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1. 发明授权

US06492211B1 Method for novel SOI DRAM BICMOS NPN 失效
标题翻译：新型SOI DRAM BICMOS NPN的方法
公开(公告)号：US06492211B1
公开(公告)日：2002-12-10
申请号：US09656819
申请日：2000-09-07
申请人： Ramachandra Divakaruni , Russell J. Houghton , Jack A. Mandelman , W. David Pricer , William R. Tonti
发明人： Ramachandra Divakaruni , Russell J. Houghton , Jack A. Mandelman , W. David Pricer , William R. Tonti
IPC分类号： H01L2100
CPC分类号： H01L27/10894 , G11C7/065 , G11C2207/005 , G11C2207/065 , H01L21/84 , H01L27/10861 , H01L27/10897 , H01L27/1203
摘要： There is disclosed herein a unique fabrication sequence and the structure of a vertical silicon on insulator (SOI) bipolar transistor integrated into a typical DRAM trench process sequence. A DRAM array utilizing an NFET allows for an integrated bipolar NPN sequence. Similarly, a vertical bipolar PNP device is implemented by changing the array transistor to a PFET. Particularly, a BICMOS device is fabricated in SOI. The bipolar emitter contacts and CMOS diffusion contacts are formed simultaneously of polysilicon plugs. The CMOS diffusion contact is the plug contact from bitline to storage node of a memory cell.
摘要翻译：在此公开了独特的制造顺序和集成到典型的DRAM沟槽工艺序列中的垂直绝缘体上硅（SOI）双极晶体管的结构。使用NFET的DRAM阵列允许集成双极NPN序列。类似地，通过将阵列晶体管改变为PFET来实现垂直双极PNP器件。特别地，在SOI中制造BICMOS器件。双极发射极触点和CMOS扩散触点同时形成多晶硅插头。 CMOS扩散触点是从存储单元的位线到存储节点的插头触点。

2. 发明授权

US06972220B2 Structures and methods of anti-fuse formation in SOI 失效
标题翻译： SOI中抗熔丝形成的结构和方法
公开(公告)号：US06972220B2
公开(公告)日：2005-12-06
申请号：US10366298
申请日：2003-02-12
申请人： Claude L. Bertin , Ramachandra Divakaruni , Russell J. Houghton , Jack A. Mandelman , William R. Tonti
发明人： Claude L. Bertin , Ramachandra Divakaruni , Russell J. Houghton , Jack A. Mandelman , William R. Tonti
IPC分类号： H01L21/82 , H01L21/334 , H01L23/525 , H01L27/108 , H01L27/12 , H01L21/00
CPC分类号： H01L23/5252 , H01L27/10829 , H01L27/10897 , H01L27/1203 , H01L29/66181 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： An anti-fuse structure that can be programmed at low voltage and current and which potentially consumes very little chip spaces and can be formed interstitially between elements spaced by a minimum lithographic feature size is formed on a composite substrate such as a silicon-on-insulator wafer by etching a contact through an insulator to a support semiconductor layer, preferably in combination with formation of a capacitor-like structure reaching to or into the support layer. The anti-fuse may be programmed either by the selected location of conductor formation and/or damaging a dielectric of the capacitor-like structure. An insulating collar is used to surround a portion of either the conductor or the capacitor-like structure to confine damage to the desired location. Heating effects voltage and noise due to programming currents are effectively isolated to the bulk silicon layer, permitting programming during normal operation of the device. Thus the potential for self-repair without interruption of operation is realized.
摘要翻译：可以在低电压和电流下被编程并且潜在地消耗很少的芯片空间并且可以间隙地在间隔最小光刻特征尺寸的元件之间形成的反熔丝结构形成在复合衬底上，例如绝缘体上硅通过蚀刻通过绝缘体的接触到支撑半导体层，优选结合形成到达或支撑层的电容器状结构。反熔丝可以由导体形成的选定位置和/或损坏电容器状结构的电介质来编程。绝缘环用于围绕导体或电容器状结构的一部分，以将损伤限制在所需位置。由于编程电流导致的加热效应电压和噪声被有效地隔离到体硅层，从而允许在器件正常工作期间进行编程。因此实现了自动修复而不中断操作的可能性。

