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1. 发明授权

US06697037B1 TFT LCD active data line repair 失效
标题翻译： TFT LCD有源数据线修复
公开(公告)号：US06697037B1
公开(公告)日：2004-02-24
申请号：US08639583
申请日：1996-04-29
申请人： Paul Matthew Alt , Pedro A. Chalco , Bruce Kenneth Furman , Raymond Robert Horton , Chandrasekhar Narayan , Benal Lee Owens, Jr. , Kevin Wilson Warren , Steven Lorenz Wright
发明人： Paul Matthew Alt , Pedro A. Chalco , Bruce Kenneth Furman , Raymond Robert Horton , Chandrasekhar Narayan , Benal Lee Owens, Jr. , Kevin Wilson Warren , Steven Lorenz Wright
IPC分类号： G09G336
CPC分类号： G02F1/1309 , G02F2001/136272 , G09G3/3611 , G09G3/3685 , G09G2300/0426 , G09G2310/0297 , G09G2330/08 , G11C29/76 , Y10S345/904
摘要： A matrix addressed display system designed so as to enable data line repair by electronic mechanisms which is efficient and low in cost and thus increases yield. Such active data line repair utilizes additional data driver outputs, a defect map memory in the TFT/LCD module and modification of the data stream to the data drivers by additional circuits between the display and the display adapter. A bus configuration on the display substrate is utilized which combines repair flexibility, low parasitic capacitance, and the ability to easily make the necessary interconnections. The number of interconnections is kept to a minimum, the connections are reliable, and the connections may be made with conventional wire bond or laser bond technology, or disk bond technology.
摘要翻译：矩阵寻址显示系统设计，以便通过电子机制进行数据线修复，这是有效率和低成本的，从而提高产量。这种有源数据线修复利用附加数据驱动器输出，TFT / LCD模块中的缺陷图存储器，以及通过显示器和显示适配器之间的附加电路将数据流修改为数据驱动器。使用显示基板上的总线配置，其结合了修复灵活性，低寄生电容和容易进行必要互连的能力。互连的数量保持最小，连接是可靠的，并且可以用传统的引线键合或激光键合技术或磁盘接合技术来进行连接。

2. 发明授权

US6029881A Micro-scale part positioning by surface interlocking 失效
标题翻译：通过表面互锁的微尺寸部件定位
公开(公告)号：US6029881A
公开(公告)日：2000-02-29
申请号：US796405
申请日：1997-02-06
申请人： Pedro A. Chalco , Bruce Kenneth Furman , Raymond Robert Horton , Chandrasekhar Narayan
发明人： Pedro A. Chalco , Bruce Kenneth Furman , Raymond Robert Horton , Chandrasekhar Narayan
IPC分类号： B23K20/10 , H01L21/00
CPC分类号： H01L21/67138 , B23K20/10 , B23K20/106 , B23K2201/38 , B23K2201/40
摘要： A principle of surface interlocking wherein the imperfections of two parallel surfaces deform and interlock under pressure. The surface interlocking enables the combination of a bridging element and a bonding tip of a diffusion bonding apparatus to pick up, transport, position at a unique location, and bond the bridging element in place to the conductors or pads. In the invention a single point bonding tip as part of a bonding apparatus is used to pick up the, to be, bridging metal object transport it to the bonding site and perform the entire bridging bonding operation all in one sequence of steps.
摘要翻译：表面互锁的原理，其中两个平行表面的缺陷在压力下变形和互锁。表面互锁使得桥接元件和扩散接合装置的接合尖端的组合能够在独特的位置拾取，传输，定位，并将桥接元件固定到导体或焊盘上。在本发明中，作为接合装置的一部分的单点接合尖端用于拾取桥接金属物体将其传送到接合位置，并且以一系列步骤完成整个桥接接合操作。

