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1. 发明授权

US5639691A Copper pellet for reducing electromigration effects associated with a conductive via in a semiconductor device 失效
公开(公告)号：US5639691A
公开(公告)日：1997-06-17
申请号：US590781
申请日：1996-01-24
申请人： Richard K. Klein , Darrell M. Erb , Steven Avanzino , Robin Cheung , Scott Luning , Bryan Tracy , Subhash Gupta , Ming-Ren Lin
发明人： Richard K. Klein , Darrell M. Erb , Steven Avanzino , Robin Cheung , Scott Luning , Bryan Tracy , Subhash Gupta , Ming-Ren Lin
IPC分类号： H01L21/768 , H01L21/283
CPC分类号： H01L21/76805 , H01L21/76877 , Y10S257/915 , Y10S438/927
摘要： A multilayer semiconductor structure includes a conductive via. The conductive via includes a pellet of metal having a high resistance to electromigration. The pellet is made from a conformal layer of copper or gold deposited over the via to form a copper or gold reservoir or contact located in the via. A barrier layer is provided between the reservoir and an insulating layer to prevent the pellet from diffusing into the insulating layer. The pellet can be formed by selective deposition or by etching a conformal layer. The conformal layer can be deposited by sputtering, collimated sputtering, chemical vapor deposition (CVD), dipping, evaporating, or by other means. The barrier layer and pellet may be etched by anisotropic dry etching, plasma-assisted etching, or other layer removal techniques.

2. 发明授权

US5770519A Copper reservoir for reducing electromigration effects associated with a conductive via in a semiconductor device 失效
标题翻译：用于减少与半导体器件中的导电通孔相关的电迁移效应的铜储存器
公开(公告)号：US5770519A
公开(公告)日：1998-06-23
申请号：US464305
申请日：1995-06-05
申请人： Richard K. Klein , Darrell Erb , Steven Avanzino , Robin Cheung , Scott Luning , Bryan Tracy , Subhash Gupta , Ming-Ren Lin
发明人： Richard K. Klein , Darrell Erb , Steven Avanzino , Robin Cheung , Scott Luning , Bryan Tracy , Subhash Gupta , Ming-Ren Lin
IPC分类号： H01L21/768 , H01L23/522 , H01L23/532 , H01L21/4763 , H01L21/44
CPC分类号： H01L21/76831 , H01L21/76805 , H01L21/76843 , H01L21/76844 , H01L21/76877 , H01L23/5226 , H01L23/53223 , H01L2924/0002
摘要： A multilayer semiconductor structure includes a conductive via. The conductive via includes a reservoir of metal having a high resistance to electromigration. The reservoir is made from a conformal layer of copper, or gold deposited over the via to form a copper, or gold plug located in the via. A barrier layer is provided between the reservoir and an insulating layer to prevent the reservoir from diffusing into the insulating layer. The barrier layer and reservoir may be deposited by sputtering, collimated sputtering, chemical vapor deposition (CVD), dipping, evaporating, or by other means. The barrier layer and reservoir may be etched by anisotropic dry etching, plasma-assisted etching, or other layer removal techniques.
摘要翻译：多层半导体结构包括导电通孔。导电通孔包括具有高抗电迁移性的金属储存器。储存器由铜的共形层或沉积在通孔上的金形成，以形成位于通孔中的铜或金塞。在储存器和绝缘层之间设置阻挡层，以防止储存器扩散到绝缘层中。可以通过溅射，准直溅射，化学气相沉积（CVD），浸渍，蒸发或其它方式沉积阻挡层和储层。可以通过各向异性干蚀刻，等离子体辅助蚀刻或其它层去除技术来蚀刻阻挡层和储存器。