3. 发明授权

US06790722B1 Logic SOI structure, process and application for vertical bipolar transistor 有权
标题翻译：逻辑SOI结构，工艺和应用于垂直双极晶体管
公开(公告)号：US06790722B1
公开(公告)日：2004-09-14
申请号：US09718850
申请日：2000-11-22
申请人： Ramachandra Divakaruni , Russell J. Houghton , Jack A. Mandelman , Wilbur D. Pricer , William R. Tonti
发明人： Ramachandra Divakaruni , Russell J. Houghton , Jack A. Mandelman , Wilbur D. Pricer , William R. Tonti
IPC分类号： H01L218238
CPC分类号： H01L29/66265 , H01L21/8249 , H01L27/0623 , H01L29/7317
摘要： A method and structure for forming an emitter in a vertical bipolar transistor includes providing a substrate having a collector layer and a base layer over the collector layer, forming a patterning mask over the collector layer, and filling openings in the mask with emitter material in a damascene process. The CMOS/vertical bipolar structure has the collector, base regions, and emitter regions vertically disposed on one another, the collector region having a peak dopant concentration adjacent the inter-substrate isolation oxide.
摘要翻译：用于在垂直双极晶体管中形成发射极的方法和结构包括在集电极层上提供具有集电极层和基极层的衬底，在集电极层上形成图案掩模，并在发光体材料中填充掩模中的开口大马士革过程。 CMOS /垂直双极结构具有彼此垂直设置的集电极，基极区域和发射极区域，集电极区域具有与衬底间隔离氧化物相邻的峰值掺杂剂浓度。

4. 发明授权

US06596592B2 Structures and methods of anti-fuse formation in SOI 失效
公开(公告)号：US06596592B2
公开(公告)日：2003-07-22
申请号：US10066759
申请日：2002-02-06
申请人： Claude L. Bertin , Ramachandra Divakaruni , Russell J. Houghton , Jack A. Mandelman , William R. Tonti
发明人： Claude L. Bertin , Ramachandra Divakaruni , Russell J. Houghton , Jack A. Mandelman , William R. Tonti
IPC分类号： H01L21336
CPC分类号： H01L23/5252 , H01L27/10829 , H01L27/10897 , H01L27/1203 , H01L29/66181 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： An anti-fuse structure that can be programmed at low voltage and current and which potentially consumes very little chip spaces and can be formed interstitially between elements spaced by a minimum lithographic feature size is formed on a composite substrate such as a silicon-on-insulator wafer by etching a contact through an insulator to a support semiconductor layer, preferably in combination with formation of a capacitor-like structure reaching to or into the support layer. The anti-fuse may be programmed either by the selected location of conductor formation and/or damaging a dielectric of the capacitor-like structure. An insulating collar is used to surround a portion of either the conductor or the capacitor-like structure to confine damage to the desired location. Heating effects voltage and noise due to programming currents are effectively isolated to the bulk silicon layer, permitting programming during normal operation of the device. Thus the potential for self-repair without interruption of operation is realized.

5. 发明授权

US07226816B2 Method of forming connection and anti-fuse in layered substrate such as SOI 有权
标题翻译：在诸如SOI的层状衬底中形成连接和反熔丝的方法
公开(公告)号：US07226816B2
公开(公告)日：2007-06-05
申请号：US11055106
申请日：2005-02-11
申请人： Claude L. Bertin , Ramachandra Divakaruni , Russell J. Houghton , Jack A. Mandelman , William R. Tonti
发明人： Claude L. Bertin , Ramachandra Divakaruni , Russell J. Houghton , Jack A. Mandelman , William R. Tonti
IPC分类号： H01L21/82
CPC分类号： H01L23/5252 , H01L27/10829 , H01L27/10897 , H01L27/1203 , H01L29/66181 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： An anti-fuse structure that can be programmed at low voltage and current and which potentially consumes very little chip spaces and can be formed interstitially between elements spaced by a minimum lithographic feature size is formed on a composite substrate such as a silicon-on-insulator wafer by etching a contact through an insulator to a support semiconductor layer, preferably in combination with formation of a capacitor-like structure reaching to or into the support layer. The anti-fuse may be programmed either by the selected location of conductor formation and/or damaging a dielectric of the capacitor-like structure. An insulating collar is used to surround a portion of either the conductor or the capacitor-like structure to confine damage to the desired location. Heating effects voltage and noise due to programming currents are effectively isolated to the bulk silicon layer, permitting programming during normal operation of the device. Thus the potential for self-repair without interruption of operation is realized.
摘要翻译：可以在低电压和电流下被编程并且潜在地消耗很少的芯片空间并且可以间隙地在间隔最小光刻特征尺寸的元件之间形成的抗熔丝结构形成在复合衬底上，例如绝缘体上硅通过蚀刻通过绝缘体的接触到支撑半导体层，优选结合形成到达或支撑层的电容器状结构。反熔丝可以由导体形成的选定位置和/或损坏电容器状结构的电介质来编程。绝缘环用于围绕导体或电容器状结构的一部分，以将损伤限制在所需位置。由于编程电流导致的加热效应电压和噪声被有效地隔离到体硅层，从而允许在器件正常工作期间进行编程。因此实现了自动修复而不中断操作的可能性。

