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    • 3. 发明授权
    • Semiconductor device and method of fabricating the same
    • 半导体装置及其制造方法
    • US06975001B2
    • 2005-12-13
    • US10163984
    • 2002-06-06
    • Risho KohYukishige SaitoJong-Wook LeeHisashi Takemura
    • Risho KohYukishige SaitoJong-Wook LeeHisashi Takemura
    • H01L21/28H01L21/8238H01L21/84H01L27/08H01L27/092H01L27/12H01L29/786H01L27/01
    • H01L27/1203H01L21/84
    • A semiconductor device includes (a) a semiconductor layer formed on an electrically insulating layer, (b) a gate insulating film formed on the semiconductor layer, (c) a gate electrode formed on the gate insulating film, and (d) a field insulating film formed on the semiconductor layer for defining a region in which a semiconductor device is to be fabricated. The semiconductor layer includes (a1) source and drain regions formed in the semiconductor layer around the gate electrode, the source and drain regions containing first electrically conductive type impurity, (a2) a body contact region formed in the semiconductor layer, the body contact region containing second electrically conductive type impurity, and (a3) a carrier path region formed in the semiconductor layer such that the carrier path region does not make contact with the source and drain regions, but makes contact with the body contact region, the carrier path region containing second electrically conductive type impurity.
    • 半导体器件包括(a)形成在电绝缘层上的半导体层,(b)形成在半导体层上的栅极绝缘膜,(c)形成在栅极绝缘膜上的栅电极,以及(d)场绝缘 在半导体层上形成用于限定要制造半导体器件的区域的膜。 半导体层包括(a1)形成在栅极周围的半导体层中的源极和漏极区,源极和漏极区包含第一导电型杂质,(a2)形成在半导体层中的体接触区域, 包含第二导电型杂质,以及(a3)形成在半导体层中的载流子路径区域,使得载流子路径区域不与源区域和漏极区域接触,但与体接触区域接触,载体路径区域 含有第二导电型杂质。
    • 4. 发明授权
    • Vertical-type non-volatile memory devices and methods of manufacturing the same
    • 垂直型非易失性存储器件及其制造方法
    • US08236650B2
    • 2012-08-07
    • US12686065
    • 2010-01-12
    • Yong-Hoon SonJong-Wook Lee
    • Yong-Hoon SonJong-Wook Lee
    • H01L21/336
    • H01L27/11568H01L21/8221H01L27/0688H01L27/11556
    • In a semiconductor device, and a method of manufacturing thereof, the device includes a substrate of single-crystal semiconductor material extending in a horizontal direction and a plurality of interlayer dielectric layers on the substrate. A plurality of gate patterns are provided, each gate pattern being between a neighboring lower interlayer dielectric layer and a neighboring upper interlayer dielectric layer. A vertical channel of single-crystal semiconductor material extends in a vertical direction through the plurality of interlayer dielectric layers and the plurality to of gate patterns, a gate insulating layer being between each gate pattern and the vertical channel that insulates the gate pattern from the vertical channel.
    • 在半导体器件及其制造方法中,该器件包括在水平方向上延伸的单晶半导体材料的衬底和在衬底上的多个层间电介质层。 提供多个栅极图案,每个栅极图案位于相邻的下层间介电层和相邻的上层间电介质层之间。 单晶半导体材料的垂直沟道在垂直方向上延伸穿过多个层间电介质层和多个栅极图案,栅极绝缘层位于每个栅极图案和垂直沟道之间,其将栅极图案与垂直沟道绝缘 渠道。
    • 8. 发明申请
    • Vertical type semiconductor device
    • 垂直型半导体器件
    • US20100109079A1
    • 2010-05-06
    • US12588948
    • 2009-11-03
    • Yong-Hoon SonJong-Wook LeeJong-Hyuk Kang
    • Yong-Hoon SonJong-Wook LeeJong-Hyuk Kang
    • H01L29/78
    • H01L29/7827H01L29/66666
    • A vertical pillar semiconductor device may include a substrate, a group of channel patterns, a gate insulation layer pattern and a gate electrode. The substrate may be divided into an active region and an isolation layer. A first impurity region may be formed in the substrate corresponding to the active region. The group of channel patterns may protrude from a surface of the active region and may be arranged parallel to each other. A second impurity region may be formed on an upper portion of the group of channel patterns. The gate insulation layer pattern may be formed on the substrate and a sidewall of the group of channel patterns. The gate insulation layer pattern may be spaced apart from an upper face of the group of channel patterns. The gate electrode may contact the gate insulation layer and may enclose a sidewall of the group of channel patterns.
    • 垂直柱半导体器件可以包括衬底,沟道图案组,栅极绝缘层图案和栅电极。 衬底可分为有源区和隔离层。 可以在对应于有源区的衬底中形成第一杂质区。 通道图案组可以从有源区域的表面突出并且可以彼此平行地布置。 第二杂质区可以形成在沟道图案组的上部。 栅极绝缘层图案可以形成在衬底和沟道图案组的侧壁上。 栅极绝缘层图案可以与沟道图案组的上表面间隔开。 栅电极可以接触栅极绝缘层并且可以包围沟道图案组的侧壁。