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1. 发明授权

US07259354B2 Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories 有权
标题翻译：通过以圆形和螺旋形轨迹移动精确定时的激光脉冲来处理孔的方法
公开(公告)号：US07259354B2
公开(公告)日：2007-08-21
申请号：US10912525
申请日：2004-08-04
申请人： Robert M. Pailthorp , Weisheng Lei , Hisashi Matsumoto , Glenn Simenson , David A. Watt , Mark A. Unrath , William J. Jordens
发明人： Robert M. Pailthorp , Weisheng Lei , Hisashi Matsumoto , Glenn Simenson , David A. Watt , Mark A. Unrath , William J. Jordens
IPC分类号： B23K26/38
CPC分类号： H05K3/0026 , B23K26/389 , H05K2201/09063
摘要： High speed removal of material from a specimen employs a beam positioner for directing a laser beam axis along various circular and spiral laser tool patterns. A preferred method of material removal entails causing relative movement between the axis of the beam and the specimen, directing the beam axis at an entry segment acceleration and along an entry trajectory to an entry position within the specimen at which laser beam pulse emissions are initiated, moving the beam axis at a circular perimeter acceleration within the specimen to remove material along a circular segment of the specimen, and setting the entry segment acceleration to less than twice the circular perimeter acceleration.
摘要翻译：从样品高速去除材料采用光束定位器，用于沿着各种圆形和螺旋形激光工具图案引导激光束轴线。优选的材料去除方法需要引起梁的轴线和样品之间的相对运动，将束轴线以入口段加速度并沿着入口轨迹引导到在激光束脉冲发射开始的样本内的入口位置，沿着试样中的圆周边加速度移动光束轴，以沿着试样的圆形段移除材料，并将进入段加速度设置为小于圆周边加速度的两倍。

2. 发明授权

US08404998B2 Acousto-optic deflector applications in laser processing of dielectric or other materials 有权
标题翻译：声光偏转器应用于电介质或其他材料的激光加工
公开(公告)号：US08404998B2
公开(公告)日：2013-03-26
申请号：US12790082
申请日：2010-05-28
申请人： Mark A. Unrath , William J. Jordens , James Ismail , Hisashi Matsumoto , Brian J. Lineburg
发明人： Mark A. Unrath , William J. Jordens , James Ismail , Hisashi Matsumoto , Brian J. Lineburg
IPC分类号： B23K26/14 , B23K26/16
CPC分类号： B23K26/032 , B23K26/046 , B23K26/0648 , B23K26/0665 , B23K26/08 , B23K26/082 , B23K26/40 , B23K2101/40 , B23K2103/50
摘要： A laser processing system for micromachining a workpiece includes a laser source to generate laser pulses for processing a feature in a workpiece, a galvanometer-driven (galvo) subsystem to impart a first relative movement of a laser beam spot position along a processing trajectory with respect to the surface of the workpiece, and an acousto-optic deflector (AOD) subsystem to effectively widen a laser beam spot along a direction perpendicular to the processing trajectory. The AOD subsystem may include a combination of AODs and electro-optic deflectors. The AOD subsystem may vary an intensity profile of laser pulses as a function of deflection position along a dither direction to selectively shape the feature in the dither direction. The shaping may be used to intersect features on the workpiece. The AOD subsystem may also provide rastering, galvo error position correction, power modulation, and/or through-the-lens viewing of and alignment to the workpiece.
摘要翻译：用于微加工工件的激光处理系统包括激光源以产生用于处理工件中的特征的激光脉冲，电流计驱动（电流）子系统，以相对于处理轨迹赋予激光束光斑位置的第一相对运动到达工件的表面，以及声光偏转器（AOD）子系统，以沿垂直于处理轨迹的方向有效地加宽激光束点。 AOD子系统可以包括AOD和电光偏转器的组合。 AOD子系统可以根据抖动方向改变作为偏转位置的函数的激光脉冲的强度分布，以选择性地在抖动方向上成形特征。成形可以用于与工件上的特征相交。 AOD子系统还可以提供对工件的扫描，Galvo错误位置校正，功率调制和/或透镜观察并对准工件。