3. 发明授权

US5646448A Copper pellet for reducing electromigration effects associated with a conductive via in a semiconductor device 失效
标题翻译：用于减少与半导体器件中的导电通孔相关的电迁移效应的铜芯片
公开(公告)号：US5646448A
公开(公告)日：1997-07-08
申请号：US699821
申请日：1996-08-19
申请人： Richard K. Klein , Darrell Erb , Steven Avanzino , Robin Cheung , Scott Luning , Bryan Tracy , Subhash Gupta , Ming-Ren Lin
发明人： Richard K. Klein , Darrell Erb , Steven Avanzino , Robin Cheung , Scott Luning , Bryan Tracy , Subhash Gupta , Ming-Ren Lin
IPC分类号： H01L21/768 , H01L23/522 , H01L23/532
CPC分类号： H01L21/76805 , H01L21/76877 , Y10S257/915 , Y10S438/927
摘要： A multilayer semiconductor structure includes a conductive via. The conductive via includes a pellet of metal having a high resistance to electromigration. The pellet is made from a conformal layer of copper or gold deposited over the via to form a copper or gold reservoir or contact located in the via. A barrier layer is provided between the reservoir and an insulating layer to prevent the pellet from diffusing into the insulating layer. The pellet can be formed by selective deposition or by etching a conformal layer. The conformal layer can be deposited by sputtering, collimated sputtering, chemical vapor deposition (CVD), dipping, evaporating, or by other means. The barrier layer and pellet may be etched by anisotropic dry etching, plasma-assisted etching, or other layer removal techniques.
摘要翻译：多层半导体结构包括导电通孔。导电通孔包括具有高抗电迁移性的金属颗粒。沉淀物由沉积在通孔上的铜或金的保形层制成，以形成位于通孔中的铜或金储存器或触点。在储存器和绝缘层之间设置阻挡层以防止颗粒扩散到绝缘层中。颗粒可以通过选择性沉积或通过蚀刻保形层形成。可以通过溅射，准直溅射，化学气相沉积（CVD），浸渍，蒸发或其它方式沉积共形层。可以通过各向异性干蚀刻，等离子体辅助蚀刻或其它层去除技术来蚀刻阻挡层和颗粒。

4. 发明授权

US5614765A Self aligned via dual damascene 失效
标题翻译：通过双镶嵌自对准
公开(公告)号：US5614765A
公开(公告)日：1997-03-25
申请号：US478319
申请日：1995-06-07
申请人： Steven Avanzino , Subhash Gupta , Rich Klein , Scott D. Luning , Ming-Ren Lin
发明人： Steven Avanzino , Subhash Gupta , Rich Klein , Scott D. Luning , Ming-Ren Lin
IPC分类号： H01L21/60 , H01L21/768 , H01L23/522 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L21/76831 , H01L21/76807 , H01L21/76877 , H01L21/76897 , H01L23/5226 , H01L2221/1036 , H01L2924/0002
摘要： An interconnection level of conductive lines and connecting vias separated by insulation for integrated circuits and substrate carriers for semiconductor devices using dual damascene with only one mask pattern for the formation of both the conductive lines and vias. The mask pattern of conductive lines contains laterally enlarged areas where the via openings are to formed in the insulating material. After the conductive line openings with laterally enlarged areas are created, the openings are filled with a conformal material whose etch selectivity is substantially less than the etch selectivity of the insulating material to the enchant for etching the insulating material and whose etch selectivity is substantially greater than the insulating material to its enchant. The conformal material is anisotropically etched to form sidewalls in the enlarged area and remove the material between the sidewalls but leave material remaining in the parts of the conductive lines openings. The sidewalls serve as self aligned mask for etching via openings. The conformal material is either a conductive material which is left in place after the via openings are formed or an insulating material which is removed. In the former, the partially filled conductive line openings are filled with additional conductive material along with the via, which is either the same or different conductive material. In the latter, the conductive line openings and vias are filled with the same conductive material.
摘要翻译：用于集成电路和用于半导体器件的衬底载体的绝缘分隔的导线和连接通孔的互连级别，使用双镶嵌仅具有一个掩模图案以形成导电线和通孔。导电线的掩模图案包含在绝缘材料中要形成通孔开口的横向扩大区域。在产生具有横向扩大区域的导电线路开口之后，开口用适形材料填充，其保护材料的蚀刻选择性基本上小于绝缘材料对用于蚀刻绝缘材料的附魔的蚀刻选择性，并且其蚀刻选择性基本上大于绝缘材料到其附魔。保形材料被各向异性地蚀刻以在扩大区域中形成侧壁并且移除侧壁之间的材料，而留下留在导电线开口部分中的材料。侧壁用作通过开口蚀刻的自对准掩模。保形材料是导电材料，其在形成通孔开口之后留在适当位置或者被去除的绝缘材料。在前者中，部分填充的导电线路开口与另外的导电材料一起填充，该通孔是相同或不同的导电材料。在后者中，导电线路开口和通孔用相同的导电材料填充。

