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1. 发明授权

US08237080B2 Method and apparatus for laser drilling holes with Gaussian pulses 有权
标题翻译：具有高斯脉冲的激光钻孔的方法和装置
公开(公告)号：US08237080B2
公开(公告)日：2012-08-07
申请号：US12056824
申请日：2008-03-27
申请人： Jeff Howerton , David Childers , Brian Johansen , Mehmet Emin Alpay
发明人： Jeff Howerton , David Childers , Brian Johansen , Mehmet Emin Alpay
IPC分类号： B23K26/38
CPC分类号： B23K26/38 , B23K26/0622 , B23K26/382 , B23K26/384 , B23K2103/05 , B23K2103/10
摘要： An improved method and apparatus for drilling tapered holes in workpieces with laser pulses is presented which uses defocused laser pulses to machine the holes with specified taper and surface finish while maintaining specified exit diameters and improved system throughput. A system is described which can also drill holes with the desired taper and surface finish without requiring defocused laser pulses.
摘要翻译：提出了一种用于在具有激光脉冲的工件中钻出锥形孔的改进方法和装置，其使用散焦的激光脉冲来加工具有指定锥度和表面光洁度的孔，同时保持指定的出口直径和改善的系统吞吐量。描述了一种系统，其还可以钻出具有期望的锥形和表面光洁度的孔，而不需要散焦的激光脉冲。

2. 发明授权

US08866043B2 Method and apparatus for laser drilling holes with Gaussian pulses 有权
标题翻译：具有高斯脉冲的激光钻孔的方法和装置
公开(公告)号：US08866043B2
公开(公告)日：2014-10-21
申请号：US13539991
申请日：2012-07-02
申请人： Jeff Howerton , David Childers , Brian Johansen , Mehmet Emin Alpay
发明人： Jeff Howerton , David Childers , Brian Johansen , Mehmet Emin Alpay
IPC分类号： B23K26/38 , B23K26/06
CPC分类号： B23K26/38 , B23K26/0622 , B23K26/382 , B23K26/384 , B23K2103/05 , B23K2103/10
摘要： An improved method and apparatus for drilling tapered holes in workpieces with laser pulses is presented which uses defocused laser pulses to machine the holes with specified taper and surface finish while maintaining specified exit diameters and improved system throughput. A system is described which can also drill holes with the desired taper and surface finish without requiring defocused laser pulses.
摘要翻译：提出了一种用于在具有激光脉冲的工件中钻出锥形孔的改进方法和装置，其使用散焦的激光脉冲来加工具有指定锥度和表面光洁度的孔，同时保持指定的出口直径和改善的系统吞吐量。描述了一种系统，其还可以钻出具有期望的锥形和表面光洁度的孔，而不需要散焦的激光脉冲。

3. 发明申请

US20120145686A1 On-The-Fly Manipulation Of Spot Size And Cutting Speed For Real-Time Control Of Trench Depth And Width In Laser Operations 有权
标题翻译：在激光操作中实时控制沟槽深度和宽度的点尺寸和切割速度的实时操作
公开(公告)号：US20120145686A1
公开(公告)日：2012-06-14
申请号：US13399856
申请日：2012-02-17
申请人： Mehmet E. ALPAY , Brian JOHANSEN , David CHILDERS
发明人： Mehmet E. ALPAY , Brian JOHANSEN , David CHILDERS
IPC分类号： B23K26/06
CPC分类号： B23K26/0734 , B23K26/0622 , B23K26/364
摘要： Systems and methods cut trenches of multiple widths in a material using a single pass of a laser beam. A first series of laser pulses cut a work surface of the material at a first cutting speed using a first spot size. In a transition region from a first trench width to a second trench width, a second series of laser pulses sequentially change spot sizes while gradually changing from the first cutting speed to a second cutting speed. Then, a third series of laser pulses continue to cut the work surface at the second cutting speed using a second spot size. The method provides for increased depth control in the transition region. A system uses a selectively adjustable optical component in the laser beam path to rapidly change spot size by adjusting a position of a focal plane with respect to the work surface.
摘要翻译：系统和方法使用单次激光束切割材料中多个宽度的沟槽。第一系列激光脉冲使用第一光斑尺寸以第一切割速度切割材料的工作表面。在从第一沟槽宽度到第二沟槽宽度的过渡区域中，第二系列激光脉冲顺序地改变光斑尺寸，同时从第一切割速度逐渐变化到第二切割速度。然后，第三系列激光脉冲使用第二光点尺寸继续以第二切割速度切割工作表面。该方法提供了在过渡区域中增加的深度控制。系统使用激光束路径中的选择性可调节的光学部件来通过调整焦平面相对于工作表面的位置来快速地改变光斑尺寸。

