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1. 发明授权

US5500388A Heat treatment process for wafers 失效
标题翻译：晶圆热处理工艺
公开(公告)号：US5500388A
公开(公告)日：1996-03-19
申请号：US202457
申请日：1994-02-28
申请人： Reiji Niino , Tomoyuki Ohbu , Hiroaki Ikegawa , Ken Nakao , Yoshiyuki Fujita , Tsutomu Haraoka , Makoto Kobayashi , Naoya Kaneda , Hiroshi Kumada
发明人： Reiji Niino , Tomoyuki Ohbu , Hiroaki Ikegawa , Ken Nakao , Yoshiyuki Fujita , Tsutomu Haraoka , Makoto Kobayashi , Naoya Kaneda , Hiroshi Kumada
IPC分类号： C23C16/46 , H01L21/20 , H01L21/285
CPC分类号： C23C16/463 , C23C16/46 , H01L21/02381 , H01L21/02532 , H01L21/02576 , H01L21/02579 , H01L21/0262 , H01L21/28512
摘要： In order to form a film on a surface of a semiconductor wafer, a multiplicity of wafers are individually mounted on ring-shaped mounts of a wafer boat, while the temperature within a reaction tube is set at, e.g., 400.degree. C. under a nitrogen gas atmosphere. After loading the wafer boat into the reaction tube, the temperature within the reaction tube is raised up to, e.g., 620.degree. C. at a rate of, e.g., 100.degree. C./min, and SiH.sub.4 gas is supplied onto the surface of a silicon substrate to form a polysilicon film. After film formation, air is forced to flow along the internal surface of the heating section to forcibly cool the interior of the reaction tube. In the case of forming a metal silicon film using a wafer having a silicon substrate and a metal film formed on the surface of the silicon substrate, the temperature within the reaction tube is set at, e.g. 100.degree. C. for loading the wafers. This suppresses the growth of a natural oxidation film and improves characteristics of a semiconductor device. The same principle may apply to an oxide film formation and an impurity dispersion.
摘要翻译：为了在半导体晶片的表面上形成薄膜，将多个晶片分别安装在晶片舟的环形安装件上，同时将反应管内的温度设定为例如400℃ 氮气气氛。在将晶片舟装载到反应管中之后，以例如100℃/ min的速率将反应管内的温度升高至例如620℃，并将SiH 4气体供应到硅衬底以形成多晶硅膜。成膜后，迫使空气沿加热部的内表面流动，强制冷却反应管的内部。在使用具有硅衬底和形成在硅衬底的表面上的金属膜的晶片形成金属硅膜的情况下，将反应管内的温度设定为例如 100℃，用于装载晶片。这抑制了天然氧化膜的生长，并提高了半导体器件的特性。相同的原理可能适用于氧化膜形成和杂质分散。