5. 发明授权

US5686354A Dual damascene with a protective mask for via etching 失效
标题翻译：双镶嵌带防蚀口罩，用于通孔蚀刻
公开(公告)号：US5686354A
公开(公告)日：1997-11-11
申请号：US478324
申请日：1995-06-07
申请人： Steven Avanzino , Subhash Gupta , Rich Klein , Scott D. Luning , Ming-Ren Lin
发明人： Steven Avanzino , Subhash Gupta , Rich Klein , Scott D. Luning , Ming-Ren Lin
IPC分类号： H01L21/768 , H01L21/28
CPC分类号： H01L21/76831 , H01L21/76807
摘要： A dual damascene method of fabricating an interconnection level of conductive lines and connecting vias separated by insulation for integrated circuits and substrate carriers for semiconductor devices using a thin protective via mask to form the via openings. A conductive line mask pattern is used to form conductive line openings in an insulating layer. Next, a thin protective layer of conformal material is deposited in the conducive line opening. The protective layer and the insulating layer each have etch resistance to others etchant. Using a via mask pattern, openings are etching the protective layer with the insulating layer serving as and etch stop. Next via openings are etched in the insulating material using the openings in the thin protective layer as the etch mask. If the protective layer is a conductive material, it is removed from the surface of the insulating layer either before or after the conductive line and via openings are filled with a conductive material. If the protective material is an insulating material, it is entirely removed before filling the conductive line and via openings conductive material.
摘要翻译：一种双镶嵌方法，用于制造导线的互连级别并且连接用于集成电路的绝缘和用于半导体器件的衬底载体的通孔，其使用薄的保护性通孔掩模形成通孔。导电线掩模图案用于在绝缘层中形成导电线路开口。接下来，在导电线路开口中沉积有保形材料的薄保护层。保护层和绝缘层各自具有对其它蚀刻剂的耐蚀刻性。使用通孔掩模图案，开口蚀刻保护层，绝缘层用作蚀刻停止。接下来通过开口被蚀刻在绝缘材料中，使用薄保护层中的开口作为蚀刻掩模。如果保护层是导电材料，则在导电线之前或之后将其从绝缘层的表面去除，并且通孔开口填充有导电材料。如果保护材料是绝缘材料，则在填充导电线和通孔开口导电材料之前将其完全去除。

6. 发明授权

US5795823A Self aligned via dual damascene 失效
标题翻译：通过双镶嵌自对准
公开(公告)号：US5795823A
公开(公告)日：1998-08-18
申请号：US752807
申请日：1996-11-20
申请人： Steven Avanzino , Subhash Gupta , Rich Klein , Scott D. Luning , Ming-Ren Lin
发明人： Steven Avanzino , Subhash Gupta , Rich Klein , Scott D. Luning , Ming-Ren Lin
IPC分类号： H01L21/60 , H01L21/768 , H01L23/522 , H01L21/441
CPC分类号： H01L21/76831 , H01L21/76807 , H01L21/76877 , H01L21/76897 , H01L23/5226 , H01L2221/1036 , H01L2924/0002
摘要： A method of fabricating an interconnection level of conductive lines and connecting vias separated by insulation for integrated circuits and substrate carriers for semiconductor devices using dual damascene with only one mask pattern for the formation of both the conductive lines and vias. The mask pattern of conductive lines contains laterally enlarged areas where the via openings are to formed in the insulating material. After the conductive line openings with laterally enlarged areas are created, the openings are filled with a conformal material whose etch selectivity is substantially less than the etch selectivity of the insulating material to the enchant for etching the insulating material and whose etch selectivity is substantially greater than the insulating material to its enchant. The conformal material is anisotropically etched to form sidewalls in the enlarged area and remove the material between the sidewalls but leave material remaining in the parts of the conductive lines openings. The sidewalls serve as self aligned mask for etching via openings. The conformal material is either a conductive material which is left in place after the via openings are formed or an insulating material which is removed. In the former, the partially filled conductive line openings are filled with additional conductive material along with the via, which is either the same or different conductive material. In the latter, the conductive line openings and vias are filled with the same conductive material.
摘要翻译：一种用于集成电路和用于半导体器件的衬底载体的绝缘体分隔开的导线的连接通孔和通孔的方法，其中使用双镶嵌仅具有一个用于形成导电线和通孔的掩模图案。导电线的掩模图案包含在绝缘材料中要形成通孔开口的横向扩大区域。在产生具有横向扩大区域的导电线路开口之后，开口用适形材料填充，其保护材料的蚀刻选择性基本上小于绝缘材料对用于蚀刻绝缘材料的附魔的蚀刻选择性，并且其蚀刻选择性基本上大于绝缘材料到其附魔。保形材料被各向异性地蚀刻以在扩大区域中形成侧壁并且移除侧壁之间的材料，而留下留在导电线开口部分中的材料。侧壁用作通过开口蚀刻的自对准掩模。保形材料是导电材料，其在形成通孔开口之后留在适当位置或者被去除的绝缘材料。在前者中，部分填充的导电线路开口与另外的导电材料一起填充，该通孔是相同或不同的导电材料。在后者中，导电线路开口和通孔用相同的导电材料填充。