6. 发明授权

US06396121B1 Structures and methods of anti-fuse formation in SOI 失效
公开(公告)号：US06396121B1
公开(公告)日：2002-05-28
申请号：US09583468
申请日：2000-05-31
申请人： Claude L. Bertin , Ramachandra Divakaruni , Russell J. Houghton , Jack A. Mandelman , William R. Tonti
发明人： Claude L. Bertin , Ramachandra Divakaruni , Russell J. Houghton , Jack A. Mandelman , William R. Tonti
IPC分类号： H01L2900
CPC分类号： H01L23/5252 , H01L27/10829 , H01L27/10897 , H01L27/1203 , H01L29/66181 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： An anti-fuse structure that can be programmed at low voltage and current and which potentially consumes very little chip spaces and can be formed interstitially between elements spaced by a minimum lithographic feature size is formed on a composite substrate such as a silicon-on-insulator wafer by etching a contact through an insulator to a support semiconductor layer, preferably in combination with formation of a capacitor-like structure reaching to or into the support layer. The anti-fuse may be programmed either by the selected location of conductor formation and/or damaging a dielectric of the capacitor-like structure. An insulating collar is used to surround a portion of either the conductor or the capacitor-like structure to confine damage to the desired location. Heating effects voltage and noise due to programming currents are effectively isolated to the bulk silicon layer, permitting programming during normal operation of the device. Thus the potential for self-repair without interruption of operation is realized.

7. 发明授权

US06498518B1 Low input impedance line/bus receiver 失效
标题翻译：低输入阻抗线路/总线接收器
公开(公告)号：US06498518B1
公开(公告)日：2002-12-24
申请号：US09617680
申请日：2000-07-14
申请人： Russell J. Houghton , Jack A. Mandelman , Azzouz Nezar , Wilbur D. Pricer , William R. Tonti
发明人： Russell J. Houghton , Jack A. Mandelman , Azzouz Nezar , Wilbur D. Pricer , William R. Tonti
IPC分类号： H03K522
CPC分类号： H04L25/0292 , H03K5/24 , H03K19/017554
摘要： A current sensing circuit connected to a power supply terminal and having at least one input terminal and at least one output terminal includes at least one bipolar transistor having a base, emitter and collector, at least one current mirror amplifier connected to the power supply terminal, the current mirror amplifier having an input connected to the collector and having at least one output connected to the emitter, and a DC voltage source connected to the base.
摘要翻译：连接到电源端子并且具有至少一个输入端子和至少一个输出端子的电流感测电路包括至少一个具有基极，发射极和集电极的双极晶体管，连接到电源端子的至少一个电流镜放大器，所述电流镜放大器具有连接到所述集电极并且具有连接到所述发射极的至少一个输出的输入端和连接到所述基极的DC电压源。

8. 发明授权

US06436749B1 Method for forming mixed high voltage (HV/LV) transistors for CMOS devices using controlled gate depletion 失效
标题翻译：用于使用受控栅极耗尽的CMOS器件形成混合高压（HV / LV）晶体管的方法
公开(公告)号：US06436749B1
公开(公告)日：2002-08-20
申请号：US09658655
申请日：2000-09-08
申请人： William R. Tonti , Claude L. Bertin , Jeffrey P. Gambino , Russell J. Houghton , Jack A. Mandelman , Wilbur D. Pricer
发明人： William R. Tonti , Claude L. Bertin , Jeffrey P. Gambino , Russell J. Houghton , Jack A. Mandelman , Wilbur D. Pricer
IPC分类号： H01L218238
CPC分类号： H01L27/092 , H01L21/823842
摘要： A method for forming mixed high voltage/low voltage (HV/LV) transistors for CMOS devices is disclosed. In an exemplary embodiment, depletion of the gate conductor is controlled by leaving a fixed region of the gate conductor intrinsic, or lightly doped, thus separating the heavily doped low resistivity portion of the electrode with an intrinsic region by use of a conducting dopant barrier. The barrier is conductive in nature, but acts as a well-controlled diffusion barrier, stopping the “fast” diffusion which normally takes place in polysilicon, and eliminating diffusion between the conductors. Thereby, the device performance may be precisely predicted by carefully controlling the gate conductor thickness.
摘要翻译：公开了一种用于形成用于CMOS器件的混合高压/低压（HV / LV）晶体管的方法。在示例性实施例中，通过将栅极导体的固定区域固有或轻掺杂来控制栅极导体的耗尽，从而通过使用导电掺杂剂屏障将本征区域的重掺杂低电阻率部分与本征区域分离。阻挡层本质上是导电的，但是作为良好控制的扩散屏障，停止通常在多晶硅中发生的“快速”扩散，并消除导体之间的扩散。因此，可以通过仔细地控制栅极导体厚度来精确地预测器件性能。