3. 发明授权

US5948286A Diffusion bonding of lead interconnections using precise laser-thermosonic energy 失效
标题翻译：使用精确的激光热循环能量进行引线互连的扩散接合
公开(公告)号：US5948286A
公开(公告)日：1999-09-07
申请号：US796767
申请日：1997-02-06
申请人： Pedro A. Chalco , Raymond Robert Horton , Chandrasekhar Narayan , Michael Jon Palmer
发明人： Pedro A. Chalco , Raymond Robert Horton , Chandrasekhar Narayan , Michael Jon Palmer
IPC分类号： B23K26/06 , H01L21/48 , H05K3/32 , B23K26/00
CPC分类号： H05K3/328 , B23K26/06 , H01L21/4853 , H05K2201/10681 , H05K2203/0285 , H05K2203/107
摘要： Thin film diffusion bonding of lead assemblies under severly limited spacing, thermal and pressure conditions is achieved through application of precisely controlled energy at the bond interface. The precisely controlled energy is a laser thermosonic energy pulse, delivered through a cleaved optical fiber end and closed end tip, that produces a heat increment in excess of the steady state manufacturing design temperature for the assembly and which is applied directly at the bond interface.
摘要翻译：通过在接合界面应用精确控制的能量，可以实现极限间隔，热和压力条件下引线组件的薄膜扩散接合。精确控制的能量是通过裂开的光纤端和封闭端尖端传送的激光热能量脉冲，其产生超过组件的稳态制造设计温度的热增量，并且直接应用于接合界面处。

4. 发明授权

US5687078A Fine pitch bonding 失效
标题翻译：细间距键合
公开(公告)号：US5687078A
公开(公告)日：1997-11-11
申请号：US476531
申请日：1995-06-07
申请人： Raymond Robert Horton , Chandrasekhar Narayan , Michael Jon Palmer
发明人： Raymond Robert Horton , Chandrasekhar Narayan , Michael Jon Palmer
IPC分类号： H01L21/00 , G01K7/00
CPC分类号： H01L21/67144
摘要： In a bonding station, a tooling principle is provided wherein first and second tool parts respectively hold first and second apparatus parts, each apparatus part having fine conductor periodicity edge bonding regions, in superpositioned registration with the tool parts providing space and accessability for optical alignment and for bonding heat and pressure. The tool members retain a first, position registered, apparatus part, with "X" - "Y" registration capability, in position with an edge bearing a fine conductor periodicity accessable by a tapered edge of the tool which permits optical fine alignment adjustment and bonding heat and pressure application.
摘要翻译：在焊接站中，提供了一种工具原理，其中第一和第二工具部分分别保持第一和第二装置部分，每个装置部分具有精细的导体周期性边缘接合区域，与工具部件重叠对准，为光学对准提供空间和可访问性，用于粘合热和压力。工具构件保持具有“X” - “Y”配准能力的第一位置登记的装置部分，其位置具有可由工具的锥形边缘访问的精细导体周期性的边缘，其允许光学精细对准调整和结合热和压力应用。

5. 发明授权

US06295128B1 Optical alignment of superpositioned objects 失效
标题翻译：重叠对象的光学对齐
公开(公告)号：US06295128B1
公开(公告)日：2001-09-25
申请号：US08476178
申请日：1995-06-07
申请人： Raymond Robert Horton , Chandrasekhar Narayan , Michael Jon Palmer
发明人： Raymond Robert Horton , Chandrasekhar Narayan , Michael Jon Palmer
IPC分类号： G01B1100
CPC分类号： H01L21/681 , G02F1/13452
摘要： In alignment of superpositioned objects on opposing substrates accuracy and simplicity is achieved through relative movement of the substrates responsive to an image of one object reflected from the surface of the opposite substrate. Alignment of mating fine pitch conductors and pads for bonding is achieved by observation of the reflection of one conductor or pad in the surface of the opposite substrate and relatively moving the substrates to eliminate the reflection.
摘要翻译：在相对的基板上对准重叠物体时，通过相对于从相对基板的表面反射的一个物体的图像的相对运动来实现精度和简单性。通过观察相对基板的表面中的一个导体或垫的反射并相对移动基板以消除反射来实现用于接合的配合细间距导体和焊盘的对准。

