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    • 3. 发明申请
    • CATALYST PRECURSOR SUBSTANCE, AND CATALYST USING THE SAME
    • 催化剂前体物质和使用该催化剂的催化剂
    • US20100112397A1
    • 2010-05-06
    • US12594983
    • 2008-04-02
    • Kozo TakatsuYoshimi KawashimaSatoshi Nakai
    • Kozo TakatsuYoshimi KawashimaSatoshi Nakai
    • B01J23/06B01D53/62H01M8/06B01J23/72
    • B01J35/006B01J23/80B01J35/002B01J35/1019B01J37/0009B01J37/03C01B3/16C01B3/326C01B2203/0233C01B2203/0283C01B2203/066C01B2203/1076C01B2203/1223C01B2203/1288H01M8/0618H01M8/0668Y02P20/52
    • The present invention provides a catalyst precursor substance containing copper, zinc, and aluminum and exhibiting an X-ray diffraction pattern having a broad peak at a specific interplanar spacing d (Å). The present invention also provides a method for producing the catalyst precursor substance by mixing a solution containing a copper salt, a zinc salt, and an aluminum salt with a solution containing an alkali metal hydroxide or an alkaline earth metal hydroxide, thereby forming a precipitate. In the present invention, a catalyst is prepared through calcining of the catalyst precursor; the catalyst is employed for water gas shift reaction; and carbon monoxide conversion is carried out by use of the catalyst. Thus, the present invention also provides a catalyst useful for water gas shift reaction, which exhibits high activity and durability and which, even when applied to a fuel cell, can be used for a long period of time with reduction in activity being suppressed; a carbon monoxide conversion method employing the catalyst; and a fuel cell system employing hydrogen produced through the carbon monoxide conversion method.
    • 本发明提供了含有铜,锌和铝的催化剂前体物质,并且具有在特定的晶面间距d()下具有宽峰的X射线衍射图。 本发明还提供了通过将含有铜盐,锌盐和铝盐的溶液与含有碱金属氢氧化物或碱土金属氢氧化物的溶液混合从而形成沉淀物来制备催化剂前体物质的方法。 在本发明中,通过煅烧催化剂前体制备催化剂; 催化剂用于水煤气变换反应; 并且通过使用催化剂进行一氧化碳转化。 因此,本发明还提供了可用于水煤气变换反应的催化剂,其具有高活性和耐久性,并且甚至当应用于燃料电池时可以长时间使用,同时抑制活性的降低; 使用该催化剂的一氧化碳转化方法; 以及使用通过一氧化碳转化法生产的氢的燃料电池系统。
    • 5. 发明申请
    • Semiconductor device and method of fabricating the same
    • 半导体装置及其制造方法
    • US20070032005A1
    • 2007-02-08
    • US11287328
    • 2005-11-28
    • Satoshi Nakai
    • Satoshi Nakai
    • H01L21/8234H01L21/336
    • H01L21/823462H01L21/823857Y10S438/981
    • The present invention provides a semiconductor device fabrication method including the steps of: forming first gate insulating films in first to third active regions of a silicon substrate; wet-etching the first gate insulating film of the second active region through a first resist opening portion of a first resist pattern; forming a second gate insulating film in the second active region; forming on the silicon substrate a second resist pattern having a second resist portion larger than the first resist opening portion; wet-etching the first gate insulating film of the third active region through a second resist opening portion of the second resist pattern; and forming a third gate insulating film in the third active region.
    • 本发明提供一种半导体器件制造方法,包括以下步骤:在硅衬底的第一至第三有源区中形成第一栅极绝缘膜; 通过第一抗蚀剂图案的第一抗蚀剂开口部分对第二有源区的第一栅极绝缘膜进行湿蚀刻; 在所述第二有源区中形成第二栅极绝缘膜; 在所述硅衬底上形成具有比所述第一抗蚀剂开口部大的第二抗蚀剂部分的第二抗蚀剂图案; 通过第二抗蚀剂图案的第二抗蚀剂开口部分对第三有源区的第一栅极绝缘膜进行湿蚀刻; 以及在所述第三有源区中形成第三栅极绝缘膜。
    • 6. 发明授权
    • Magnetron with external terminals having connecting portions which are air-tightly connected to cathode leads
    • 具有外部端子的磁控管具有气密地连接到阴极引线的连接部分
    • US06696790B2
    • 2004-02-24
    • US10154809
    • 2002-05-28
    • Noriyuki MuraoKazuki MikiSetsuo HasegawaNoriyuki OkadaSatoshi Nakai
    • Noriyuki MuraoKazuki MikiSetsuo HasegawaNoriyuki OkadaSatoshi Nakai
    • H01J2550
    • H01J23/14H01J2225/50
    • A magnetron including a tubular metallic container which is air-tightly connected to an anode, cathode leads for supporting a cathode with filaments being disposed in a central axial portion of the anode, a stem insulator formed with through holes through which the cathode leads pass, and external terminals formed with planar portions which are air-tightly connected to a surface of the stem insulator opposite to a surface facing the tubular metallic container and with connecting portions which are air-tightly connected to the cathode leads. The connecting portions are arranged to be bent in an axial direction of the cathode leads. It is possible to exhibit the effect of preventing vacuum break from occurring by oxidation or the like since the increase in the area of the connecting portions will result in elongation of the distance between the end portions of the connecting portions and the through holes.