3. 发明申请

US20100147813A1 METHOD FOR LASER PROCESSING GLASS WITH A CHAMFERED EDGE 有权
标题翻译：用于激光加工玻璃与渐变边缘的方法
公开(公告)号：US20100147813A1
公开(公告)日：2010-06-17
申请号：US12336609
申请日：2008-12-17
申请人： Weisheng Lei , Glenn Simenson , Hisashi Matsumoto , Guangyu Li , Jeffery Howerton
发明人： Weisheng Lei , Glenn Simenson , Hisashi Matsumoto , Guangyu Li , Jeffery Howerton
IPC分类号： B23K26/38
CPC分类号： B23K26/40 , B23K2103/50 , B28D1/22 , C03B33/0222 , C03B33/04 , C03B33/082
摘要： A laser machining process is described for laser machining glass or glass-like materials. This process machines articles or features in articles with chamfered edges in one manufacturing operation. Chamfered edges are desirable in glass and glass-like materials because they resist fracturing or chipping and eliminate sharp edges. Producing articles or features in articles in one manufacturing operation is desirable because it can save time and expense by eliminating the need to transfer the article to a separate machine for chamfering after laser machining. Alternatively, it can permit use of less expensive equipment because the same laser used for machining can be used to form the chamfer instead of having a separate process perform the chamfering. Producing chamfers with laser machining results in high quality chamfers without the need for a separate polishing or finishing step.
摘要翻译：描述了激光加工玻璃或玻璃状材料的激光加工工艺。在一个制造操作中，该过程在具有倒角边缘的物品中加工制品或特征。倒角边缘在玻璃和玻璃状材料中是理想的，因为它们抵抗压裂或碎裂并消除锋利的边缘。在一个制造操作中在制品中制造物品或特征是期望的，因为通过在激光加工之后不需要将物品转移到单独的机器进行倒角，因此可以节省时间和费用。或者，它可以允许使用较便宜的设备，因为用于加工的相同的激光可用于形成倒角，而不是具有单独的工艺来执行倒角。使用激光加工生产倒角可以获得高品质的倒角，无需单独的抛光或精加工。

4. 发明申请

US20100078418A1 METHOD OF LASER MICRO-MACHINING STAINLESS STEEL WITH HIGH COSMETIC QUALITY 审中-公开
标题翻译：具有高化妆品质量的激光微加工不锈钢的方法
公开(公告)号：US20100078418A1
公开(公告)日：2010-04-01
申请号：US12413272
申请日：2009-03-27
申请人： Weisheng Lei , Mehmet E. Alpay , Hisashi Matsumoto , Jeffrey Howerton , Guangyu Li , Peter Pirogovsky , Wilson Lu , Glenn Simenson
发明人： Weisheng Lei , Mehmet E. Alpay , Hisashi Matsumoto , Jeffrey Howerton , Guangyu Li , Peter Pirogovsky , Wilson Lu , Glenn Simenson
IPC分类号： B23K26/38
CPC分类号： B23K26/18 , B23K26/009 , B23K26/0622 , B23K26/36 , B23K26/382 , B23K26/40 , B23K2101/34 , B23K2103/05 , B23K2103/10
摘要： A process to laser micro-machine a metal part with a high cosmetic quality surface includes applying a protective coating layer to at least one surface of the part before micro-machining the part with a laser. The protective coating applied to the high quality cosmetic surface can have a thickness of between about 5 mil and about 10 mil, inclusive and have sufficient adhesion strength to adhere to the part without delaminating during processing. The protective coating applied to the machining surface of the part can be a metallic material, such as a metallic foil or tape.
摘要翻译：激光微加工具有高化妆品质量表面的金属部件的方法包括在用激光微加工部件之前，在部件的至少一个表面上施加保护涂层。施加到高质量化妆品表面的保护涂层可以具有约5密耳至约10密耳之间的厚度，并且具有足够的粘附强度以在加工期间粘附到部件上而不会分层。施加到部件的加工表面的保护涂层可以是金属材料，例如金属箔或带。

5. 发明授权

US07605343B2 Micromachining with short-pulsed, solid-state UV laser 有权
标题翻译：用短脉冲固态紫外激光微加工
公开(公告)号：US07605343B2
公开(公告)日：2009-10-20
申请号：US11440697
申请日：2006-05-24
申请人： Weisheng Lei , Glenn Simenson , Hisashi Matsumoto , John Davignon
发明人： Weisheng Lei , Glenn Simenson , Hisashi Matsumoto , John Davignon
IPC分类号： B23K26/38
CPC分类号： H05K3/0035 , B23K26/0624 , B23K26/382 , B23K26/389 , B23K26/40 , B23K2101/35 , B23K2101/40 , B23K2103/08 , B23K2103/10 , B23K2103/12 , B23K2103/14 , B23K2103/172 , B23K2103/26 , B23K2103/42 , B23K2103/50 , B23K2103/52 , H05K3/0038 , H05K3/28
摘要： In some embodiments, laser output including at least one laser pulse having a wavelength shorter than 400 microns and having a pulsewidth shorter than 1,000 picoseconds permits the number of pulses used to clean a bottom surface of a via or the surface of a solder pad to increase process throughput. An oscillator module in cooperation with an amplification module may be used to generate the laser output.
摘要翻译：在一些实施例中，包括至少一个波长短于400微米并具有短于1000皮秒的脉冲宽度的激光脉冲的激光输出允许用于清洁通孔或焊盘表面的底表面的脉冲数增加过程吞吐量。可以使用与放大模块协作的振荡器模块来产生激光输出。