2. 发明授权

US5645419A Heat treatment method and device 失效
标题翻译：热处理方法及装置
公开(公告)号：US5645419A
公开(公告)日：1997-07-08
申请号：US409098
申请日：1995-03-23
申请人： Tetsu Ohsawa , Hiroyuki Iwai , Hisashi Kikuchi , Shingo Watanabe , Keiji Takano , Tsutomu Haraoka , Ken Nakao
发明人： Tetsu Ohsawa , Hiroyuki Iwai , Hisashi Kikuchi , Shingo Watanabe , Keiji Takano , Tsutomu Haraoka , Ken Nakao
IPC分类号： H01L21/00 , H01L21/677 , F23D11/44
CPC分类号： H01L21/67115 , H01L21/67769 , H01L21/67781
摘要： A heat treatment device including a handling chamber that has a carriers feed in/out opening for carriers holding plural sheets of objects to be treated parallelly vertical, a vertical heat treatment furnace for heat treating the objects and a posture changer for swinging the carriers near the carriers feed in/out opening of the handling chamber on a rotational center into a territory of lower sides of the carriers to change the posture of the objects to be treated from the vertical position to the horizontal position. The heat treatment device also has a carriers storage unit disposed above the posture changing means for storing a plural number of posture changed carriers, conveying device for conveying the carriers between the storage unit and the posture changing device and the heat treatment furnace side. Also, provided is a transferrer for transferring the objects-to-be-treated to/from an objects-to-be-treated holder for loading and unloading into/out of the heat treatment furnace side. The posture changer swings the carriers on the rotational center to sides of the carriers to change the carriers' posture from vertical to horizontal so the carriers have postures changed along a swing track of a minimum radius with small bulge amounts and a minimum moving amount. Thus, a conveying distance and a conveying time for conveying the posture changed carriers to the upper storage unit be reduced, and the heat treatment device can be smaller-sized and have improved processing efficiency.
摘要翻译：一种热处理装置，其特征在于，具备搬运室，该处理室具有用于保持待平行放置待处理的多个物体的载体的进/出开口，用于对物体进行热处理的立式热处理炉，以及用于使载体附近的载体摆动的姿势变换器载体将转动中心的处理室的进/出开口输送到载体的下侧的区域中，以将被处理物体的姿态从垂直位置改变到水平位置。该热处理装置还具有：载置体存放部，其设置在姿势变更机构的上方，用于存储多个姿势变化的载体，用于在存放部与姿势变更装置以及热处理炉侧之间输送载体的输送装置。而且，提供了一种转移器，用于将待处理物体转移到待处理的待处理的保持器，用于装载和卸载进入/离开热处理炉侧。姿态变换器将转动中心的载体摆动到载体的侧面，以将载体的姿态从垂直方向转换为水平，使得载体具有沿着具有小凸起量和最小移动量的最小半径的摆动轨道改变的姿势。因此，能够减少用于输送姿势的输送距离和输送时间，使载体向上部存储单元减少，并且热处理装置可以更小尺寸并且具有改善的处理效率。

3. 发明授权

US08134100B2 Heat processing furnace and method of manufacturing the same 有权
标题翻译：热加工炉及其制造方法
公开(公告)号：US08134100B2
公开(公告)日：2012-03-13
申请号：US12155095
申请日：2008-05-29
申请人： Makoto Kobayashi , Ken Nakao
发明人： Makoto Kobayashi , Ken Nakao
IPC分类号： F27D11/00 , F27D7/06
CPC分类号： H01L21/67109 , F27B17/0025 , Y10T29/49083
摘要： A heat processing furnace comprises: a processing vessel for receiving an object to be processed by a heat process; a cylindrical heat insulation member surrounding the processing vessel; a helical heating resistor arranged along an inner peripheral surface of the heat insulation member; a support member for supporting the heating resistor. The support member includes a base part positioned on an inside of the heating resistor, and a plurality of support pieces extending radially outward from the base part through spaces between adjacent portions of the heating resistor so as to support the heating resistor, the support member being formed to have a comb-like shape. An upper surface part of each of the support pieces is formed to have a curved shape in order to reduce a frictional resistance generated when the heating resistor is moved upon a thermal expansion and a thermal shrinkage thereof.
摘要翻译：热处理炉包括：用于通过热处理接收待加工物体的处理容器; 围绕处理容器的圆柱形隔热构件; 螺旋形加热电阻器，沿着所述隔热部件的内周面布置; 用于支撑加热电阻器的支撑构件。所述支撑构件包括位于所述加热电阻器的内侧的基座部分和从所述基座部分通过所述加热电阻器的相邻部分之间的空间径向向外延伸的多个支撑件，以支撑所述加热电阻器，所述支撑构件为形成为具有梳状形状。每个支撑片的上表面部分形成为具有弯曲形状，以便减少当热电阻器在热膨胀和热收缩时移动时产生的摩擦阻力。

