    • 催化剂前体物质和使用该催化剂的催化剂
    • US20100112397A1
    • 2010-05-06
    • US12594983
    • 2008-04-02
    • Kozo TakatsuYoshimi KawashimaSatoshi Nakai
    • Kozo TakatsuYoshimi KawashimaSatoshi Nakai
    • B01J23/06B01D53/62H01M8/06B01J23/72
    • B01J35/006B01J23/80B01J35/002B01J35/1019B01J37/0009B01J37/03C01B3/16C01B3/326C01B2203/0233C01B2203/0283C01B2203/066C01B2203/1076C01B2203/1223C01B2203/1288H01M8/0618H01M8/0668Y02P20/52
    • The present invention provides a catalyst precursor substance containing copper, zinc, and aluminum and exhibiting an X-ray diffraction pattern having a broad peak at a specific interplanar spacing d (Å). The present invention also provides a method for producing the catalyst precursor substance by mixing a solution containing a copper salt, a zinc salt, and an aluminum salt with a solution containing an alkali metal hydroxide or an alkaline earth metal hydroxide, thereby forming a precipitate. In the present invention, a catalyst is prepared through calcining of the catalyst precursor; the catalyst is employed for water gas shift reaction; and carbon monoxide conversion is carried out by use of the catalyst. Thus, the present invention also provides a catalyst useful for water gas shift reaction, which exhibits high activity and durability and which, even when applied to a fuel cell, can be used for a long period of time with reduction in activity being suppressed; a carbon monoxide conversion method employing the catalyst; and a fuel cell system employing hydrogen produced through the carbon monoxide conversion method.
    • 本发明提供了含有铜,锌和铝的催化剂前体物质,并且具有在特定的晶面间距d()下具有宽峰的X射线衍射图。 本发明还提供了通过将含有铜盐,锌盐和铝盐的溶液与含有碱金属氢氧化物或碱土金属氢氧化物的溶液混合从而形成沉淀物来制备催化剂前体物质的方法。 在本发明中,通过煅烧催化剂前体制备催化剂; 催化剂用于水煤气变换反应; 并且通过使用催化剂进行一氧化碳转化。 因此,本发明还提供了可用于水煤气变换反应的催化剂,其具有高活性和耐久性,并且甚至当应用于燃料电池时可以长时间使用,同时抑制活性的降低; 使用该催化剂的一氧化碳转化方法; 以及使用通过一氧化碳转化法生产的氢的燃料电池系统。
    • 6. 发明申请
    • Semiconductor device and method of fabricating the same
    • 半导体装置及其制造方法
    • US20070032005A1
    • 2007-02-08
    • US11287328
    • 2005-11-28
    • Satoshi Nakai
    • Satoshi Nakai
    • H01L21/8234H01L21/336
    • H01L21/823462H01L21/823857Y10S438/981
    • The present invention provides a semiconductor device fabrication method including the steps of: forming first gate insulating films in first to third active regions of a silicon substrate; wet-etching the first gate insulating film of the second active region through a first resist opening portion of a first resist pattern; forming a second gate insulating film in the second active region; forming on the silicon substrate a second resist pattern having a second resist portion larger than the first resist opening portion; wet-etching the first gate insulating film of the third active region through a second resist opening portion of the second resist pattern; and forming a third gate insulating film in the third active region.
    • 本发明提供一种半导体器件制造方法,包括以下步骤:在硅衬底的第一至第三有源区中形成第一栅极绝缘膜; 通过第一抗蚀剂图案的第一抗蚀剂开口部分对第二有源区的第一栅极绝缘膜进行湿蚀刻; 在所述第二有源区中形成第二栅极绝缘膜; 在所述硅衬底上形成具有比所述第一抗蚀剂开口部大的第二抗蚀剂部分的第二抗蚀剂图案; 通过第二抗蚀剂图案的第二抗蚀剂开口部分对第三有源区的第一栅极绝缘膜进行湿蚀刻; 以及在所述第三有源区中形成第三栅极绝缘膜。
    • 7. 发明授权
    • Magnetron with external terminals having connecting portions which are air-tightly connected to cathode leads
    • 具有外部端子的磁控管具有气密地连接到阴极引线的连接部分
    • US06696790B2
    • 2004-02-24
    • US10154809
    • 2002-05-28
    • Noriyuki MuraoKazuki MikiSetsuo HasegawaNoriyuki OkadaSatoshi Nakai
    • Noriyuki MuraoKazuki MikiSetsuo HasegawaNoriyuki OkadaSatoshi Nakai
    • H01J2550
    • H01J23/14H01J2225/50
    • A magnetron including a tubular metallic container which is air-tightly connected to an anode, cathode leads for supporting a cathode with filaments being disposed in a central axial portion of the anode, a stem insulator formed with through holes through which the cathode leads pass, and external terminals formed with planar portions which are air-tightly connected to a surface of the stem insulator opposite to a surface facing the tubular metallic container and with connecting portions which are air-tightly connected to the cathode leads. The connecting portions are arranged to be bent in an axial direction of the cathode leads. It is possible to exhibit the effect of preventing vacuum break from occurring by oxidation or the like since the increase in the area of the connecting portions will result in elongation of the distance between the end portions of the connecting portions and the through holes.
    • 一种磁控管,其包括气密地连接到阳极的管状金属容器,阴极引线,用于支撑阴极,灯丝设置在阳极的中心轴向部分;杆绝缘子,其形成有阴极引线通过的通孔, 以及形成有平坦部分的外部端子,其气密地连接到与所述管状金属容器相对的表面的所述杆绝缘体的表面,以及气密地连接到所述阴极引线的连接部分。 连接部被布置成沿着阴极引线的轴向弯曲。 由于连接部分的面积的增加将导致连接部分的端部和通孔之间的距离的伸长,所以可以表现出通过氧化等发生防止真空断裂的效果。
    • 10. 发明授权
    • Semiconductor device and method of fabricating the same
    • 半导体装置及其制造方法
    • US07405118B2
    • 2008-07-29
    • US11287328
    • 2005-11-28
    • Satoshi Nakai
    • Satoshi Nakai
    • H01L21/8238
    • H01L21/823462H01L21/823857Y10S438/981
    • The present invention provides a semiconductor device fabrication method including the steps of: forming first gate insulating films in first to third active regions of a silicon substrate; wet-etching the first gate insulating film of the second active region through a first resist opening portion of a first resist pattern; forming a second gate insulating film in the second active region; forming on the silicon substrate a second resist pattern having a second resist portion larger than the first resist opening portion; wet-etching the first gate insulating film of the third active region through a second resist opening portion of the second resist pattern; and forming a third gate insulating film in the third active region.
    • 本发明提供一种半导体器件制造方法,包括以下步骤:在硅衬底的第一至第三有源区中形成第一栅极绝缘膜; 通过第一抗蚀剂图案的第一抗蚀剂开口部分对第二有源区的第一栅极绝缘膜进行湿蚀刻; 在所述第二有源区中形成第二栅极绝缘膜; 在所述硅衬底上形成具有比所述第一抗蚀剂开口部大的第二抗蚀剂部分的第二抗蚀剂图案; 通过第二抗蚀剂图案的第二抗蚀剂开口部分对第三有源区的第一栅极绝缘膜进行湿蚀刻; 以及在所述第三有源区中形成第三栅极绝缘膜。