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    • 1. 发明授权
    • Method of forming a binary code of a ROM
    • 形成ROM的二进制码的方法
    • US6166943A
    • 2000-12-26
    • US421260
    • 1999-10-20
    • Ping-Ying WangChun-Yi YangChun-Jung LinJui-Chin ChangMam-Tsung Wang
    • Ping-Ying WangChun-Yi YangChun-Jung LinJui-Chin ChangMam-Tsung Wang
    • G11C17/10G11C17/00
    • G11C17/10
    • The present invention provides a method of writing a set of binary codes into a ROM. The method is performed by forming a first photo mask and a second photo mask according to an original first code pattern, an original second code pattern, and a set of binary codes to be written into the ROM. Final first and second code patterns are formed by coupling the binary codes to be written with the original first and second code patterns by using a Boolean logical OR operation. The first and second photo masks are formed according to the final first and second code patterns. The first photolithographic process is performed using the first photo mask, and the first ion implantation process is performed; the second photolithographic process is performed using the second photo mask, and the second ion implantation process is performed. Thus the set of binary codes is written into the ROM completely and correctly.
    • 本发明提供了将一组二进制码写入到ROM中的方法。 该方法通过根据原始第一代码图案,原始第二代码图案和要写入ROM的一组二进制代码形成第一光掩模和第二光掩模来执行。 最终的第一和第二代码模式通过使用布尔逻辑“或”运算来耦合待写入的二进制代码与原始的第一和第二代码模式而形成。 根据最终的第一和第二编码模式形成第一和第二光掩膜。 使用第一光掩模执行第一光刻工艺,并且执行第一离子注入工艺; 使用第二光掩模进行第二光刻工序,进行第二离子注入工序。 因此,二进制代码集完全正确地写入ROM中。
    • 3. 发明授权
    • Method of fabricating mask read only memory
    • 制造掩模只读存储器的方法
    • US06468869B1
    • 2002-10-22
    • US09930843
    • 2001-08-14
    • Chun-Yi YangChun-Jung LinFul-Long Ni
    • Chun-Yi YangChun-Jung LinFul-Long Ni
    • H01L218236
    • H01L27/11266H01L27/112
    • A method of fabricating a mask read only memory. Gate stacked structures, each of which made up of a gate dielectric layer, a gate conductive layer and a gate cap layer, are formed on a substrate. Source/drain regions are between, but not adjacent to the gate stacked structures. Regions between the source/drain regions and the gate stacked structures are coding areas. A dielectric layer is formed to fill spaces between the gate stacked structures. A photoresist layer with openings exposing the first dielectric layer on the coding areas is formed. The exposed first dielectric layer is removed to form implantation openings of the coding areas. Ion implantation is performed on the exposed coding areas. The photoresist layer is removed, and another dielectric layer is formed to fill the implantation openings. An etching back process is performed to expose the gate conductive layer. A word line is formed on the gate conductive layer.
    • 一种制造掩模只读存储器的方法。 在基板上形成由栅极介电层,栅极导电层和栅极盖层构成的栅极堆叠结构。 源极/漏极区域在栅极堆叠结构之间但不邻近栅极堆叠结构。 源极/漏极区域和栅极堆叠结构之间的区域是编码区域。 形成电介质层以填充栅层叠结构之间的空间。 形成具有使编码区域上的第一介电层露出的开口的光致抗蚀剂层。 去除暴露的第一介电层以形成编码区域的注入开口。 在暴露的编码区域进行离子注入。 去除光致抗蚀剂层,形成另一介质层以填充注入开口。 进行蚀刻反应处理以暴露栅极导电层。 在栅极导电层上形成字线。
    • 4. 发明授权
    • Method of fabricating a mask ROM with raised bit-line on each buried bit-line
    • 在每个掩埋位线上制造具有凸起位线的掩模ROM的方法
    • US06440803B1
    • 2002-08-27
    • US10047685
    • 2002-01-14
    • Shui-Chin HuangYen-hung YehTso-Hung FanChun-Yi YangChun-Jung Lin
    • Shui-Chin HuangYen-hung YehTso-Hung FanChun-Yi YangChun-Jung Lin
    • H01L218238
    • H01L27/11266H01L27/112
    • A method of fabricating a mask ROM, in which conductive strips are formed with a cap layer on each of them, then a plurality of spacers are formed on the side-walls of the conductive strips, while the substrate under the spacers are used as the coding regions. The buried bit-lines are formed in the substrate between the spacers, then a two-step coding process is performed, wherein the coding regions at the first and the second side of the conductive strips are selectively doped by a first and a second tilt coding implantation with a first and a second coding mask. After the second mask layer and the cap layer are removed, a conductive layer is formed over the substrate, then the conductive layer and the conductive strips are patterned successively to form a plurality of word-lines and plural gates, respectively.
