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    • 2. 发明授权
    • Semiconductor device and method for making the same
    • 半导体装置及其制造方法
    • US08143691B2
    • 2012-03-27
    • US12585273
    • 2009-09-10
    • Hisao Ichijo
    • Hisao Ichijo
    • H01L23/58
    • H01L29/7816H01L29/0696H01L29/0878H01L29/1095H01L29/42368H01L29/4238H01L29/66681
    • To provide a semiconductor device and a method of making the same, the device being capable of preventing decrease in the withstanding voltage along the direction perpendicular to the source-drain direction and thereby improving the resistance to an overvoltage (overcurrent), the device includes: a p-type semiconductor substrate 201; an n-type diffusion region 202; a p-type body region 206, a p-type buried diffusion region 204, and an n-type drift region 207 within the n-type diffusion region 202; an n-type source region 208 and a p-type body contact region 209 within the p-type body region 206; an n-type drain region 210 within the n-type drift region 207; a gate insulating film above the p-type body region 206; and a gate electrode 211 above the gate insulating film, where the region 204 extends away from the region 206 farther than the farther edge of the gate electrode 211 is along a cross section perpendicular to the source-drain direction.
    • 为了提供一种半导体器件及其制造方法,该器件能够防止沿着与源极 - 漏极方向垂直的方向的耐受电压降低,从而提高对过电压(过电流)的抵抗性,该器件包括: p型半导体衬底201; n型扩散区域202; n型扩散区域202内的p型体区域206,p型埋入扩散区域204和n型漂移区域207; p型体区域206内的n型源极区域208和p型体接触区域209; n型漂移区域207内的n型漏极区域210; p型体区域206上方的栅极绝缘膜; 以及栅极绝缘膜上方的栅电极211,其中区域204远离距离栅电极211的更远边缘更远的区域206沿着与源极 - 漏极方向垂直的横截面。
    • 6. 发明申请
    • Semiconductor device
    • 半导体器件
    • US20060255406A1
    • 2006-11-16
    • US11370038
    • 2006-03-08
    • Hisao IchijoHiroyoshi OguraYoshinobu SatoTeruhisa IkutaToru Terashita
    • Hisao IchijoHiroyoshi OguraYoshinobu SatoTeruhisa IkutaToru Terashita
    • H01L27/12
    • H01L27/1203H01L21/76264H01L29/0696H01L29/086H01L29/0878H01L29/42364H01L29/42368H01L29/7824
    • An object of the present invention is to provide a semiconductor device which enables to reduce the device area, while securing the breakdown voltage between the drain and the source of each MOS transistor for the semiconductor device including plural MOS transistors, which are arrayed adjacently each other, with different types of channel conductivity. The semiconductor device includes a semiconductor substrate, a buried oxide film and a semiconductor layer, and furthermore the semiconductor layer has an island-like semiconductor layer, in which a MOS transistor is formed, the MOS transistor has a source region, and a drain region that is positioned in the periphery of the source region, an island-like semiconductor layer, in which a MOS transistor is formed, the MOS transistor has a drain region, and a source region is that is positioned in the periphery of the drain region, an isolation trench which isolates the former island-like semiconductor layer from other portions of the semiconductor layer, an isolation trench which isolates the latter island-like semiconductor layer from other portions of the semiconductor layer, and a buffer region, in which the electric potential is fixed to the lowest electric potential in a circuit, which prevents an electrical interference occurred between transistors.
    • 本发明的目的是提供一种半导体器件,其能够在确保包括多个相互排列的多个MOS晶体管的半导体器件的每个MOS晶体管的漏极和源极之间的击穿电压的同时,减小器件面积 ,具有不同类型的通道电导率。 半导体器件包括半导体衬底,掩埋氧化物膜和半导体层,此外,半导体层具有形成MOS晶体管的岛状半导体层,MOS晶体管具有源极区域和漏极区域 位于源极区域周围的岛状半导体层,形成有MOS晶体管的岛状半导体层,MOS晶体管具有漏极区域,源极区域位于漏极区域的周围, 将前述岛状半导体层与半导体层的其他部分隔离的隔离沟槽,将后述的岛状半导体层与半导体层的其他部分隔离的隔离沟槽和缓冲区域,其中电位 被固定在电路中的最低电位,这防止晶体管之间发生电干扰。
    • 7. 发明申请
    • Lateral semiconductor device and method for producing the same
    • 侧面半导体器件及其制造方法
    • US20060118902A1
    • 2006-06-08
    • US11242084
    • 2005-10-04
    • Teruhisa IkutaHiroyoshi OguraYoshinobu SatoHisao Ichijo
    • Teruhisa IkutaHiroyoshi OguraYoshinobu SatoHisao Ichijo
    • H01L29/76H01L23/58H01L21/76
    • H01L29/0847H01L29/0878H01L29/1045H01L29/1083H01L29/1095H01L29/42368H01L29/66681H01L29/7824H01L29/7835
    • A high withstand voltage lateral semiconductor device capable of improving its on-state breakdown voltage and safe operation area (SOA) without lowering its current capabilities, and structured so as to be easy to produce. The lateral semiconductor device comprises a second conductivity type second semiconductor region formed in a semiconductor layer so as to be adjacent to or away from a first semiconductor region, a second conductivity type source region, a second conductivity type drain region, and a gate electrode formed on a gate insulating film formed between an end of the source region on the surface of the semiconductor layer and an end of the second semiconductor region, wherein the first semiconductor region is extended from under the source region to partly under the gate electrode, the concentration distribution of a first conductivity type impurity increases in the region ranging from the surface of the semiconductor layer to the embedded insulating film and has a peak under the source region, and the impurity concentration in the semiconductor layer ranging from directly under the first semiconductor region to the embedded insulating film is lower than the surface concentration in the first semiconductor region.
    • 高耐压横向半导体器件能够在不降低其电流能力的情况下改善其导通电压和安全工作区域(SOA),并且结构化以便于生产。 横向半导体器件包括形成在半导体层中以与第一半导体区相邻或离开的第二导电类型的第二半导体区,第二导电类型源极区,第二导电类型漏极区和形成的栅极 在形成在所述半导体层的表面上的所述源极区域的端部与所述第二半导体区域的端部之间的栅极绝缘膜上,其中,所述第一半导体区域从所述源极区域的下部延伸到所述栅极电极的下方, 在从半导体层的表面到嵌入绝缘膜的范围内的第一导电型杂质的分布增加,并且在源极区域具有峰值,并且半导体层中的杂质浓度范围从第一半导体区域的正下方到 嵌入式绝缘膜低于第一绝缘膜中的表面浓度 半导体区域。