6. 发明授权

US5641114A Controlled temperature bonding 失效
标题翻译：受控温度键合
公开(公告)号：US5641114A
公开(公告)日：1997-06-24
申请号：US475255
申请日：1995-06-07
申请人： Raymond Robert Horton , Chandrasekhar Narayan , Michael Jon Palmer
发明人： Raymond Robert Horton , Chandrasekhar Narayan , Michael Jon Palmer
IPC分类号： B23K1/00 , B23K31/02 , B23K37/00
CPC分类号： B23K1/0016 , B23K2201/40
摘要： In a bonding station the parts of the apparatus to be bonded are retained at a thermal bias temperature at a permitted level and a thermal check valve interface is provided between the bonding location and the part of the station that would serve as a conduction heat sink, thereby thermally insulating other uninvolved parts of the structure and and confining the bonding heat to the bonding region. Such confinement reduces the dwell time that the bond must remain at the bonding temperature. The bonding station has a number of features: the parts to be bonded are maintained on a support member that is provided with a heat biasing capability that can establish the assembly at a specified temperature; a retention capability, such as the use of vacuum, is provided to maintain registration and thermal contact of the part with the support; and a thermal check valve capability is provided to control the rate of heat flow through the support member so that locallized heat is controlled in dissipation.
摘要翻译：在接合站中，要被接合的设备的部件被保持在允许的水平的热偏压温度，并且在用作传导散热器的接合位置和站的部分之间提供热止回阀接口，从而将结构的其它未掺杂部分进行绝热并且将结合热限制到接合区域。这种限制减少了粘合在粘合温度下必须保持的停留时间。粘合台具有许多特征：待粘合的部件被保持在具有可在规定温度下建立组件的热偏置能力的支撑部件上; 提供保持能力，例如使用真空，以保持部件与支撑件的配准和热接触; 并且提供热止回阀能力以控制通过支撑构件的热流的速率，从而控制局部放热的散热。

7. 发明授权

US06734363B1 Lightweight electronic equipment conductor with coolant permeable support 失效
标题翻译：轻型电子设备导体，带冷却剂可渗透支撑
公开(公告)号：US06734363B1
公开(公告)日：2004-05-11
申请号：US09205782
申请日：1998-12-04
申请人： Raymond Robert Horton , Ismail Cevdet Noyan , Michael Jon Palmer , William Edward Pence, IV
发明人： Raymond Robert Horton , Ismail Cevdet Noyan , Michael Jon Palmer , William Edward Pence, IV
IPC分类号： H01B700
CPC分类号： H05K7/20009 , H01L23/142 , H01L23/367 , H01L23/3733 , H01L2924/0002 , H01L2924/3011 , H05K5/0091 , H01L2924/00
摘要： The invention provides a wiring conductor for densely packed electronic apparatus, on which there is a supporting body of a material with randomly intertwined and fused filaments with spacing for being permeated by a coolant. The filamentary body material in addition may have imparted thereto the physical properties of interdependent density and permeability, noncorrosiveness and electrical conductivity.
摘要翻译：本发明提供了一种用于密集封装的电子设备的布线导体，其上有一个材料的支撑体，具有随机缠绕的和熔合的长丝，间隔被冷却剂渗透。此外，丝状体材料可以赋予其相互依赖的密度和渗透性，非腐蚀性和导电性的物理性质。

8. 发明授权

US06326696B1 Electronic package with interconnected chips 失效
标题翻译：具有互连芯片的电子封装
公开(公告)号：US06326696B1
公开(公告)日：2001-12-04
申请号：US09018698
申请日：1998-02-04
申请人： Raymond Robert Horton , Alphonso Philip Lanzetta , Joseph Maryan Milewski , Lawrence S. Mok , Robert Kevin Montoye , Hussain Shaukatulla
发明人： Raymond Robert Horton , Alphonso Philip Lanzetta , Joseph Maryan Milewski , Lawrence S. Mok , Robert Kevin Montoye , Hussain Shaukatulla
IPC分类号： H01L2348
CPC分类号： H01L23/49822 , H01L23/49811 , H01L23/49833 , H01L24/45 , H01L24/48 , H01L2224/05599 , H01L2224/16145 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/854 , H01L2224/85439 , H01L2224/85444 , H01L2224/8547 , H01L2924/00014 , H01L2924/01039 , H01L2924/01079 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： An electronic package which includes a circuitized substrate with a cavity and a first semiconductor chip positioned therein. The first chip is electrically coupled to conductive members located on the circuitized substrate. A second semiconductor chip is positioned on and electrically coupled to the first chip.
摘要翻译：一种电子封装，其包括具有空腔的电路化基板和位于其中的第一半导体芯片。第一芯片电耦合到位于电路化基板上的导电构件。第二半导体芯片位于第一芯片上并电耦合到第一芯片。

