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    • 3. 发明申请
    • VAPOR DEPOSITION OF SILICON DIOXIDE NANOLAMINATES
    • 二氧化硅纳米酰胺的蒸气沉积
    • US20110281417A1
    • 2011-11-17
    • US13189283
    • 2011-07-22
    • Roy G. GORDONJill BeckerDennis Hausmann
    • Roy G. GORDONJill BeckerDennis Hausmann
    • H01L21/762H01L21/316B82Y40/00
    • C23C16/45534C23C16/045C23C16/401C23C16/402C23C16/403C23C16/45525C23C16/45529C23C16/45555
    • This invention relates to materials and processes for thin film deposition on solid substrates. Silica/alumina nanolaminates were deposited on heated substrates by the reaction of an aluminum-containing compound with a silanol. The nanolaminates have very uniform thickness and excellent step coverage in holes with aspect ratios over 40:1. The films are transparent and good electrical insulators. This invention also relates to materials and processes for producing improved porous dielectric materials used in the insulation of electrical conductors in microelectronic devices, particularly through materials and processes for producing semi-porous dielectric materials wherein surface porosity is significantly reduced or removed while internal porosity is preserved to maintain a desired low-k value for the overall dielectric material. The invention can also be used to selectively fill narrow trenches with low-k dielectric material while at the same time avoiding deposition of any dielectric on the surface area outside of the trenches.
    • 本发明涉及在固体基底上薄膜沉积的材料和方法。 通过含铝化合物与硅烷醇的反应将二氧化硅/氧化铝纳米层压材料沉积在加热的基底上。 纳米层压板具有非常均匀的厚度和在具有40:1以上的纵横比的孔中的优异的台阶覆盖。 这些胶片是透明和良好的电绝缘体。 本发明还涉及用于生产用于微电子器件中的电导体的绝缘中的改进的多孔电介质材料的材料和方法,特别是通过用于生产半孔电介质材料的材料和工艺,其中表面孔隙率被显着减少或去除,同时保持内部孔隙度 以保持整个介电材料的期望的低k值。 本发明还可用于选择性地填充具有低k介电材料的窄沟槽,同时避免任何电介质沉积在沟槽外部的表面区域上。
    • 4. 发明授权
    • Vapor deposition of silicon dioxide nanolaminates
    • 二氧化硅纳米层压板的气相沉积
    • US08008743B2
    • 2011-08-30
    • US10951464
    • 2004-09-27
    • Roy G. GordonJill BeckerDennis Hausmann
    • Roy G. GordonJill BeckerDennis Hausmann
    • H01L21/70
    • C23C16/45534C23C16/045C23C16/401C23C16/402C23C16/403C23C16/45525C23C16/45529C23C16/45555
    • This invention relates to materials and processes for thin film deposition on solid substrates. Silica/alumina nanolaminates were deposited on heated substrates by the reaction of an aluminum-containing compound with a silanol. The nanolaminates have very uniform thickness and excellent step coverage in holes with aspect ratios over 40:1. The films are transparent and good electrical insulators. This invention also relates to materials and processes for producing improved porous dielectric materials used in the insulation of electrical conductors in microelectronic devices, particularly through materials and processes for producing semi-porous dielectric materials wherein surface porosity is significantly reduced or removed while internal porosity is preserved to maintain a desired low-k value for the overall dielectric material. The invention can also be used to selectively fill narrow trenches with low-k dielectric material while at the same time avoiding deposition of any dielectric on the surface area outside of the trenches.