9. 发明授权

US07981731B2 Method of forming a high impedance antifuse 有权
标题翻译：形成高阻抗反熔丝的方法
公开(公告)号：US07981731B2
公开(公告)日：2011-07-19
申请号：US11482688
申请日：2006-07-07
申请人： John A. Fifield , Russell J. Houghton , William R. Tonti
发明人： John A. Fifield , Russell J. Houghton , William R. Tonti
IPC分类号： H01L21/82
CPC分类号： H01L23/5252 , H01L2924/0002 , H01L2924/3011 , Y10S438/957 , H01L2924/00
摘要： A programmable element that has a first diode having an electrode and a first insulator disposed between the substrate and said electrode of said first device, said first insulator having a first value of a given characteristic, and an FET having an electrode and a second insulator disposed between the substrate and said electrode of said second device, said second insulator having a second value of said given characteristic that is different from said first value. The electrodes of the diode and the FET are coupled to one another, and a source of programming energy is coupled to the diode to cause it to permanently decrease in resistivity when programmed. The programmed state of the diode is indicated by a current in the FET, which is read by a sense latch. Thus a small resistance change in the diode translates to a large signal gain/change in the latch. This allows the diode to be programmed at lower voltages.
摘要翻译：一种可编程元件，其具有第一二极管，其具有电极和布置在所述基板和所述第一器件的所述电极之间的第一绝缘体，所述第一绝缘体具有给定特性的第一值，以及具有电极和设置在所述第二绝缘体中的第二绝缘体的FET 在所述基板和所述第二装置的所述电极之间，所述第二绝缘体具有与所述第一值不同的所述给定特性的第二值。二极管和FET的电极彼此耦合，并且编程能量源耦合到二极管，以使其在编程时永久地降低电阻率。二极管的编程状态由FET中的电流表示，该电流由读出锁存器读取。因此，二极管中的小电阻变化转换为锁存器中的大信号增益/变化。这允许二极管在较低的电压下被编程。

10. 发明授权

US06388305B1 Electrically programmable antifuses and methods for forming the same 有权
标题翻译：电子可编程反熔丝及其形成方法
公开(公告)号：US06388305B1
公开(公告)日：2002-05-14
申请号：US09466495
申请日：1999-12-17
申请人： Claude L. Bertin , Erik L. Hedberg , Russell J. Houghton , Max G. Levy , Rick L. Mohler , William R. Tonti , Wayne M. Trickle
发明人： Claude L. Bertin , Erik L. Hedberg , Russell J. Houghton , Max G. Levy , Rick L. Mohler , William R. Tonti , Wayne M. Trickle
IPC分类号： H01L2900
CPC分类号： H01L21/763 , H01L23/5252 , H01L27/10861 , H01L27/10894 , H01L2924/0002 , H01L2924/00
摘要： A first one time, voltage programmable logic element is provided in a semiconductor substrate of first conductivity type that comprises a first layer beneath a surface of the substrate, the first layer having a second conductivity type; and a trench formed through the surface and passing through the first layer. The trench comprises an interior surface, a dielectric material lining the interior surface and a conductive material filling the lined trench. The first logic element is configured so that a predetermined voltage or higher applied between the conductive material and the first layer causes a breakdown within a region of the trench. A second one time, voltage programmable logic element is provided in a semiconductor substrate of first conductivity type that comprises a first layer formed in a surface of the substrate, the first layer having a second conductivity type; and a trench formed through the surface and passing through the first layer. The trench comprises an interior surface, a first dielectric material lining the interior surface and a second dielectric material filling the lined trench. The second logic element further comprises a dielectric layer formed over a portion of the first layer and contacting the first dielectric material lining the trench at a merge location; and an electrode extending over a portion of both the dielectric layer and the filled trench. The second logic element is configured so that a predetermined voltage or higher applied between the electrode and the first layer causes a breakdown near the merge location.
摘要翻译：首先，电压可编程逻辑元件设置在第一导电类型的半导体衬底中，该第一导电类型的半导体衬底包括在衬底的表面下面的第一层，第一层具有第二导电类型; 以及通过表面形成并穿过第一层的沟槽。沟槽包括内表面，衬在内表面的电介质材料和填充衬里沟槽的导电材料。第一逻辑元件被配置为使得施加在导电材料和第一层之间的预定电压或更高的电压导致沟槽区域内的击穿。第二次，电压可编程逻辑元件设置在第一导电类型的半导体衬底中，该半导体衬底包括形成在衬底的表面中的第一层，第一层具有第二导电类型; 以及通过表面形成并穿过第一层的沟槽。沟槽包括内表面，衬在内表面的第一电介质材料和填充衬里沟槽的第二电介质材料。第二逻辑元件还包括形成在第一层的一部分上并且在合并位置处接触衬套在沟槽上的第一介电材料的电介质层; 以及在电介质层和填充沟槽的一部分上延伸的电极。第二逻辑元件被配置为使得施加在电极和第一层之间的预定电压或更高的电压导致合并位置附近的击穿。

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