4. 发明申请

US20090242521A1 ON-THE-FLY MANIPULATION OF SPOT SIZE AND CUTTING SPEED FOR REAL-TIME CONTROL OF TRENCH DEPTH AND WIDTH IN LASER OPERATIONS 有权
标题翻译：实时控制雷射深度和宽度的光点大小和切割速度的飞行操纵
公开(公告)号：US20090242521A1
公开(公告)日：2009-10-01
申请号：US12060043
申请日：2008-03-31
申请人： Mehmet E. Alpay , Brian Johansen , David Childers
发明人： Mehmet E. Alpay , Brian Johansen , David Childers
IPC分类号： B23K26/00
CPC分类号： B23K26/0734 , B23K26/0622 , B23K26/364
摘要： Systems and methods cut trenches of multiple widths in a material using a single pass of a laser beam. A first series of laser pulses cut a work surface of the material at a first cutting speed using a first spot size. In a transition region from a first trench width to a second trench width, a second series of laser pulses sequentially change spot sizes while gradually changing from the first cutting speed to a second cutting speed. Then, a third series of laser pulses continue to cut the work surface at the second cutting speed using a second spot size. The method provides for increased depth control in the transition region. A system uses a selectively adjustable optical component in the laser beam path to rapidly change spot size by adjusting a position of a focal plane with respect to the work surface.
摘要翻译：系统和方法使用单次激光束切割材料中多个宽度的沟槽。第一系列激光脉冲使用第一光斑尺寸以第一切割速度切割材料的工作表面。在从第一沟槽宽度到第二沟槽宽度的过渡区域中，第二系列激光脉冲顺序地改变光斑尺寸，同时从第一切割速度逐渐变化到第二切割速度。然后，第三系列激光脉冲使用第二光点尺寸继续以第二切割速度切割工作表面。该方法提供了在过渡区域中增加的深度控制。系统使用激光束路径中的选择性可调节的光学部件来通过调整焦平面相对于工作表面的位置来快速地改变光斑尺寸。

5. 发明申请

US20080102053A1 Enhanced Antimicrobial Skin Preparation 有权
标题翻译：增强抗菌皮肤准备
公开(公告)号：US20080102053A1
公开(公告)日：2008-05-01
申请号：US11971522
申请日：2008-01-09
申请人： David Childers
发明人： David Childers
IPC分类号： A61K31/79 , A61Q19/00
CPC分类号： A61K31/79 , A61K8/19 , A61K8/34 , A61K8/4913 , A61K8/8152 , A61K8/86 , A61K33/18 , A61K2800/48 , A61Q17/005
摘要： An antimicrobial skin composition comprised of an antimicrobial agent, an alcohol, one or more pH sensitive viscosity builders, a plasticizer and water. Preferably, the viscosity builders of the present invention are comprised of pH sensitive methacrylic polymers which are alcohol compatible and have pH controlled water solubility. The composition combines the advantages of an antimicrobial agent and an alcohol, and has a viscosity of from 100 cp to 1,000. This viscosity is sufficiently low for purposes of dispensing and applying the preparation, yet sufficiently high to cause the solution to remain in the area of the wound and not flow away or pool under the patient. The preparation further forms a water-resistant film that is difficult to remove during wound irrigation, but can be easily removed upon completion of the procedure. In addition, the preparation is fast drying so as to take advantage of the fast high initial kill properties of alcohol. Finally, with the addition of a plasticizer (such as PEG 400), the film formed by the composition resists flaking in medical procedures requiring substantial skin manipulation.
摘要翻译：由抗微生物剂，醇，一种或多种pH敏感性粘度助洗剂，增塑剂和水组成的抗微生物皮肤组合物。优选地，本发明的粘合助洗剂由pH敏感的甲醇聚合物组成，其是醇相容的并且具有pH控制的水溶性。该组合物结合了抗微生物剂和醇的优点，并具有100cp至1,000的粘度。为了分配和施用制剂的目的，该粘度足够低，但足够高以使溶液保留在伤口的区域中，并且不会流动或流下患者。该制剂进一步形成在伤口冲洗期间难以除去的耐水膜，但是可以在手术完成时容易地除去。此外，该制剂是快速干燥的，以利用酒精的快速高的初始杀灭性能。最后，通过添加增塑剂（例如PEG 400），由组合物形成的膜在需要大量皮肤操作的医疗过程中抗剥落。