    • 一种磁控管,其包括气密地连接到阳极的管状金属容器,阴极引线,用于支撑阴极,灯丝设置在阳极的中心轴向部分;杆绝缘子,其形成有阴极引线通过的通孔, 以及形成有平坦部分的外部端子,其气密地连接到与所述管状金属容器相对的表面的所述杆绝缘体的表面,以及气密地连接到所述阴极引线的连接部分。 连接部被布置成沿着阴极引线的轴向弯曲。 由于连接部分的面积的增加将导致连接部分的端部和通孔之间的距离的伸长,所以可以表现出通过氧化等发生防止真空断裂的效果。
    • 9. 发明授权
    • Method of manufacturing semiconductor device and semiconductor device
    • 制造半导体器件和半导体器件的方法
    • US08084340B2
    • 2011-12-27
    • US11541728
    • 2006-10-03
    • Satoshi Nakai
    • Satoshi Nakai
    • H01L21/425
    • H01L21/26513H01L21/76232H01L29/78
    • A method of manufacturing a semiconductor device whereby, even in cases where ions are implanted into a shallow region of a semiconductor substrate when a deep well is formed, the influence of the ions on a MOSFET can be removed, thereby eliminating the need for increasing the chip area. A photoresist with a thickness matching the wavelength of exposure light is formed over the semiconductor substrate and then is exposed to the exposure light to form a photoresist pattern with an opening corresponding to a region for forming a first well. Subsequently, using the photoresist pattern as a mask, ions are implanted to form the first well, and after the photoresist pattern is removed, an epitaxial layer is grown over the semiconductor substrate. Consequently, the deep well is virtually located deeper in level than at the time of the ion implantation by an amount corresponding to the thickness of the epitaxial layer.
    • 一种半导体器件的制造方法,其中即使在形成深阱时将离子注入到半导体衬底的浅区域的情况下,可以除去离子对MOSFET的影响,从而不需要增加 芯片面积。 在半导体衬底上形成具有与曝光光的波长相匹配的光致抗蚀剂,然后暴露于曝光光以形成具有对应于用于形成第一阱的区域的开口的光致抗蚀剂图案。 随后,使用光致抗蚀剂图案作为掩模,注入离子以形成第一阱,并且在去除光致抗蚀剂图案之后,在半导体衬底上生长外延层。 因此,深阱实际上位于比离子注入时更深的水平,其量与对应于外延层的厚度相对应。
    • 10. 发明授权
    • Method for manufacturing a semiconductor device
    • 半导体器件的制造方法
    • US07008834B2
    • 2006-03-07
    • US10844497
    • 2004-05-13
    • Satoshi NakaiJun SakumaMitsugu Tajima
    • Satoshi NakaiJun SakumaMitsugu Tajima
    • H01L21/00H01L21/76
    • H01L29/66772H01L21/76283H01L21/84H01L27/1203H01L29/78609H01L29/78654
    • A method for manufacturing a semiconductor device includes: forming a first photoresist pattern on a second hard mask by use of ArF; forming first and second openings in the second hard mask by use of the first photoresist pattern as an etching mask; forming third and fourth openings in a first hard mask under the first and second openings; forming a partial trench (first trench) and a trench for a full trench (second trench) in an SOI substrate (semiconductor substrate) under the first and second openings; and forming the trench for a full trench into a full trench by etching the trench for a full trench through the fourth opening exposed through a third window of a second photoresist pattern.
    • 一种制造半导体器件的方法包括:通过使用ArF在第二硬掩模上形成第一光致抗蚀剂图案; 通过使用第一光致抗蚀剂图案作为蚀刻掩模在第二硬掩模中形成第一和第二开口; 在第一和第二开口下方的第一硬掩模中形成第三和第四开口; 在第一和第二开口下方的SOI衬底(半导体衬底)中形成用于全沟槽(第二沟槽)的部分沟槽(第一沟槽)和沟槽; 以及通过蚀刻通过穿过第二光致抗蚀剂图案的第三窗口暴露的第四开口的全沟槽的沟槽,将全沟槽的沟槽形成全沟槽。