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    • 1. 发明授权
    • Lightweight packaging
    • 轻便包装
    • US5847926A
    • 1998-12-08
    • US772655
    • 1996-12-23
    • Raymond Robert HortonIsmail Cevdet NoyanMichael Jon PalmerWilliam Edward Pence, IV
    • Raymond Robert HortonIsmail Cevdet NoyanMichael Jon PalmerWilliam Edward Pence, IV
    • H01L23/06H01L23/14H01L23/367H01L23/373H05K5/00H05K5/02H05K7/20
    • H05K7/20009H01L23/142H01L23/367H01L23/3733H05K5/0091H01L2924/0002H01L2924/3011Y10T29/49002
    • The invention provides lightweight packaging of portable electronic apparatus by using the combined structural properties of an enclosure, that houses the interwired heat producing electronic signal devices of the apparatus, to provide coolant movement and direction, locally selectable physical protection and shock resistance and electrical shielding. It achieves the packaging benefits by having; a laminated enclosure member structure that has an internal device supporting lamination and an external wear resistant lamination on each side of a layer of a material that has the combined physical properties of selectably interrelated coolant permeability and density, non-corrosiveness and electrical conductivity; heat generating signal processing devices mounted on the internal lamination; positioned holes through the laminations on each side of the permeable material layer that provide entrance, exit and directing openings for a coolant fluid, including air, that is brought in from the outside, and, propelling the coolant at least conventionally by the heat from the signal processing devices and additionally by a separate fan located in the enclosure so that the heated coolant is exhausted to the outside. Localized shock resistance is imparted by selective change in the density of the permeable layer.
    • 本发明通过使用容纳设备的相互连接的发热电子信号装置的外壳的组合结构特性来提供便携式电子设备的轻量级包装,以提供冷却剂运动和方向,局部可选择的物理保护和抗冲击性以及电屏蔽。 它通过拥有包装的好处来实现; 层压的外壳构件结构,其具有支撑层压的内部装置和在材料层的每一侧上具有可选择地相互关联的冷却剂渗透性和密度,非腐蚀性和导电性的组合物理性质的外部耐磨层压; 安装在内层上的发热信号处理装置; 定位孔穿过可渗透材料层的每一侧上的层叠体,其为从外部引入的冷却剂流体(包括空气)提供入口,出口和引导开口,并且至少传统地通过来自 信号处理装置,另外由位于外壳中的单独的风扇,使得加热的冷却剂被排出到外部。 通过选择性地改变可渗透层的密度来赋予局部抗冲击性。