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    • 2. 发明授权
    • Sacrifice layer structure and method for magnetic tunnel junction (MTJ) etching process
    • 牺牲层结构和磁隧道结(MTJ)蚀刻工艺
    • US08629518B2
    • 2014-01-14
    • US12828593
    • 2010-07-01
    • Yu-Jen WangYa-Chen KaoChun-Jung Lin
    • Yu-Jen WangYa-Chen KaoChun-Jung Lin
    • H01L29/82
    • H01L43/12H01L43/08
    • A magnetic tunnel junction (MTJ) etching process uses a sacrifice layer. An MTJ cell structure includes an MTJ stack with a first magnetic layer, a second magnetic layer, and a tunnel barrier layer in between the first magnetic layer and the second magnetic layer, and a sacrifice layer adjacent to the second magnetic layer, where the sacrifice layer protects the second magnetic layer in the MTJ stack from oxidation during an ashing process. The sacrifice layer does not increase a resistance of the MTJ stack. The sacrifice layer can be made of Mg, Cr, V, Mn, Ti, Zr, Zn, or any alloy combination thereof, or any other suitable material. The sacrifice layer can be multi-layered and/or have a thickness ranging from 5 Å to 400 Å. The MTJ cell structure can have a top conducting layer over the sacrifice layer.
    • 磁隧道结(MTJ)蚀刻工艺使用牺牲层。 MTJ单元结构包括在第一磁性层和第二磁性层之间的具有第一磁性层,第二磁性层和隧道势垒层的MTJ堆叠以及与第二磁性层相邻的牺牲层,其中牺牲 层在灰化过程中保护MTJ堆叠中的第二磁性层免受氧化。 牺牲层不会增加MTJ堆叠的电阻。 牺牲层可以由Mg,Cr,V,Mn,Ti,Zr,Zn或其任何合金组合或任何其它合适的材料制成。 牺牲层可以是多层的和/或具有从5到400的厚度。 MTJ单元结构可以在牺牲层上方具有顶部导电层。
    • 3. 发明授权
    • Reverse connection MTJ cell for STT MRAM
    • 用于STT MRAM的反向连接MTJ单元
    • US08416600B2
    • 2013-04-09
    • US12626092
    • 2009-11-25
    • Chun-Jung LinYu-Jen WangYa-Chen KaoWen-Cheng ChenMing-Te Liu
    • Chun-Jung LinYu-Jen WangYa-Chen KaoWen-Cheng ChenMing-Te Liu
    • G11C11/00
    • H01L43/08G11C11/16G11C11/1659H01L27/228H01L43/12
    • Apparatus and methods are disclosed herein for a reverse-connection STT MTJ element of a MRAM to overcome the source degeneration effect when switching the magnetization of the MTJ element from the parallel to the anti-parallel direction. A memory cell of a MRAM having a reverse-connection MTJ element includes a switching device having a source, a gate, and a drain, and a reverse-connection MTJ device having a free layer, a fixed layer, and an insulator layer interposed between the free layer and the fixed layer. The free layer of the reverse-connection MTJ device is connected to the drain of the switching device and the fixed layer is connected to a bit line (BL). The reverse-connection MTJ device applies the lower IMTJ capability of the memory cell caused by the source degeneration effect to the less stringent IMTJ(AP->P) while preserving the higher IMTJ capability for the more demanding IMTJ(P->AP).
    • 本文公开了用于MRAM的反向连接STT MTJ元件的装置和方法,以在将MTJ元件的磁化从平行方向切换到反平行方向时克服源退化效应。 具有反向连接MTJ元件的MRAM的存储单元包括具有源极,栅极和漏极的开关器件和具有自由层,固定层和绝缘体层的反向连接MTJ器件, 自由层和固定层。 反连接MTJ器件的自由层连接到开关器件的漏极,固定层连接到位线(BL)。 反向连接MTJ设备将由源退化效应引起的存储器单元的较低IMTJ能力应用于较不严格的IMTJ(AP-> P),同时为更苛刻的IMTJ(P-> AP)保持较高的IMTJ能力。