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    • 4. 发明授权
    • Multi-tool positioning system
    • 多功能定位系统
    • US5847960A
    • 1998-12-08
    • US728619
    • 1996-10-10
    • Donald R. CutlerRobert M. PailthorpMark A. UnrathThomas W. RichardsonAlan J. Cable
    • Donald R. CutlerRobert M. PailthorpMark A. UnrathThomas W. RichardsonAlan J. Cable
    • B23K26/02B23K26/08G05B19/39G05D3/12H05K3/00G06F19/00G06G7/64G06G7/66
    • B23K26/08B23K26/082B23K26/083B23K26/0853G05B19/39H05K3/0038G05B2219/34047G05B2219/34391G05B2219/36029G05B2219/41331G05B2219/42209G05B2219/42219G05B2219/45041G05B2219/45139H05K2203/0165H05K2203/108H05K3/0008H05K3/0017
    • A multi-rate, multi-head positioner (150) receives and processes unpanelized positioning commands to actuate slow stages (56, 58) and multiple fast stages (154) that are mounted on one of the slow stages to simultaneously position multiple tools (156) relative to target locations (162) on multiple associated workpieces (152). Each of the fast stages is coupled to a fast stage signal processor (172) that provides corrected position data to each fast stage positioner to compensate for fast stage nonlinearities and workpiece placement, offset, rotation, and dimensional variations among the multiple workpieces. When cutting blind via holes in etched circuit boards (ECBs), improved throughput and process yield are achieved by making half of the tools ultraviolet ("UV") lasers, which readily cut conductor and dielectric layers, and making the other half of the tools are infrared ("IR") lasers, which readily cut only dielectric layers. The UV lasers are controlled to cut an upper conductor layer and a portion of an underlying dielectric layer, and the IR lasers are controlled to cut the remaining dielectric layer without cutting through or damaging a second underlying conductor layer. The throughput is increased by cutting conductor layers in unprocessed ECBs while concurrently cutting dielectric layers in ECBs that have already had their conductor layer cut. The process yield is increased by performing a workpiece calibration prior to each cutting step to account for any ECB placement, offset, rotation, and dimensional variations.
    • 多速率多头定位器(150)接收和处理未通用的定位命令以致动缓慢级(56,58)和多个快速级(154),所述缓慢级(56,58)和多级快速级(154)安装在所述慢速级中的一级以同时定位多个工具 )相对于多个相关工件(152)上的目标位置(162)。 每个快速级耦合到快速级信号处理器(172),其向每个快速定位器提供校正的位置数据,以补偿多个工件之间的快速阶段非线性和工件放置,偏移,旋转和尺寸变化。 在蚀刻电路板(ECB)中通过盲孔切割盲孔时,通过制造一半的工具紫外线(“UV”)激光器可以实现提高的吞吐量和工艺产量,这些激光器易于切割导体和介电层,并使另一半的工具 是红外线(“IR”)激光器,其易于切割电介质层。 控制UV激光器以切割上导体层和底层电介质层的一部分,并且IR激光器被控制以切割剩余的电介质层而不切割或损坏第二下面的导体层。 通过在未加工的ECB中切割导体层,同时切割已经具有导体层切割的ECB中的电介质层,从而提高了生产量。 通过在每个切割步骤之前执行工件校准以考虑任何ECB放置,偏移,旋转和尺寸变化来增加工艺屈服。
    • 7. 发明授权
    • Compound switching matrix for probing and interconnecting devices under
test to measurement equipment
    • 用于测试和互连测试设备的复合开关矩阵
    • US06100815A
    • 2000-08-08
    • US998156
    • 1997-12-24
    • Robert M. Pailthorp
    • Robert M. Pailthorp
    • G01R31/00G01R1/073H01C17/22H01C17/242H01H47/00H01H67/24H01H67/30H04Q19/00
    • H01H67/30H01C17/242G01R1/07385
    • A compound switching matrix (30) operates in cooperation with a resistance measuring system (20) and a laser (22) to quickly and accurately trim resistors (12) to predetermined values while they are being measured. The compound switching matrix is implemented with dry reed relays (34-81, 101-164) and includes a probe switching matrix (90-97) and a configuration matrix (32) that reduce the average number of relay contacts required per probe to implement two-, three-, and four-terminal measurements with or without guarding. Moreover, the separate probe switching and measurement configuration matrices effectively separate the high and low sides of the measurement to reduce the effects of stray resistances and capacitances on measurement speed and accuracy. A switchable grounding configuration (82-89) further improves measurement accuracy. The compound switching matrix of this invention enables sequential resistance measurements of individual resistors in the array, with two-, three-, and four-terminal measurement configurations being adapted to resistors having values ranging from less than 0.1 ohm to greater than 100 Megohms.
    • 复合开关矩阵(30)与电阻测量系统(20)和激光器(22)配合工作,以在电阻器(12)被测量时将电阻器(12)快速和精确地修整到预定值。 复合开关矩阵采用干簧继电器(34-81,101-164)实现,并包括一个探针开关矩阵(90-97)和一个配置矩阵(32),可以减少每个探针实现的继电器触点平均次数 两端,三端和四端测量,带或不带保护。 此外,单独的探头开关和测量配置矩阵有效地分离了测量的高低侧,以减少杂散电阻和电容对测量速度和精度的影响。 可切换接地配置(82-89)进一步提高了测量精度。 本发明的复合开关矩阵能够对阵列中的各个电阻器进行顺序电阻测量,其中两个,三个和四端测量配置适用于范围从小于0.1欧姆到大于100兆欧的值的电阻器。
    • 8. 发明授权
    • Resolving thermoelectric potentials during laser trimming of resistors
    • 在电阻激光微调期间解决热电势
    • US07667159B2
    • 2010-02-23
    • US11218283
    • 2005-08-31
    • Robert M. PailthorpBrandon McCurry
    • Robert M. PailthorpBrandon McCurry
    • B23K26/36
    • H01C17/242B23K26/0006B23K26/0624B23K26/066B23K26/351B23K26/361B23K2103/50B23K2103/52
    • Thermoelectric effects that occur during laser trimming of resistors (20) are resolved by taking voltage measurements. The voltage attributed to laser heating on a resistor (20) during a low-power simulated trim (10) is used to determine a relatively thermal-neutral location (18) on the resistor (20). A trimming-to-value operation can then be performed on all like resistors (20). Voltage measurements can also be taken before and after every pulse in a trimming operation to establish thermal deviation information that can be used to offset the desired trim value against which resistor measurement values are compared. Spatially distant or nonadjacent resistors (20) in a row or column can also be trimmed sequentially to minimize heating effects that might otherwise distort resistance values on adjacent or nearby resistors (20).
    • 在电阻(20)的激光微调期间发生的热电效应通过采取电压测量来解决。 用于在低功率模拟微调(10)期间归因于电阻器(20)上的激光加热的电压用于确定电阻器(20)上的相对热中性位置(18)。 然后可以对所有类似的电阻器(20)执行修整到值的操作。 也可以在修整操作中的每个脉冲之前和之后进行电压测量,以建立热偏差信息,该热偏差信息可用于抵消与哪个电阻测量值进行比较的期望的微调值。 也可以顺序修剪行或列中的空间较远或不相邻的电阻器(20),以最小化否则可能在相邻或附近的电阻器(20)上扭曲电阻值的加热效应。