6. 发明申请

US20060027544A1 Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories 有权
标题翻译：通过以圆形和螺旋形轨迹移动精确定时的激光脉冲来处理孔的方法
公开(公告)号：US20060027544A1
公开(公告)日：2006-02-09
申请号：US10912525
申请日：2004-08-04
申请人： Robert Pailthorp , Weisheng Lei , Hisashi Matsumoto , Glenn Simenson , David Watt , Mark Unrath , William Jordens
发明人： Robert Pailthorp , Weisheng Lei , Hisashi Matsumoto , Glenn Simenson , David Watt , Mark Unrath , William Jordens
IPC分类号： B23K26/38
CPC分类号： H05K3/0026 , B23K26/389 , H05K2201/09063
摘要： High speed removal of material from a specimen employs a beam positioner for directing a laser beam axis along various circular and spiral laser tool patterns. A preferred method of material removal entails causing relative movement between the axis of the beam and the specimen, directing the beam axis at an entry segment acceleration and along an entry trajectory to an entry position within the specimen at which laser beam pulse emissions are initiated, moving the beam axis at a circular perimeter acceleration within the specimen to remove material along a circular segment of the specimen, and setting the entry segment acceleration to less than twice the circular perimeter acceleration.
摘要翻译：从样品高速去除材料采用光束定位器，用于沿着各种圆形和螺旋形激光工具图案引导激光束轴线。优选的材料去除方法需要引起梁的轴线和样品之间的相对运动，将束轴线以入口段加速度并沿着入口轨迹引导到在激光束脉冲发射开始的样本内的入口位置，沿着试样中的圆周边加速度移动光束轴，以沿着试样的圆形段移除材料，并将进入段加速度设置为小于圆周边加速度的两倍。

7. 发明申请

US20100301023A1 ACOUSTO-OPTIC DEFLECTOR APPLICATIONS IN LASER PROCESSING OF DIELECTRIC OR OTHER MATERIALS 有权
标题翻译：光电或其他材料的激光加工中的光学偏光器应用
公开(公告)号：US20100301023A1
公开(公告)日：2010-12-02
申请号：US12790082
申请日：2010-05-28
申请人： Mark A. Unrath , William J. Jordens , James Ismail , Hisashi Matsumoto , Brian J. Lineburg
发明人： Mark A. Unrath , William J. Jordens , James Ismail , Hisashi Matsumoto , Brian J. Lineburg
IPC分类号： B23K26/00 , B23K26/073
CPC分类号： B23K26/032 , B23K26/046 , B23K26/0648 , B23K26/0665 , B23K26/08 , B23K26/082 , B23K26/40 , B23K2101/40 , B23K2103/50
摘要： A laser processing system for micromachining a workpiece includes a laser source to generate laser pulses for processing a feature in a workpiece, a galvanometer-driven (galvo) subsystem to impart a first relative movement of a laser beam spot position along a processing trajectory with respect to the surface of the workpiece, and an acousto-optic deflector (AOD) subsystem to effectively widen a laser beam spot along a direction perpendicular to the processing trajectory. The AOD subsystem may include a combination of AODs and electro-optic deflectors. The AOD subsystem may vary an intensity profile of laser pulses as a function of deflection position along a dither direction to selectively shape the feature in the dither direction. The shaping may be used to intersect features on the workpiece. The AOD subsystem may also provide rastering, galvo error position correction, power modulation, and/or through-the-lens viewing of and alignment to the workpiece.
摘要翻译：用于微加工工件的激光处理系统包括激光源以产生用于处理工件中的特征的激光脉冲，电流计驱动（电流）子系统，以相对于处理轨迹赋予激光束光斑位置的第一相对运动到达工件的表面，以及声光偏转器（AOD）子系统，以沿垂直于处理轨迹的方向有效地加宽激光束点。 AOD子系统可以包括AOD和电光偏转器的组合。 AOD子系统可以根据抖动方向改变作为偏转位置的函数的激光脉冲的强度分布，以选择性地形成抖动方向上的特征。成形可以用于与工件上的特征相交。 AOD子系统还可以提供对工件的扫描，Galvo错误位置校正，功率调制和/或透镜观察并对准工件。