    • 本发明涉及在固体基底上薄膜沉积的材料和方法。 通过含铝化合物与硅烷醇的反应将二氧化硅/氧化铝纳米层压材料沉积在加热的基底上。 纳米层压板具有非常均匀的厚度和在具有40:1以上的纵横比的孔中的优异的台阶覆盖。 这些胶片是透明和良好的电绝缘体。 本发明还涉及用于生产用于微电子器件中的电导体的绝缘中的改进的多孔电介质材料的材料和方法,特别是通过用于生产半孔电介质材料的材料和工艺,其中表面孔隙率被显着减少或去除,同时保持内部孔隙度 以保持整个介电材料的期望的低k值。 本发明还可用于选择性地填充具有低k介电材料的窄沟槽,同时避免任何电介质沉积在沟槽外部的表面区域上。
    • 8. 发明申请
    • Vapor deposition of silicon dioxide nanolaminates
    • 二氧化硅纳米层压板的气相沉积
    • US20050112282A1
    • 2005-05-26
    • US10951464
    • 2004-09-27
    • Roy GordonJill BeckerDennis Hausmann
    • Roy GordonJill BeckerDennis Hausmann
    • C23C16/42C23C16/04C23C16/40C23C16/44C23C16/455H01L21/31H01L21/316H01L21/469
    • C23C16/45534C23C16/045C23C16/401C23C16/402C23C16/403C23C16/45525C23C16/45529C23C16/45555
    • This invention relates to materials and processes for thin film deposition on solid substrates. Silica/alumina nanolaminates were deposited on heated substrates by the reaction of an aluminum-containing compound with a silanol. The nanolaminates have very uniform thickness and excellent step coverage in holes with aspect ratios over 40:1. The films are transparent and good electrical insulators. This invention also relates to materials and processes for producing improved porous dielectric materials used in the insulation of electrical conductors in microelectronic devices, particularly through materials and processes for producing semi-porous dielectric materials wherein surface porosity is significantly reduced or removed while internal porosity is preserved to maintain a desired low-k value for the overall dielectric material. The invention can also be used to selectively fill narrow trenches with low-k dielectric material while at the same time avoiding deposition of any dielectric on the surface area outside of the trenches.
    • 本发明涉及在固体基底上薄膜沉积的材料和方法。 通过含铝化合物与硅烷醇的反应将二氧化硅/氧化铝纳米层压材料沉积在加热的基底上。 纳米层压板具有非常均匀的厚度和在具有40:1以上的纵横比的孔中的优异的台阶覆盖。 这些胶片是透明和良好的电绝缘体。 本发明还涉及用于生产用于微电子器件中的电导体的绝缘中的改进的多孔电介质材料的材料和方法,特别是通过用于生产半孔介电材料的材料和工艺,其中表面孔隙率被显着地减少或去除,同时保持内部孔隙率 以保持整个介电材料的期望的低k值。 本发明还可用于选择性地填充具有低k介电材料的窄沟槽,同时避免任何电介质沉积在沟槽外部的表面区域上。
    • 10. 发明授权
    • Methods for forming conductive carbon films by PECVD
    • 通过PECVD形成导电碳膜的方法
    • US08563414B1
    • 2013-10-22
    • US12766721
    • 2010-04-23
    • Keith FoxDennis Hausmann
    • Keith FoxDennis Hausmann
    • C23C8/54C23C14/28
    • C23C16/26C23C16/505
    • Conductive carbon films having a resistivity of less than about 0.2 Ohm-cm, preferably less than about 0.05 Ohm-cm, are deposited by PECVD. Conductive carbon films are essentially free of sp3-hybridized carbon and contain predominantly sp2 carbon, based on IR spectral features. Carbon content of the films is at least about 75% atomic C. Conductive carbon films may contain hydrogen, but are typically hydrogen-poor, containing less than about 20% H. In some embodiments, conductive carbon films further contain nitrogen (N). For example, conductive films having a CxHyNz composition, where nitrogen is present at between about 5-10% atomic, have both high conductivity and low roughness, because introduction of nitrogen delays formation of crystallites in the film. The films are deposited at a process temperature of at least about 620° C., and at a pressure of less than about 20 Torr in a dual-frequency plasma process dominated by low frequency (LF) plasma.
    • 通过PECVD沉积电阻率小于约0.2欧姆 - 厘米,优选小于约0.05欧姆 - 厘米的导电碳膜。 基于IR光谱特征,导电碳膜基本上不含sp3杂化碳并主要含有sp2碳。 膜的碳含量为至少约75%原子C.导电碳膜可能含有氢,但通常为氢贫,含量小于约20%H.在一些实施方案中,导电碳膜还含有氮(N)。 例如,由于氮的引入会延缓薄膜中的微晶形成,所以具有C 5 H 10 Nz组成的导电膜,其中氮存在于约5-10%原子之间,具有高导电性和低粗糙度。 在由低频(LF)等离子体主导的双频等离子体工艺中,膜的至少约620℃的处理温度和小于约20托的压力下沉积。