4. 发明授权

US07888622B2 Heat-processing furnace and manufacturing method thereof 有权
标题翻译：热处理炉及其制造方法
公开(公告)号：US07888622B2
公开(公告)日：2011-02-15
申请号：US11902333
申请日：2007-09-20
申请人： Ken Nakao , Kenichi Yamaga , Makoto Kobayashi
发明人： Ken Nakao , Kenichi Yamaga , Makoto Kobayashi
IPC分类号： F27D11/00 , H05B3/00
CPC分类号： F27B17/0025 , H01L21/67103 , H05B3/08 , Y10T29/49083
摘要： A heat-processing furnace comprises: a processing vessel for housing an object to be processed to thermally heat the object to be processed; a cylindrical heat insulating member surrounding the processing vessel; a helical heating resistor disposed along an inner circumferential surface of the heat insulating member; and support members axially disposed on the inner circumferential surface of the heat insulating member, for supporting the heating resistor at predetermined pitches. A plurality of terminal plates are disposed outside the heating resistor at suitable intervals therebetween and attached to the heating resistor, the terminal plates radially passing through the heat insulating member to be extended outside. A plurality of fixing plates are disposed outside the heating resistor at suitable intervals therebetween and attached to the heating resistor, the fixing plates being fixed in the heat insulating member. The fixing plates are attached to the heating resistor by the same attachment structure as the attachment structure of the terminal plates to the heating resistor.
摘要翻译：一种热处理炉包括：用于容纳待加工物体的热处理容器，用于对被处理物体进行热加热; 围绕所述处理容器的圆柱形绝热构件; 螺旋加热电阻器，沿着所述绝热构件的内周面设置; 以及轴向设置在绝热构件的内周面上的支撑构件，用于以预定间距支撑加热电阻器。多个端子板以适当的间隔设置在加热电阻器的外侧，并且附接到加热电阻器，端子板径向通过隔热构件延伸到外部。多个固定板以适当的间隔设置在加热电阻器的外部，并附着在加热电阻器上，固定板固定在绝热构件中。固定板通过与端子板与加热电阻器的连接结构相同的附接结构附接到加热电阻器。

5. 发明申请

US20090194521A1 Thermal processing furnace 有权
标题翻译：热处理炉
公开(公告)号：US20090194521A1
公开(公告)日：2009-08-06
申请号：US12320433
申请日：2009-01-26
申请人： Makoto Kobayashi , Kenichi Yamaga , Ken Nakao
发明人： Makoto Kobayashi , Kenichi Yamaga , Ken Nakao
IPC分类号： H05B3/06
CPC分类号： H01L21/67109 , F27B17/0025 , F27D11/02 , F27D99/0006 , H05B3/08
摘要： A thermal processing furnace comprises: a tubular heat insulation member 4 surrounding a processing vessel 3 for receiving and thermally processing an object to be processed w; a heating resistor 5 helically arranged on an inner circumferential surface of the heat insulation member 4; and a support member 13 disposed on the inner circumferential surface of the heat insulation member 4, the support member 13 supporting the heating resistor 5 such that the heating resistor 5 can be thermally expanded and thermally shrunk. The thermal processing furnace further comprises: a movement prevention member 15 disposed on the heating resistor 5 to be in contact with one side surface of the support member 13 so as to prevent a downward movement of the heating resistor 5.
摘要翻译：热处理炉包括：围绕处理容器3的管状隔热构件4，用于接收和热处理待加工物体w; 螺旋形地布置在隔热构件4的内周面上的加热电阻器5; 以及设置在绝热构件4的内周面上的支撑构件13，支撑构件13，其支撑加热电阻器5，使得加热电阻器5可以热膨胀和热收缩。热处理炉还包括：移动防止部件15，设置在加热电阻器5上以与支撑部件13的一个侧表面接触，以防止加热电阻器5的向下移动。