9. 发明授权

US5669437A High efficiency thermal interposer 失效
标题翻译：高效热插入器
公开(公告)号：US5669437A
公开(公告)日：1997-09-23
申请号：US172674
申请日：1993-12-22
申请人： Bernardo Hernandez , Raymond Robert Horton , Ismail Cevdet Noyan , Michael Jon Palmer
发明人： Bernardo Hernandez , Raymond Robert Horton , Ismail Cevdet Noyan , Michael Jon Palmer
IPC分类号： H01L21/60 , B23K20/02 , F28F9/20 , F28F13/00 , F28F7/00 , B23K1/12
CPC分类号： B23K20/025 , B23K20/023 , F28F13/00 , F28F9/20 , H01L2924/0002
摘要： A high efficiency thermal interposer comprising a first hollow disk and second hollow disk, held together by thermally isolating fasteners. The fasteners keep the disks from touching one another. In an illustrative embodiment of the invention, the first disk is the low temperature disk portion and the second disk is the high temperature disk portion of the heat shield. Furthermore, according to a preferred embodiment of the invention, the space between the disks is filled with small thermally conductive particles (e.g., stainless steel spheres) which are in thermal contact with the high temperature disk; but which are not in contact with the low temperature disk. The thermal interposer/heat shield includes means for introducing cold jets of air into the cavity containing the particles, means for circulating the air therebetween, and means through which the air can exit from the cavity to carry away the heat picked up from the particles inside the cavity. The novel thermal interposer has a low mass, is compact and can achieve a temperature drop that will permit high powered HAT devices to be used in conjuction with temperature sensitive electronic orientation means, such as robot arms.
摘要翻译：一种高效热插入件，包括第一中空盘和第二中空盘，通过热隔离紧固件保持在一起。紧固件保持磁盘彼此接触。在本发明的说明性实施例中，第一盘是低温盘部分，第二盘是隔热板的高温盘部分。此外，根据本发明的优选实施例，盘之间的空间填充有与高温盘热接触的小导热颗粒（例如不锈钢球）; 但不与低温盘接触。热插入器/隔热罩包括用于将冷空气引入到容纳颗粒的空腔中的装置，用于使空气循环的装置，以及空气可以从腔排出以携带从颗粒内部吸收的热量的装置空腔。新型热插入器具有质量低，紧凑，并且可以实现温度下降，这将允许高功率HAT装置与温度敏感的电子定向装置（例如机器人臂）结合使用。

10. 发明授权

US06306686B1 Method of fabricating an electronic package with interconnected chips 失效
标题翻译：制造具有互连芯片的电子封装的方法
公开(公告)号：US06306686B1
公开(公告)日：2001-10-23
申请号：US09487747
申请日：2000-01-19
申请人： Raymond Robert Horton , Alphonso Philip Lanzetta , Joseph Maryan Milewski , Lawrence S. Mok , Robert Kevin Montoye , Hussain Shaukatulla
发明人： Raymond Robert Horton , Alphonso Philip Lanzetta , Joseph Maryan Milewski , Lawrence S. Mok , Robert Kevin Montoye , Hussain Shaukatulla
IPC分类号： H01L2150
CPC分类号： H01L23/49822 , H01L23/49811 , H01L23/49833 , H01L24/45 , H01L24/48 , H01L2224/05599 , H01L2224/16145 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/854 , H01L2224/85439 , H01L2224/85444 , H01L2224/8547 , H01L2924/00014 , H01L2924/01039 , H01L2924/01079 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： An electronic package which includes a circuitized substrate with a cavity and a first semiconductor chip positioned therein. The first chip is electrically coupled to conductive members located on the circuitized substrate. A second semiconductor chip is positioned on and electrically coupled to the first chip.
摘要翻译：一种电子封装，其包括具有空腔的电路化基板和位于其中的第一半导体芯片。第一芯片电耦合到位于电路化基板上的导电构件。第二半导体芯片位于第一芯片上并电耦合到第一芯片。

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