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    • 10. 发明授权
    • Process for removal of resist mask over low k carbon-doped silicon oxide dielectric material of an integrated circuit structure, and removal of residues from via etch and resist mask removal
    • 用于在集成电路结构的低k碳掺杂氧化硅介电材料上去除抗蚀剂掩模的工艺,以及从通孔蚀刻和抗蚀剂掩模去除中除去残余物
    • US06562700B1
    • 2003-05-13
    • US09873043
    • 2001-05-31
    • Sam GuDavid PritchardDerryl D. J. AllmanPonce SaopraseuthSteve Reder
    • Sam GuDavid PritchardDerryl D. J. AllmanPonce SaopraseuthSteve Reder
    • H01L21322
    • H01L21/31138H01L21/02052H01L21/31633
    • A process is disclosed for removing a photoresist mask used to form openings in an underlying layer of low k carbon-doped silicon oxide dielectric material of an integrated circuit structure formed on a semiconductor substrate, which comprises exposing the photoresist mask in a plasma reactor to a plasma formed using a reducing gas until the photoresist mask is removed. In a preferred embodiment the reducing gas is selected from the group consisting of NH3, H2, forming gas, and a mixture of NH3 and H2. The process further provides for the removal of etch residues by first contacting the low k carbon-doped silicon oxide dielectric material with a solvent capable of dissolving and/or removing etch residues left from forming the openings in the low k dielectric material, and from removing the photoresist mask used to form the openings in the low k carbon-doped silicon oxide dielectric material; and then annealing the substrate in an annealing chamber at a temperature sufficient to remove liquid and gaseous byproducts from the low k carbon-doped silicon oxide dielectric material.
    • 公开了一种用于去除在半导体衬底上形成的集成电路结构的低k碳掺杂氧化硅介电材料的下层中形成开口的光刻胶掩模的方法,其包括将等离子体反应器中的光刻胶掩模曝光于 使用还原气体形成的等离子体直到除去光致抗蚀剂掩模。 在优选的实施方案中,还原气体选自NH 3,H 2,形成气体和NH 3和H 2的混合物。 该方法还通过首先使低k碳掺杂的氧化硅介电材料与能够溶解和/或去除在低k电介质材料中形成开口所留下的蚀刻残留物的溶剂和除去 用于在低k碳掺杂氧化硅电介质材料中形成开口的光致抗蚀剂掩模; 然后在退火室中以足以从低k碳掺杂的氧化硅介电材料除去液体和气体副产物的温度退火衬底。