7. 发明授权

US5705430A Dual damascene with a sacrificial via fill 失效
标题翻译：双镶嵌与牺牲通过填充
公开(公告)号：US5705430A
公开(公告)日：1998-01-06
申请号：US486777
申请日：1995-06-07
申请人： Steven Avanzino , Subhash Gupta , Rich Klein , Scott D. Luning , Ming-Ren Lin
发明人： Steven Avanzino , Subhash Gupta , Rich Klein , Scott D. Luning , Ming-Ren Lin
IPC分类号： H01L21/768 , H01L21/44
CPC分类号： H01L21/76808 , H01L2221/1031
摘要： A dual damascene method of fabricating an interconnection level of conductive lines and connecting vias separated by insulation for integrated circuits and substrate carriers for semiconductor devices using a sacrificial via fill. A first layer of insulating material is formed with via openings. The openings are filled with a sacrificial removable material. A second layer of insulating material is deposed on the first layer. In one embodiment, the etch selectivity to the etchant of the second layer is essentially the same as the sacrificial via fill and, preferably, is substantially higher than second layer. Using a conductive line pattern aligned with the via openings, conductive line openings are etched in the second insulating layer and, during etching, the sacrificial fill is removed from the via openings. In a second embodiment, the sacrificial material is not etchable by the etchant for forming the conductive line openings and, after formation of the conductive line openings, the sacrificial material is removed with an etchant to which the first insulating layer is resistive or less selective. A conductive material now is deposited in the conductive line and via openings.
摘要翻译：一种双镶嵌方法，用于制造用于集成电路的绝缘体分隔开的导电线路的互连电平和用于半导体器件的衬底载体的通孔，其使用牺牲通孔填充物。第一层绝缘材料形成有通孔。开口填充有牺牲可移除材料。在第一层上放置第二层绝缘材料。在一个实施例中，对第二层的蚀刻剂的蚀刻选择性基本上与牺牲通孔填充相同，并且优选地基本上高于第二层。使用与通孔开口对准的导电线图案，在第二绝缘层中蚀刻导电线开口，并且在蚀刻期间，将牺牲填充物从通孔开口移除。在第二实施例中，牺牲材料不可蚀刻用于形成导电线路开口的蚀刻剂，并且在形成导电线路开口之后，用第一绝缘层具有电阻或较小选择性的蚀刻剂去除牺牲材料。导电材料现在沉积在导电线和通孔中。