    • 一种制造掩模ROM的方法,其中在每个掩模ROM上形成具有覆盖层的导电条,然后在导电条的侧壁上形成多个间隔物,同时使用间隔物下的基板作为 编码区域。 掩埋位线形成在间隔物之间​​的衬底中,然后进行两步编码处理,其中导电条的第一和第二侧的编码区被第一和第二倾斜编码 用第一和第二编码掩模进行植入。 在除去第二掩模层和盖层之后,在衬底上形成导电层,然后分别对导电层和导电条进行图案化以形成多个字线和多个栅极。
    • 6. 发明授权
    • Sacrifice layer structure and method for magnetic tunnel junction (MTJ) etching process
    • 牺牲层结构和磁隧道结(MTJ)蚀刻工艺
    • US08629518B2
    • 2014-01-14
    • US12828593
    • 2010-07-01
    • Yu-Jen WangYa-Chen KaoChun-Jung Lin
    • Yu-Jen WangYa-Chen KaoChun-Jung Lin
    • H01L29/82
    • H01L43/12H01L43/08
    • A magnetic tunnel junction (MTJ) etching process uses a sacrifice layer. An MTJ cell structure includes an MTJ stack with a first magnetic layer, a second magnetic layer, and a tunnel barrier layer in between the first magnetic layer and the second magnetic layer, and a sacrifice layer adjacent to the second magnetic layer, where the sacrifice layer protects the second magnetic layer in the MTJ stack from oxidation during an ashing process. The sacrifice layer does not increase a resistance of the MTJ stack. The sacrifice layer can be made of Mg, Cr, V, Mn, Ti, Zr, Zn, or any alloy combination thereof, or any other suitable material. The sacrifice layer can be multi-layered and/or have a thickness ranging from 5 Å to 400 Å. The MTJ cell structure can have a top conducting layer over the sacrifice layer.
    • 磁隧道结(MTJ)蚀刻工艺使用牺牲层。 MTJ单元结构包括在第一磁性层和第二磁性层之间的具有第一磁性层,第二磁性层和隧道势垒层的MTJ堆叠以及与第二磁性层相邻的牺牲层,其中牺牲 层在灰化过程中保护MTJ堆叠中的第二磁性层免受氧化。 牺牲层不会增加MTJ堆叠的电阻。 牺牲层可以由Mg,Cr,V,Mn,Ti,Zr,Zn或其任何合金组合或任何其它合适的材料制成。 牺牲层可以是多层的和/或具有从5到400的厚度。 MTJ单元结构可以在牺牲层上方具有顶部导电层。
    • 7. 发明授权
    • MRAM with current-based self-referenced read operations
    • MRAM具有基于当前的自引用读操作
    • US08493776B1
    • 2013-07-23
    • US13364756
    • 2012-02-02
    • Hung-Chang YuKai-Chun LinYu-Der ChihChun-Jung Lin
    • Hung-Chang YuKai-Chun LinYu-Der ChihChun-Jung Lin
    • G11C11/00
    • G11C11/1673G11C13/004G11C29/74
    • A magnetoresistive memory stores logic values in high and low resistance states of magnetic tunnel junction elements. Instead of comparing the resistance of elements to a fixed threshold to discern a logic state, the resistances of elements are self-compared before and after imposing a low resistance state. A measure of the resistance of an element in its unknown resistance state is stored, for example by charging a capacitor to a voltage produced when read current bias is applied. Then the element is written into its low resistance state and read current bias is applied again to develop another voltage, representing the low resistance state. A comparison circuit using current summing and an offset providing a minimum difference tolerance determines whether the resistance of the element was changed or remained the same. This determines the logic state of the element.
    • 磁阻存储器将逻辑值存储在磁性隧道结元件的高电阻和低电阻状态中。 代替将元件的电阻与固定阈值进行比较以辨别逻辑状态,元件的电阻在施加低电阻状态之前和之后自我比较。 例如,通过将电容器充电到施加读取电流偏压时产生的电压来存储元件在其未知电阻状态下的电阻的量度。 然后将元件写入其低电阻状态,并再次施加读取电流偏压以产生表示低电阻状态的另一电压。 使用电流求和和提供最小差容差的偏移的比较电路确定元件的电阻是改变还是保持相同。 这决定了元素的逻辑状态。