6. 发明申请

US20120267350A1 METHOD AND APPARATUS FOR LASER DRILLING HOLES WITH GAUSSIAN PULSES 有权
标题翻译：用于激光钻孔的方法和装置与高斯脉冲
公开(公告)号：US20120267350A1
公开(公告)日：2012-10-25
申请号：US13539991
申请日：2012-07-02
申请人： Jeff Howerton , David Childers , Brian Johansen , Mehmet Emin Alpay
发明人： Jeff Howerton , David Childers , Brian Johansen , Mehmet Emin Alpay
IPC分类号： B23K26/00
CPC分类号： B23K26/38 , B23K26/0622 , B23K26/382 , B23K26/384 , B23K2103/05 , B23K2103/10
摘要： An improved method and apparatus for drilling tapered holes in workpieces with laser pulses is presented which uses defocused laser pulses to machine the holes with specified taper and surface finish while maintaining specified exit diameters and improved system throughput. A system is described which can also drill holes with the desired taper and surface finish without requiring defocused laser pulses.
摘要翻译：提出了一种用于在具有激光脉冲的工件中钻出锥形孔的改进方法和装置，其使用散焦的激光脉冲来加工具有指定锥度和表面光洁度的孔，同时保持指定的出口直径和改善的系统吞吐量。描述了一种系统，其还可以钻出具有期望的锥形和表面光洁度的孔，而不需要散焦的激光脉冲。

7. 发明申请

US20090312858A1 METHOD FOR DEFINING SAFE ZONES IN LASER MACHINING SYSTEMS 失效
标题翻译：在激光加工系统中定义安全区的方法
公开(公告)号：US20090312858A1
公开(公告)日：2009-12-17
申请号：US12241413
申请日：2008-09-30
申请人： Mehmet E. Alpay , Heny Sadikin , David Childers
发明人： Mehmet E. Alpay , Heny Sadikin , David Childers
IPC分类号： G06F17/00
CPC分类号： B23K26/38 , B23K26/60
摘要： A method for defining machine cutting path safety zones for use in laser machining devices. The method includes indentifying safety zone positional coordinates in a computer aided design model, using a machine vision system to image the modeled physical machining device, determining the positional difference between the design model safety zone points and the imaged points and converting the design model safety zone coordinates into machine specific coordinates for input into a machining cutting path program.
摘要翻译：一种用于定义用于激光加工设备的机器切割路径安全区域的方法。该方法包括在计算机辅助设计模型中识别安全区位置坐标，使用机器视觉系统对建模的物理加工装置进行成像，确定设计模型安全区域与成像点之间的位置差异，并转换设计模型安全区坐标到机床特定坐标，输入到加工切割路径程序中。

8. 发明授权

US06413921B1 Antimicrobial composition containing parachlorometaxylenol (PCMX) 有权
标题翻译：含有对氯甲ax en酚（PCMX）的抗微生物组合物
公开(公告)号：US06413921B1
公开(公告)日：2002-07-02
申请号：US09630678
申请日：2000-08-01
申请人： David Childers , David Jeng
发明人： David Childers , David Jeng
IPC分类号： A61K740
CPC分类号： A61Q17/005 , A01N31/08 , A61K8/02 , A61K8/0208 , A61K8/347 , A61K8/361 , A61K8/44 , A61K8/463 , A61K8/466 , A61K8/8182 , A61K8/86 , A61K8/922 , A61K2800/75 , A61Q19/00 , A61Q19/10 , A01N25/30 , A01N2300/00
摘要： The present invention provides an antimicrobial composition for disinfection of a skin surface in preparation for surgery. The antimicrobial composition comprises parachlorometaxylenol (PCMX) and an anionic surfactant composition which exhibits both a high degree of antimicrobial efficacy and low skin irritability properties. In a preferred embodiment, the composition comprises an anionic surfactant composition comprising a surfactant having a hydrophobic portion consisting of a linear alkyl and a hydrophilic portion having ethoxylation termination with a sulfonate anionic group, and a sarcosine surfactant. A preferred surfactant composition further comprises a foaming anionic surfactant, such as sodium lauryl sulfate. The antimicrobial composition can be used in skin disinfecting formulations, such as scrub formulations and pre-operative skin disinfecting formulations. In one embodiment, the composition comprises about 3.3% parachlorometaxylenol. The composition can be used as a surgical scrub formulation or in various pre-surgical skin disinfecting products, including sponges, swabs and topical application devices.
摘要翻译：本发明提供了一种用于皮肤表面消毒的抗微生物组合物，用于外科手术。抗微生物组合物包含对氯马克醇（PCMX）和阴离子表面活性剂组合物，其表现出高度的抗微生物效能和低皮肤易怒性。在优选的实施方案中，组合物包含阴离子表面活性剂组合物，其包含具有疏水部分的表面活性剂，所述表面活性剂具有由直链烷基和具有乙氧基化端基的亲水部分与磺酸根阴离子基团组成的疏水部分和肌氨酸表面优选的表面活性剂组合物还包含发泡阴离子表面活性剂，例如十二烷基硫酸钠。抗微生物组合物可用于皮肤消毒制剂，例如擦洗配方和手术前皮肤消毒制剂。在一个实施方案中，组合物包含约3.3％的对氯甲ax en酚。组合物可以用作外科手术擦洗剂或各种手术前皮肤消毒产品，包括海绵，拭子和局部施用装置。

