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    • 4. 发明授权
    • Method for manufacturing a transistor with parallel semiconductor nanofingers
    • 制造具有并联半导体纳米装置的晶体管的方法
    • US08460978B2
    • 2013-06-11
    • US12063288
    • 2006-08-07
    • Philippe CoronelJessy BustosRomain Wacquez
    • Philippe CoronelJessy BustosRomain Wacquez
    • H01L21/00H01L27/01
    • H01L29/785H01L29/42392H01L29/66772
    • A method of producing a transistor having parallel semiconductor nanofingers. The method includes: forming a monocrystalline layer of a semiconductor material on a layer of a subjacent material which can be selectively etched in relation to the monocrystalline layer; etching parallel partitions in the monocrystalline layer and in the subjacent layer and continuing said etching operation in order to hollow out part of the subjacent layer of material; filling the gap between the partitions and the hollowed-out part with a first insulating material; defining a central part of the partitions and removing the first insulating material from around the central part of the monocrystalline layer, thereby forming a finger of semiconductor material; and filling and coating the central part with a conductor material.
    • 一种制造具有并联半导体纳米装置的晶体管的方法。 该方法包括:在可以相对于单晶层选择性地蚀刻的下层材料层上形成半导体材料的单晶层; 蚀刻单晶层和下层中的平行隔板,并继续进行所述蚀刻操作,以便中断部分下层材料; 用第一绝缘材料填充隔板和中空部分之间的间隙; 限定隔板的中心部分,并且从单晶层的中心部分周围去除第一绝缘材料,从而形成半导体材料的手指; 并用导体材料填充和涂覆中心部分。
    • 5. 发明授权
    • Transistor and fabrication process
    • 晶体管和制造工艺
    • US07803668B2
    • 2010-09-28
    • US11710599
    • 2007-02-23
    • Romain WacquezPhilippe CoronelJessy Bustos
    • Romain WacquezPhilippe CoronelJessy Bustos
    • H01L21/335
    • H01L29/42392H01L21/28158H01L29/42384H01L29/66772H01L29/78645H01L29/78654
    • Process for fabricating a transistor, in which an electron-sensitive resist layer lying between at least two semiconductor fingers is formed and said resist lying between at least two wires is converted into a dielectric. For example, in one embodiment of the present disclosure an integrated circuit includes a transistor having an insulating substrate including, for example, based on silicon oxide. Transistor also includes a conducting gate region comprising, for example, TiN or polysilicon, formed on a localized zone of the upper surface of the substrate, and an isolating region, comprising, for example, silicon oxide and surrounding the conducting region. The conducting region is also bounded in the direction normal to the plane of the drawing.
    • 制造其中形成位于至少两个半导体指状物之间的电子敏感抗蚀剂层并且位于至少两条导线之间的所述抗蚀剂的晶体管的工艺被转换为电介质。 例如,在本公开的一个实施例中,集成电路包括具有例如基于氧化硅的绝缘衬底的晶体管。 晶体管还包括形成在衬底的上表面的局部区域上的例如TiN或多晶硅的导电栅极区域,以及包括例如氧化硅并且围绕导电区域的隔离区域。 导电区域也沿垂直于图面平面的方向界定。
    • 6. 发明申请
    • METHOD FOR MANUFACTURING A TRANSISTOR WITH PARALLEL SEMICONDUCTOR NANOFINGERS
    • 用平行半导体纳米ZnO制造晶体管的方法
    • US20100184274A1
    • 2010-07-22
    • US12063288
    • 2006-08-07
    • Philippe CoronelJessy BustosRomain Wacquez
    • Philippe CoronelJessy BustosRomain Wacquez
    • H01L21/762
    • H01L29/785H01L29/42392H01L29/66772
    • A method of producing a transistor having parallel semiconductor nanofingers. The method includes: forming a monocrystalline layer of a semiconductor material on a layer of a subjacent material which can be selectively etched in relation to the monocrystalline layer; etching parallel partitions in the monocrystalline layer and in the subjacent layer and continuing said etching operation in order to hollow out part of the subjacent layer of material; filling the gap between the partitions and the hollowed-out part with a first insulating material; defining a central part of the partitions and removing the first insulating material from around the central part of the monocrystalline layer, thereby forming a finger of semiconductor material; and filling and coating the central part with a conductor material.
    • 一种制造具有并联半导体纳米装置的晶体管的方法。 该方法包括:在可以相对于单晶层选择性地蚀刻的下层材料层上形成半导体材料的单晶层; 蚀刻单晶层和下层中的平行隔板,并继续进行所述蚀刻操作,以便中断部分下层材料; 用第一绝缘材料填充隔板和中空部分之间的间隙; 限定隔板的中心部分,并且从单晶层的中心部分周围去除第一绝缘材料,从而形成半导体材料的手指; 并用导体材料填充和涂覆中心部分。
    • 9. 发明申请
    • METHOD FOR PRODUCING STACKED AND SELF-ALIGNED COMPONENTS ON A SUBSTRATE
    • 在衬底上生产堆叠和自对准组件的方法
    • US20100099233A1
    • 2010-04-22
    • US12577379
    • 2009-10-12
    • Romain WacquezPhilippe CoronelVincent DestefanisJean-Michel Hartmann
    • Romain WacquezPhilippe CoronelVincent DestefanisJean-Michel Hartmann
    • H01L21/762
    • H01L21/84H01L21/76264H01L21/8221
    • The invention relates to a method for producing stacked and self-aligned components on a substrate, comprising the following steps: forming a stack of layers on one face of the substrate, the stack comprising a first sacrificial layer, a second sacrificial layer and a superficial layer, selective etching of a zone of the first sacrificial layer, the second sacrificial layer and the superficial layer forming a bridge above the etched zone of the first sacrificial layer, depositing resin in the etched zone of the first sacrificial layer and on the superficial layer, lithography of the resin to leave remaining at least one zone of resin in the etched zone of the first sacrificial layer, in alignment with at least one resin zone on the superficial layer, replacing the eliminated resin in the etched zone of the first sacrificial layer and on the superficial layer with a material for confining the remaining resin, eliminating the remaining resin zones in the etched zone of the first sacrificial layer and on the superficial layer to provide zones dedicated to the production of components, forming elements of components in the dedicated zones, selective etching of a zone of the second sacrificial layer, the superficial layer forming a bridge above the etched zone of the second sacrificial layer.
    • 本发明涉及一种用于在衬底上制备堆叠和自对准部件的方法,包括以下步骤:在衬底的一个面上形成一叠层,所述堆叠包括第一牺牲层,第二牺牲层和表面 层,选择性蚀刻第一牺牲层的区域,第二牺牲层和表层在第一牺牲层的蚀刻区上形成桥,在第一牺牲层的蚀刻区和表层上沉积树脂 在所述第一牺牲层的所述蚀刻区中保留至少一个树脂区域,以与所述表面层上的至少一个树脂区域对准,替换所述第一牺牲层的所述蚀刻区域中被去除的树脂, 并且在表面层上具有用于限制剩余树脂的材料,消除了第一次牺牲的蚀刻区域中剩余的树脂区域 提供专用于生产部件的区域,在专用区域中形成部件的元件,选择性蚀刻第二牺牲层的区域,在第二蚀刻区域的蚀刻区域之上形成桥接的表面层 牺牲层。