8. 发明申请

US20100252959A1 METHOD FOR IMPROVED BRITTLE MATERIALS PROCESSING 审中-公开
标题翻译：改进的脆性材料加工方法
公开(公告)号：US20100252959A1
公开(公告)日：2010-10-07
申请号：US12732020
申请日：2010-03-25
申请人： Weisheng Lei , Glenn Simenson , Hisashi Matsumoto , Guangyu Li , Jeffrey Howerton
发明人： Weisheng Lei , Glenn Simenson , Hisashi Matsumoto , Guangyu Li , Jeffrey Howerton
IPC分类号： B44C1/22 , B29C35/08
CPC分类号： B23K26/40 , B23K2103/50
摘要： An improved method for laser machining features in brittle materials such as glass is presented, wherein a tool path related to a feature is analyzed to determine how many passes are required to laser machine the feature using non-adjacent laser pulses. Laser pulses applied during subsequent passes are located so as to overlap previous laser spot locations by a predetermined overlap amount. In this way no single spot receives excessive laser radiation caused by immediately subsequent laser pulses being applied adjacent to a previous pulse location.
摘要翻译：提出了一种用于脆性材料如玻璃中的激光加工特征的改进方法，其中分析与特征相关的刀具路径，以确定使用不相邻的激光脉冲激光加工特征所需的通过数量。在后续通过期间施加的激光脉冲被定位成与先前的激光光斑位置重叠预定的重叠量。以这种方式，没有单个点接收由紧邻的先前脉冲位置施加的紧随其后的激光脉冲引起的过多的激光辐射。

9. 发明申请

US20100252540A1 METHOD AND APPARATUS FOR BRITTLE MATERIALS PROCESSING 审中-公开
标题翻译：用于脆性材料加工的方法和装置
公开(公告)号：US20100252540A1
公开(公告)日：2010-10-07
申请号：US12753509
申请日：2010-04-02
申请人： Weisheng Lei , Hisashi Matsumoto , Glenn Simenson , Guangyu Li , Jeffrey Howerton , David Childers , Edward Johnson , Jeffrey Albelo
发明人： Weisheng Lei , Hisashi Matsumoto , Glenn Simenson , Guangyu Li , Jeffrey Howerton , David Childers , Edward Johnson , Jeffrey Albelo
IPC分类号： B23K26/00
CPC分类号： B23K26/40 , B23K2103/50
摘要： An improved method for laser machining features in brittle materials 8 such as glass is presented, wherein a tool path 10 related to a feature is analyzed to determine how many passes are required to laser machine the feature using non-adjacent laser pulses 12. Laser pulses 12 applied during subsequent passes are located so as to overlap previous laser spot locations by a predetermined overlap amount. In this way no single spot receives excessive laser radiation caused by immediately subsequent laser pulses 12 being applied adjacent to a previous pulse location.
摘要翻译：提出了一种用于诸如玻璃的脆性材料8中的激光加工特征的改进方法，其中分析与特征相关的工具路径10，以确定使用不相邻的激光脉冲12激光加工特征所需的通过次数。激光脉冲在后续通过期间施加的12被定位成与先前的激光光斑位置重叠预定的重叠量。以这种方式，没有单个点接收由紧邻的先前脉冲位置施加的紧随其后的激光脉冲12引起的过多的激光辐射。

10. 发明申请

US20070272667A1 Micromachining with short-pulsed, solid-state UV laser 有权
标题翻译：用短脉冲固态紫外激光微加工
公开(公告)号：US20070272667A1
公开(公告)日：2007-11-29
申请号：US11440697
申请日：2006-05-24
申请人： Weisheng Lei , Glenn Simenson , Hisashi Matsumoto , John Davignon
发明人： Weisheng Lei , Glenn Simenson , Hisashi Matsumoto , John Davignon
IPC分类号： B23K26/38
CPC分类号： H05K3/0035 , B23K26/0624 , B23K26/382 , B23K26/389 , B23K26/40 , B23K2101/35 , B23K2101/40 , B23K2103/08 , B23K2103/10 , B23K2103/12 , B23K2103/14 , B23K2103/172 , B23K2103/26 , B23K2103/42 , B23K2103/50 , B23K2103/52 , H05K3/0038 , H05K3/28
摘要： In some embodiments, laser output including at least one laser pulse having a wavelength shorter than 400 microns and having a pulsewidth shorter than 1,000 picoseconds permits the number of pulses used to clean a bottom surface of a via or the surface of a solder pad to increase process throughput. An oscillator module in cooperation with an amplification module may be used to generate the laser output.
摘要翻译：在一些实施例中，包括至少一个波长短于400微米并具有短于1000皮秒的脉冲宽度的激光脉冲的激光输出允许用于清洁通孔或焊盘表面的底表面的脉冲数增加过程吞吐量。可以使用与放大模块协作的振荡器模块来产生激光输出。

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