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    • 5. 发明授权
    • Monitoring circuit, method for outputting monitor signal, and optical receiver
    • 监控电路,监控信号输出方法,光接收机
    • US08476894B2
    • 2013-07-02
    • US12801051
    • 2010-05-19
    • Hiroshi Okada
    • Hiroshi Okada
    • G01R31/00
    • G01R19/0092
    • A monitoring circuit of the present invention provides a monitor signal with which a magnitude of a current flowing across a photodetector, such as a photodiode, can be calculated accurately over a wide temperature range on the basis of a value of the monitor signal. The monitoring circuit of the present invention includes: a current mirror circuit for outputting a monitor current proportional to an input current, the current mirror circuit having an input point for receiving the input current, the input point being connected to a photodetector and a load resistor, which are connected thereto in parallel; and an output circuit for outputting a monitor signal indicating a difference between a monitor electric potential proportional to the monitor current, and an offset electric potential proportional to an offset current which flows across the load resistor concurrently with the monitor current.
    • 本发明的监视电路提供一种监视信号,通过该监视信号,可以根据监视信号的值,在宽的温度范围内精确地计算流过光电探测器(例如光电二极管)的电流大小。 本发明的监视电路包括:电流镜电路,用于输出与输入电流成比例的监视电流,电流镜电路具有用于接收输入电流的输入点,输入点连接到光电检测器和负载电阻器 ,其并联连接; 以及输出电路,用于输出指示与监视电流成比例的监视电位之间的差异的监视信号和与监视电流同时流过负载电阻的偏移电流成比例的偏移电位。
    • 7. 发明授权
    • Light-receiving device
    • 光接收装置
    • US08058642B2
    • 2011-11-15
    • US12443575
    • 2008-07-18
    • Yasuhiro IguchiHiroshi OkadaYuichi Kawamura
    • Yasuhiro IguchiHiroshi OkadaYuichi Kawamura
    • H01L31/0352
    • H01L31/035236B82Y20/00H01L27/14649H01L31/03046Y02E10/544
    • A light-receiving element device capable of receiving near infrared to mid-infrared light of 1.7 μm-3.5 μm is provided. A substrate is formed of InP, and a superlattice light-receiving layer is formed of a superlattice of a type 2 junction formed by alternately being stacked a falling layer of a Group III-V compound semiconductor including In, Ga, As, N and a rising layer of a Group III-V compound semiconductor including Ga, As, Sb. The film thickness of the falling layer and the rising layer is each 3 nm-10 nm. The entire thickness of the superlattice light-receiving layer is 2 μm-7 μm. The lattice mismatch of the constituent film of the superlattice light-receiving layer to InP is ±0.2% or less.
    • 提供能够接收1.7μm〜3.5μm的近红外到中红外光的受光元件装置。 基板由InP形成,超晶格光接收层由通过交替堆叠包括In,Ga,As,N的III-V族化合物半导体的下降层形成的2型结的超晶格形成,并且 包含Ga,As,Sb的III-V族化合物半导体的上升层。 下降层和上升层的膜厚分别为3nm〜10nm。 超晶格光接收层的整个厚度为2μm-7μm。 超晶格光接收层的构成膜与InP的晶格失配为±0.2%以下。
    • 9. 发明申请
    • Imaging Module
    • 成像模块
    • US20110037893A1
    • 2011-02-17
    • US12988493
    • 2009-04-10
    • Hiroshi Okada
    • Hiroshi Okada
    • H04N5/225
    • H04N5/2252G02B7/021G02B13/001G03B17/02H04N5/2257
    • An imaging module includes an imaging substrate mounting an imaging device thereon, a resin holder including a substrate securing portion to which the imaging substrate is secured, a lens support barrel supporting a lens at an inside thereof, and a holding portion which protrudes toward a subject from the substrate securing portion and includes a through hole configured to permit retention of the holder in an external structure, a metal securing member disposed at a side of the substrate securing portion of the holder facing a subject, and a metal holding plate including a securing region which is secured to and electrically connected to the securing member, and a holding portion adjacent region which overlaps a part around the through hole of the holding portion and includes a through hole configured to communicate with the through hole.
    • 成像模块包括在其上安装成像装置的成像基板,包括固定有成像基板的基板固定部分的树脂保持器,在其内侧支撑透镜的透镜支撑筒以及向主体突出的保持部 并且包括通孔,该通孔被配置为允许保持器保持在外部结构中;金属固定构件,其设置在所述保持器的面向被检体的基板固定部分的一侧;金属保持板,其包括固定 固定到电连接到固定构件的区域和与保持部分的通孔周围的部分重叠的保持部​​分相邻区域,并且包括与通孔相连通的通孔。
    • 10. 发明申请
    • QUICK-RESPONSE THERMOCOUPLE FOR HIGH-SPEED FLUID
    • 用于高速流体的快速热电偶
    • US20100322286A1
    • 2010-12-23
    • US12666105
    • 2008-10-24
    • Kozo ToyamaMitsuaki MochizukiHiroshi OkadaShinichi FukushimaJunichi Sano
    • Kozo ToyamaMitsuaki MochizukiHiroshi OkadaShinichi FukushimaJunichi Sano
    • G01K7/02
    • G01K13/02G01K1/08G01K1/18G01K7/02
    • An object of the invention is to provide a thermocouple having a high response speed without receiving mechanical damages such as bending and curving even when it is used in a high-speed fluid. The invention provides a quick-response thermocouple for high-speed fluid in which a sheathed thermocouple having a small outer diameter that is formed by housing, in a metal sheath, a positive-side thermocouple filament and a negative-side thermocouple filament embedded within a powder of an inorganic insulating material, and by forming a temperature sensing point at a tip portion thereof by bonding the tips of the positive-side thermocouple filament and the negative-side thermocouple filament together at the tip portion thereof, is inserted in a protective tube having a large outer diameter so that the tip portion is exposed, in which a portion of the sheathed thermocouple that is exposed from the protective tube is inserted in a protective cylinder having a bottom cover with a hole on a tip side through which the sheathed thermocouple is inserted and having a plurality of through windows, the tip of the sheathed thermocouple is slightly exposed from the bottom cover of the protective cylinder, and the bottom cover of the protective cylinder and the sheathed thermocouple as well as the protective cylinder and a lower portion of the protective tube are welded.
    • 本发明的目的是提供一种具有高响应速度的热电偶,即使在高速流体中使用时也不会受到弯曲和弯曲等机械损伤。 本发明提供了一种用于高速流体的快速响应热电偶,其中具有小外径的铠装热电偶通过在金属外壳中容纳正嵌入的热电偶丝和负侧热电偶丝而形成 无机绝缘材料的粉末,并且通过在顶端部分处将正侧热电偶丝和负侧热电偶丝的末端接合在一起的顶端处形成温度感测点,插入保护管中 具有大的外径,使得尖端部分露出,其中从保护管暴露的一部分铠装热电偶被插入到具有底盖的保护筒中,该保护筒具有在顶端侧的孔,护套热电偶 插入并具有多个通孔,该护套热电偶的尖端稍微暴露于保护层的底盖 e气缸,保护筒的底盖和护套热电偶以及保护筒和保护管的下部焊接。