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    • 5. 发明授权
    • Metal complex source reagents for MOCVD
    • 用于MOCVD的金属络合物源试剂
    • US5453494A
    • 1995-09-26
    • US181800
    • 1994-01-18
    • Peter S. KirlinDuncan W. BrownRobin A. Gardiner
    • Peter S. KirlinDuncan W. BrownRobin A. Gardiner
    • C23C16/18C23C16/40C23C16/448G01T5/08G02B6/02G02B6/036H01L39/24C06F5/00C07D213/22H01B12/00
    • G02B6/02C23C16/18C23C16/40C23C16/408C23C16/409C23C16/4481C23C16/4483C23C16/45561H01L39/2441
    • Metal organic chemical vapor deposition (MOCVD) source reagents useful for formation of metal-containing films, such as thin film copper oxide high temperature superconductor (HTSC) materials. The source reagents have the formula MAyX wherein: M is a metal such as Cu, Ba, Sr, La, Nd, Ce, Pr, Sm, Eu, Th, Gd, Tb, Dy, Ho, Er, Tm Yb, Lu Bi, Tl, Y or Pb; A is a monodentate or multidentate organic ligand; y is 2 or 3; MAy is a stable sub-complex at STP conditions; and X is a monodentate or multidentate ligand coordinated to M and containing one or more atoms independently selected from the group consisting of atoms of the elements C, N, H, S, O, and F. The ligand A may for example be selected from beta-diketonates, cyclopentadienyls, alkyls, perfluoroalkyls, alkoxides, perfluoroalkoxides, and Schiff bases. The complexes of the invention utilize monodentate or multidentate ligands to provide additional coordination to the metal atom, so that the resulting complex is of enhanced volatility characteristics, and enhanced suitability for MOCVD applications.
    • 用于形成含金属膜的金属有机化学气相沉积(MOCVD)源试剂,如薄膜氧化铜高温超导体(HTSC)材料。 所述源试剂具有下式:其中:M是金属如Cu,Ba,Sr,La,Nd,Ce,Pr,Sm,Eu,Th,Gd,Tb,Dy,Ho,Er,Tm Yb,Lu Bi ,Tl,Y或Pb; A是单齿或多齿有机配体; y为2或3; 在STP条件下,MAy是一个稳定的子复合体; 并且X是与M配位且含有独立地选自元素C,N,H,S,O和F的原子的一个或多个原子的单齿或多齿配体。配体A可以例如选自 β-二酮酸酯,环戊二烯基,烷基,全氟烷基,醇盐,全氟烷氧基化物和希夫碱。 本发明的络合物利用单齿或多齿配位体为金属原子提供额外的配位,使得所得复合物具有增强的挥发性特征,并且增强了对MOCVD应用的适用性。