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    • 3. 发明授权
    • Atomic layer deposition using metal amidinates
    • 使用金属脒基的原子层沉积
    • US07557229B2
    • 2009-07-07
    • US10534687
    • 2003-11-14
    • Roy G. GordonBooyong S. Lim
    • Roy G. GordonBooyong S. Lim
    • C07F15/00C23C16/00C07F7/00C07F9/00
    • C23C16/404C07C257/14C23C16/18C23C16/40C23C16/403C23C16/406C23C16/45553
    • Metal films are deposited with uniform thickness and excellent step coverage. Copper metal films were deposited on heated substrates by the reaction of alternating doses of copper(I) N,N′-diisopropylacetamidinate vapor and hydrogen gas. Cobalt metal films were deposited on heated substrates by the reaction of alternating doses of cobalt(II) bis(N,N′-diisopropylacetamidinate) vapor and hydrogen gas. Nitrides and oxides of these metals can be formed by replacing the hydrogen with ammonia or water vapor, respectively. The films have very uniform thickness and excellent step coverage in narrow holes. Suitable applications include electrical interconnects in microelectronics and magnetoresistant layers in magnetic information storage devices.
    • 金属膜以均匀的厚度沉积并具有优异的台阶覆盖率。 通过交替剂量的铜(I)N,N'-二异丙基乙酰胺化物蒸汽和氢气的反应,将铜金属膜沉积在加热的基底上。 通过交替剂量的双(N,N'-二异丙基乙酰胺基)钴(II)蒸气和氢气的反应,将钴金属膜沉积在加热的基底上。 这些金属的氮化物和氧化物可以通过分别用氨或水蒸汽代替氢来形成。 薄膜具有非常均匀的厚度,并且在窄孔中具有优异的台阶覆盖率。 合适的应用包括微电子学中的电互连和磁信息存储设备中的磁阻层。