6. 发明申请

US20080296282A1 Heat processing furnace and method of manufacturing the same 有权
标题翻译：热加工炉及其制造方法
公开(公告)号：US20080296282A1
公开(公告)日：2008-12-04
申请号：US12155095
申请日：2008-05-29
申请人： Makoto Kobayashi , Ken Nakao
发明人： Makoto Kobayashi , Ken Nakao
IPC分类号： F27D11/00 , H05B3/02
CPC分类号： H01L21/67109 , F27B17/0025 , Y10T29/49083
摘要： The object of the present invention is to reduce a frictional resistance which is generated between a support member and a heating resistor when the heating resistor is thermally expanded and thermally shrunk, whereby generation of a permanent deformation of the heating resistor caused by a residual stress thereof can be restrained, to thereby improve the durability. A heat processing furnace comprises: a processing vessel 3 capable of accommodating an object to be processed w and subjecting the object to be processed w to a heat process; a cylindrical heat insulation member 4 surrounding the processing vessel 3; a helical heating resistor 5 arranged along an inner peripheral surface of the heat insulation member 4; a support member 13 disposed on the inner peripheral surface of the heat insulation member 4 in parallel with an axial direction thereof, for supporting the heating resistor 5 at predetermined pitches along the axial direction; and a plurality of terminal plates 14 axially arranged on an outside of the heating resistor 5 at suitable intervals therebetween, the terminal plates 14 radially passing through the heat insulation member 4 so as to be extended outside. The support member 13 includes a base part 17 positioned on an inside of the heating resistor 5, and a plurality of support pieces 18 extending radially outward from the base part through spaces between adjacent portions of the heating resistor 5 so as to support the heating resistor 5, the support member 13 being formed to have a comb-like shape. An upper surface part of each of the support pieces 18 is formed to have a curved shape in order to reduce a frictional resistance generated when the heating resistor 5 is moved upon a thermal expansion and a thermal shrinkage thereof.
摘要翻译：本发明的目的是减少当加热电阻器热膨胀和热收缩时在支撑构件和加热电阻器之间产生的摩擦阻力，由此产生由其残余应力引起的加热电阻器的永久变形可以抑制，从而提高耐久性。热处理炉包括：处理容器3，其能够容纳被处理物体w并对被加工物W进行加热处理; 围绕处理容器3的圆柱形隔热构件4; 沿着绝热构件4的内周面布置的螺旋形加热电阻器5; 支撑构件13，其设置在绝热构件4的与其轴向平行的内周面上，用于沿着轴向以预定的间距支撑加热电阻器5; 以及在它们之间以合适的间隔轴向地布置在加热电阻器5的外侧上的多个端子板14，端子板14径向地穿过绝热构件4以便向外延伸。支撑构件13包括位于加热电阻器5的内部的基部17和从基部通过加热电阻器5的相邻部分之间的空间径向向外延伸的多个支撑件18，以支撑加热电阻器如图5所示，支撑构件13形成为具有梳状形状。每个支撑件18的上表面部分形成为具有弯曲形状，以便减少当热电阻器5在热膨胀和其热收缩时移动时产生的摩擦阻力。

7. 发明申请

US20080073334A1 Heat-processing furnace and manufacuring method thereof 有权
标题翻译：热处理炉及其制造方法
公开(公告)号：US20080073334A1
公开(公告)日：2008-03-27
申请号：US11902333
申请日：2007-09-20
申请人： Ken Nakao , Kenichi Yamaga , Makoto Kobayashi
发明人： Ken Nakao , Kenichi Yamaga , Makoto Kobayashi
IPC分类号： F27D11/02 , H05B3/06
CPC分类号： F27B17/0025 , H01L21/67103 , H05B3/08 , Y10T29/49083
摘要： A heat-processing furnace comprises: a processing vessel for housing an object to be processed to thermally heat the object to be processed; a cylindrical heat insulating member surrounding the processing vessel; a helical heating resistor disposed along an inner circumferential surface of the heat insulating member; and support members axially disposed on the inner circumferential surface of the heat insulating member, for supporting the heating resistor at predetermined pitches. A plurality of terminal plates are disposed outside the heating resistor at suitable intervals therebetween and attached to the heating resistor, the terminal plates radially passing through the heat insulating member to be extended outside. A plurality of fixing plates are disposed outside the heating resistor at suitable intervals therebetween and attached to the heating resistor, the fixing plates being fixed in the heat insulating member. The fixing plates are attached to the heating resistor by the same attachment structure as the attachment structure of the terminal plates to the heating resistor.
摘要翻译：一种热处理炉包括：用于容纳待加工物体的热处理容器，用于对被处理物体进行热加热; 围绕所述处理容器的圆柱形绝热构件; 螺旋加热电阻器，沿着所述绝热构件的内周面设置; 以及轴向设置在绝热构件的内周面上的支撑构件，用于以预定间距支撑加热电阻器。多个端子板以适当的间隔设置在加热电阻器的外侧，并且附接到加热电阻器，端子板径向通过隔热构件延伸到外部。多个固定板以适当的间隔设置在加热电阻器的外部，并附着在加热电阻器上，固定板固定在绝热构件中。固定板通过与端子板与加热电阻器的连接结构相同的附接结构附接到加热电阻器。