8. 发明授权

US5691238A Subtractive dual damascene 失效
标题翻译：扣除双镶嵌
公开(公告)号：US5691238A
公开(公告)日：1997-11-25
申请号：US478321
申请日：1995-06-07
申请人： Steven Avanzino , Subhash Gupta , Rich Klein , Scott D. Luning , Ming-Ren Lin
发明人： Steven Avanzino , Subhash Gupta , Rich Klein , Scott D. Luning , Ming-Ren Lin
IPC分类号： H01L21/768 , H01L23/522 , H01L21/44
CPC分类号： H01L23/5226 , H01L21/76807 , H01L21/76813 , H01L21/76877 , H01L21/76885 , H01L2924/0002
摘要： A method of fabricating an interconnection level of conductive lines and connecting vias separated by insulation for integrated circuits and substrate carriers for semiconductor devices using a reverse damascene in the formation of the conductive lines and vias. A conductive line pattern is first used to etch completely through the layer to form conductive line openings. The openings are completely filled with a conductive material and planarized so that the surfaces of the conductive material and the insulating layer are coplanar. A via pattern is aligned perpendicular to the conductive lines and the conductive material is etched half way through the conductive lines in other than the areas covered by the via pattern. The openings thus created in the upper portion of the conductive lines are filled with insulating material to complete the dual damascene interconnection level with the conductive lines in the lower portion of the insulating layer and upwardly projecting vias in the upper portion of the layer. In addition, a triple damascene layer is formed by starting with an insulating layer about one-third thicker than normal and by combining the standard dual damascene method with the above described method. The resulting interconnection level structure comprises conductive lines having upwardly and downwardly projecting vias.
摘要翻译：一种制造导线的互连电平的方法，以及用于集成电路的绝缘和用于半导体器件的衬底载体分离的通孔的方法，其使用反向镶嵌来形成导电线和通孔。首先使用导电线图案来完全蚀刻该层以形成导电线开口。开口完全被导电材料填充并平坦化，使得导电材料和绝缘层的表面是共面的。通孔图案垂直于导电线对齐，并且导电材料被除了通孔图案覆盖的区域之外的一半蚀刻通过导电线。由此在导线的上部形成的开口用绝缘材料填充，以完成与绝缘层的下部中的导电线和层的上部中的向上突出的通孔的双镶嵌互连水平。此外，通过从绝对层开始比正常厚约三分之一的厚度并通过将标准双镶嵌方法与上述方法组合来形成三镶嵌层。所产生的互连级联结构包括具有向上和向下突出的通孔的导线。

9. 发明授权

US5635423A Simplified dual damascene process for multi-level metallization and interconnection structure 失效
标题翻译：用于多层次金属化和互连结构的简化双镶嵌工艺
公开(公告)号：US5635423A
公开(公告)日：1997-06-03
申请号：US320516
申请日：1994-10-11
申请人： Richard J. Huang , Angela Hui , Robin Cheung , Mark Chang , Ming-Ren Lin
发明人： Richard J. Huang , Angela Hui , Robin Cheung , Mark Chang , Ming-Ren Lin
IPC分类号： H01L21/768 , H01L21/44
CPC分类号： H01L21/7681 , H01L21/76807 , H01L21/76813
摘要： A semiconductor device containing an interconnection structure having a reduced interwiring spacing is produced by a modified dual damascene process. In one embodiment, an opening for a via is initially formed in a second insulative layer above a first insulative layer with an etch stop layer therebetween. A larger opening for a trench is then formed in the second insulative layer while simultaneously extending the via opening through the etch stop layer and first insulative layer. The trench and via are then simultaneously filled with conductive material.
摘要翻译：通过改进的双镶嵌工艺产生包含具有减小的布线间距的互连结构的半导体器件。在一个实施例中，用于通孔的开口最初形成在第一绝缘层之上的第二绝缘层中，其间具有蚀刻停止层。然后在第二绝缘层中形成用于沟槽的较大开口，同时使通孔开口延伸穿过蚀刻停止层和第一绝缘层。沟槽和通孔然后同时填充导电材料。

10. 发明授权

US07422961B2 Method of forming isolation regions for integrated circuits 有权
标题翻译：形成集成电路隔离区的方法
公开(公告)号：US07422961B2
公开(公告)日：2008-09-09
申请号：US10389456
申请日：2003-03-14
申请人： Haihong Wang , Minh-Van Ngo , Qi Xiang , Paul R. Besser , Eric N. Paton , Ming-Ren Lin
发明人： Haihong Wang , Minh-Van Ngo , Qi Xiang , Paul R. Besser , Eric N. Paton , Ming-Ren Lin
IPC分类号： H01L21/762
CPC分类号： H01L21/76224 , H01L21/823481 , H01L29/1054
摘要： A method of manufacturing an integrated circuit (IC) utilizes a shallow trench isolation (STI) technique. The shallow trench isolation technique is used in strained silicon (SMOS) process. The liner for the trench is formed from a semiconductor or metal layer which is deposited in a low temperature process which reduces germanium outgassing. The low temperature process can be a CVD process.
摘要翻译：集成电路（IC）的制造方法利用浅沟槽隔离（STI）技术。浅沟槽隔离技术用于应变硅（SMOS）工艺。用于沟槽的衬垫由半导体或金属层形成，该半导体或金属层在低温过程中沉积，这降低了锗除气。低温工艺可以是CVD工艺。

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