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    • 6. 发明授权
    • Vapor deposition of silicon dioxide nanolaminates
    • 二氧化硅纳米层压板的气相沉积
    • US08008743B2
    • 2011-08-30
    • US10951464
    • 2004-09-27
    • Roy G. GordonJill BeckerDennis Hausmann
    • Roy G. GordonJill BeckerDennis Hausmann
    • H01L21/70
    • C23C16/45534C23C16/045C23C16/401C23C16/402C23C16/403C23C16/45525C23C16/45529C23C16/45555
    • This invention relates to materials and processes for thin film deposition on solid substrates. Silica/alumina nanolaminates were deposited on heated substrates by the reaction of an aluminum-containing compound with a silanol. The nanolaminates have very uniform thickness and excellent step coverage in holes with aspect ratios over 40:1. The films are transparent and good electrical insulators. This invention also relates to materials and processes for producing improved porous dielectric materials used in the insulation of electrical conductors in microelectronic devices, particularly through materials and processes for producing semi-porous dielectric materials wherein surface porosity is significantly reduced or removed while internal porosity is preserved to maintain a desired low-k value for the overall dielectric material. The invention can also be used to selectively fill narrow trenches with low-k dielectric material while at the same time avoiding deposition of any dielectric on the surface area outside of the trenches.
    • 本发明涉及在固体基底上薄膜沉积的材料和方法。 通过含铝化合物与硅烷醇的反应将二氧化硅/氧化铝纳米层压材料沉积在加热的基底上。 纳米层压板具有非常均匀的厚度和在具有40:1以上的纵横比的孔中的优异的台阶覆盖。 这些胶片是透明和良好的电绝缘体。 本发明还涉及用于生产用于微电子器件中的电导体的绝缘中的改进的多孔电介质材料的材料和方法,特别是通过用于生产半孔电介质材料的材料和工艺,其中表面孔隙率被显着减少或去除,同时保持内部孔隙度 以保持整个介电材料的期望的低k值。 本发明还可用于选择性地填充具有低k介电材料的窄沟槽,同时避免任何电介质沉积在沟槽外部的表面区域上。
    • 7. 发明授权
    • Cyclic metal amides and vapor deposition using them
    • 使用它们的环状金属酰胺和气相沉积
    • US08796483B2
    • 2014-08-05
    • US13077241
    • 2011-03-31
    • Roy G. GordonAdam S. HockJaeyeong HeoPrasert Sinsermsuksakul
    • Roy G. GordonAdam S. HockJaeyeong HeoPrasert Sinsermsuksakul
    • C07F7/22C07F7/24C23C16/00
    • C07F7/003C23C16/18C23C16/305C23C16/407C23C16/45553
    • Novel cyclic amides containing tin or lead are disclosed. These cyclic amides can be used for atomic layer deposition or chemical vapor deposition of tin or lead as well as their oxides, sulfides, selenides, nitrides, phosphides, carbides, silicides or borides or other compounds. Tin(IV) oxide, SnO2, films were deposited by reaction of a cyclic tin amide vapor and H2O2 or NO2 as oxygen sources. The films have high purity, smoothness, transparency, electrical conductivity, density, and uniform thickness even inside very narrow holes or trenches. Deposition temperatures are low enough for thermally sensitive substrates such as plastics. Suitable applications of these films include displays, light-emitting diodes, solar cells and gas sensors. Doping SnO2 with aluminum was used to reduce its conductivity, making material suitable as the active semiconductor layer in electron multipliers or transparent transistors. Deposition using the same tin precursor and H2S deposited tin monosulfide, SnS, a material suitable for solar cells.
    • 公开了含有锡或铅的新型环状酰胺。 这些环状酰胺可用于锡或铅及其氧化物,硫化物,硒化物,氮化物,磷化物,碳化物,硅化物或硼化物或其它化合物的原子层沉积或化学气相沉积。 通过环状锡酰胺蒸气和H 2 O 2或NO 2作为氧源反应沉积氧化锡(IV),SnO 2。 即使在非常狭窄的孔或沟槽内,这些膜也具有高纯度,平滑度,透明度,导电性,密度和均匀的厚度。 沉积温度对于热敏基材如塑料来说足够低。 这些膜的合适应用包括显示器,发光二极管,太阳能电池和气体传感器。 使用铝掺杂SnO2以降低其导电性,使得材料适合作为电子倍增器或透明晶体管中的有源半导体层。 沉积使用相同的锡前体和H2S沉积锡一硫化物,SnS,适合太阳能电池的材料。
    • 9. 发明申请
    • Cyclic Metal Amides and Vapor Deposition Using Them
    • 使用它们的循环金属酰胺和气相沉积
    • US20120027937A1
    • 2012-02-02
    • US13077241
    • 2011-03-31
    • Roy G. GordonAdam S. HockJaeyeong HeoPrasert Sinsermsuksakul
    • Roy G. GordonAdam S. HockJaeyeong HeoPrasert Sinsermsuksakul
    • B05D1/38C07F7/22C07F5/02C07F9/02C07F7/02B05D3/10C07F7/24
    • C07F7/003C23C16/18C23C16/305C23C16/407C23C16/45553
    • Novel cyclic amides containing tin or lead are disclosed. These cyclic amides can be used for atomic layer deposition or chemical vapor deposition of tin or lead as well as their oxides, sulfides, selenides, nitrides, phosphides, carbides, silicides or borides or other compounds. Tin(IV) oxide, SnO2, films were deposited by reaction of a cyclic tin amide vapor and H2O2 or NO2 as oxygen sources. The films have high purity, smoothness, transparency, electrical conductivity, density, and uniform thickness even inside very narrow holes or trenches. Deposition temperatures are low enough for thermally sensitive substrates such as plastics. Suitable applications of these films include displays, light-emitting diodes, solar cells and gas sensors. Doping SnO2 with aluminum was used to reduce its conductivity, making material suitable as the active semiconductor layer in electron multipliers or transparent transistors. Deposition using the same tin precursor and H2S deposited tin monosulfide, SnS, a material suitable for solar cells.
    • 公开了含有锡或铅的新型环状酰胺。 这些环状酰胺可用于锡或铅及其氧化物,硫化物,硒化物,氮化物,磷化物,碳化物,硅化物或硼化物或其它化合物的原子层沉积或化学气相沉积。 通过环状锡酰胺蒸气和H 2 O 2或NO 2作为氧源反应沉积氧化锡(IV),SnO 2。 即使在非常狭窄的孔或沟槽内,这些膜也具有高纯度,平滑度,透明度,导电性,密度和均匀的厚度。 沉积温度对于热敏基材如塑料来说足够低。 这些膜的合适应用包括显示器,发光二极管,太阳能电池和气体传感器。 使用铝掺杂SnO2以降低其导电性,使得材料适合作为电子倍增器或透明晶体管中的有源半导体层。 沉积使用相同的锡前体和H2S沉积锡一硫化物,SnS,适合太阳能电池的材料。