8. 发明授权

US08476560B2 Thermal processing furnace 有权
公开(公告)号：US08476560B2
公开(公告)日：2013-07-02
申请号：US12320433
申请日：2009-01-26
申请人： Makoto Kobayashi , Kenichi Yamaga , Ken Nakao
发明人： Makoto Kobayashi , Kenichi Yamaga , Ken Nakao
IPC分类号： F27B5/14 , F27D11/02 , H05B3/66
CPC分类号： H01L21/67109 , F27B17/0025 , F27D11/02 , F27D99/0006 , H05B3/08
摘要： A thermal processing furnace comprises: a tubular heat insulation member 4 surrounding a processing vessel 3 for receiving and thermally processing an object to be processed w; a heating resistor 5 helically arranged on an inner circumferential surface of the heat insulation member 4; and a support member 13 disposed on the inner circumferential surface of the heat insulation member 4, the support member 13 supporting the heating resistor 5 such that the heating resistor 5 can be thermally expanded and thermally shrunk. The thermal processing furnace further comprises: a movement prevention member 15 disposed on the heating resistor 5 to be in contact with one side surface of the support member 13 so as to prevent a downward movement of the heating resistor 5.

9. 发明授权

US6008477A Heat treatment apparatus 失效
标题翻译：热处理设备
公开(公告)号：US6008477A
公开(公告)日：1999-12-28
申请号：US23769
申请日：1998-02-13
申请人： Ken Nakao , Makoto Kobayashi , Hisaei Osanai
发明人： Ken Nakao , Makoto Kobayashi , Hisaei Osanai
IPC分类号： H05B3/06 , H01L21/00 , H01L21/205 , H01L21/22 , H01L21/31 , H05B3/46 , H05B3/64 , H05B3/66 , F27B5/14
CPC分类号： H01L21/67109 , H05B3/64 , H05B3/66
摘要： A helical heating wire is disposed so as to surround a reaction tube, and is held by a heat insulating structure. Support members are arranged at predetermined pitches on the inner circumference of the heat insulating structure to support the heating wire on the inner circumference of the heat insulating structure so as to enable the heating wire to make thermal expansion and thermal contraction. Fixing means are attached to one loop out of every suitable number of loops of the helical heating wire to fix the heating wire to the heat insulating structure.
摘要翻译：螺旋形加热线设置成围绕反应管，并且由隔热结构保持。支撑构件以隔热结构的内圆周上的预定间距布置，以将热丝支撑在绝热结构的内周上，以使得加热丝能够进行热膨胀和热收缩。固定装置连接到螺旋形加热丝的每个合适数量的环的一个环上，以将加热丝固定到隔热结构。

10. 发明申请

US20140174364A1 HEAT TREATMENT DEVICE 审中-公开
标题翻译：热处理装置
公开(公告)号：US20140174364A1
公开(公告)日：2014-06-26
申请号：US14236955
申请日：2012-07-23
申请人： Ken Nakao , Eisuke Morisaki
发明人： Ken Nakao , Eisuke Morisaki
IPC分类号： C23C16/46
CPC分类号： C23C16/46 , C23C16/4588 , H01L21/67109 , H01L21/67115
摘要： A heat treatment device includes: a processing container that accommodates a plurality of substrates to be subjected to heat treatment; a substrate holding member that holds the plurality of substrates; an induction heating coil that forms an induction magnetic field inside the processing container; a high frequency power supply that applies a high frequency electric power to the induction heating coil; a gas supply mechanism that supplies a processing gas to the inside of the processing container; an exhaust mechanism that exhausts the inside of the processing container; and an induction heating element provided between the induction heating coil and the substrate holding member to enclose the substrate holding member inside the treatment container. The induction heating element is heated by an induction electric current formed by the induction magnetic field, and the substrates are heated by radiation heat from the induction heating element. The flow of the inductive electric current to the substrate is blocked by the induction heating element.
摘要翻译：热处理装置包括：容纳要进行热处理的多个基板的处理容器; 保持所述多个基板的基板保持部件; 感应加热线圈，其在处理容器内部形成感应磁场; 向感应加热线圈施加高频电力的高频电源; 气体供给机构，其向处理容器的内部供给处理气体; 排出处理容器内部的排气机构; 以及感应加热元件，其设置在所述感应加热线圈和所述基板保持部件之间，以将所述基板保持部件包围在所述处理容器内。感应加热元件由感应磁场形成的感应电流加热，并且基板被来自感应加热元件的辐射热加热。感应电流流向基板被感应加热元件阻挡。

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