9. 发明授权

US08723076B2 On-the-fly manipulation of spot size and cutting speed for real-time control of trench depth and width in laser operations 有权
标题翻译：实时控制光斑尺寸和切割速度，实时控制激光操作中的沟槽深度和宽度
公开(公告)号：US08723076B2
公开(公告)日：2014-05-13
申请号：US13399856
申请日：2012-02-17
申请人： Mehmet E. Alpay , Brian Johansen , David Childers
发明人： Mehmet E. Alpay , Brian Johansen , David Childers
IPC分类号： B23K26/08 , H01L39/24
CPC分类号： B23K26/0734 , B23K26/0622 , B23K26/364
摘要： Systems and methods cut trenches of multiple widths in a material using a single pass of a laser beam. A first series of laser pulses cut a work surface of the material at a first cutting speed using a first spot size. In a transition region from a first trench width to a second trench width, a second series of laser pulses sequentially change spot sizes while gradually changing from the first cutting speed to a second cutting speed. Then, a third series of laser pulses continue to cut the work surface at the second cutting speed using a second spot size. The method provides for increased depth control in the transition region. A system uses a selectively adjustable optical component in the laser beam path to rapidly change spot size by adjusting a position of a focal plane with respect to the work surface.
摘要翻译：系统和方法使用单次激光束切割材料中多个宽度的沟槽。第一系列激光脉冲使用第一光斑尺寸以第一切割速度切割材料的工作表面。在从第一沟槽宽度到第二沟槽宽度的过渡区域中，第二系列激光脉冲顺序地改变光斑尺寸，同时从第一切割速度逐渐变化到第二切割速度。然后，第三系列激光脉冲使用第二光点尺寸继续以第二切割速度切割工作表面。该方法提供了在过渡区域中增加的深度控制。系统使用激光束路径中的选择性可调节的光学部件来通过调整焦平面相对于工作表面的位置来快速地改变光斑尺寸。

10. 发明授权

US08124911B2 On-the-fly manipulation of spot size and cutting speed for real-time control of trench depth and width in laser operations 有权
标题翻译：实时控制光斑尺寸和切割速度，实时控制激光操作中的沟槽深度和宽度
公开(公告)号：US08124911B2
公开(公告)日：2012-02-28
申请号：US12060043
申请日：2008-03-31
申请人： Mehmet E. Alpay , Brian Johansen , David Childers
发明人： Mehmet E. Alpay , Brian Johansen , David Childers
IPC分类号： B23K26/36
CPC分类号： B23K26/0734 , B23K26/0622 , B23K26/364
摘要： Systems and methods cut trenches of multiple widths in a material using a single pass of a laser beam. A first series of laser pulses cut a work surface of the material at a first cutting speed using a first spot size. In a transition region from a first trench width to a second trench width, a second series of laser pulses sequentially change spot sizes while gradually changing from the first cutting speed to a second cutting speed. Then, a third series of laser pulses continue to cut the work surface at the second cutting speed using a second spot size. The method provides for increased depth control in the transition region. A system uses a selectively adjustable optical component in the laser beam path to rapidly change spot size by adjusting a position of a focal plane with respect to the work surface.
摘要翻译：系统和方法使用单次激光束切割材料中多个宽度的沟槽。第一系列激光脉冲使用第一光斑尺寸以第一切割速度切割材料的工作表面。在从第一沟槽宽度到第二沟槽宽度的过渡区域中，第二系列激光脉冲顺序地改变光斑尺寸，同时从第一切割速度逐渐变化到第二切割速度。然后，第三系列激光脉冲使用第二光点尺寸继续以第二切割速度切割工作表面。该方法提供了在过渡区域中增加的深度控制。系统使用激光束路径中的选择性可调节的光学部件来通过调整焦平面相对于工作表面的位置来快速地改变光斑尺寸。

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