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1. 发明授权

US11765837B2 Method and apparatus for flexible circuit cable attachment 有权
公开(公告)号：US11765837B2
公开(公告)日：2023-09-19
申请号：US17504812
申请日：2021-10-19
申请人： Jabil Inc.
发明人： Wenlu Wang , Mark A. Tudman , Michael Piring Santos , Ross Kristensen Benz , Hien Ly , Gary Fang
IPC分类号： H05K3/36 , H05K3/34 , H01L23/00 , B23K20/02 , B23K20/233 , H01L21/84 , H05K1/11 , B23K20/00 , B23K20/24 , B23K35/02 , B23K35/30 , H05K3/32 , H05K3/40 , H05K13/00 , B23K101/42 , B23K103/08 , B32B37/06
CPC分类号： H05K3/3494 , B23K20/007 , B23K20/025 , B23K20/233 , B23K20/24 , B23K35/0222 , B23K35/3013 , H01L21/84 , H01L24/80 , H05K1/111 , H05K1/117 , H05K3/321 , H05K3/361 , H05K3/363 , H05K3/4015 , H05K13/0015 , B23K2101/42 , B23K2103/08 , B32B37/06 , H05K2203/049 , H05K2203/166 , Y02P70/50 , Y02P70/62
摘要： A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.

2. 发明申请

US20180132360A1 METHOD AND APPARATUS FOR FLEXIBLE CIRCUIT CABLE ATTACHMENT 审中-公开
公开(公告)号：US20180132360A1
公开(公告)日：2018-05-10
申请号：US15344101
申请日：2016-11-04
申请人： Jabil Circuit, Inc.
发明人： Wenlu Wang , Mark A. Tudman , Michael Piring Santos , Ross Kristensen Benz , Hien Ly , Gary Fang
IPC分类号： H05K3/34 , H05K1/11 , H05K3/40 , H05K3/32 , H05K13/00 , B23K20/00 , B23K20/24 , B23K35/02 , B23K35/30
CPC分类号： H05K3/3494 , B23K20/007 , B23K20/025 , B23K20/233 , B23K20/24 , B23K35/0222 , B23K35/3013 , B23K2101/42 , B23K2103/08 , H01L21/84 , H01L24/80 , H05K1/111 , H05K1/117 , H05K3/321 , H05K3/361 , H05K3/363 , H05K3/4015 , H05K13/0015 , H05K2203/049 , H05K2203/166 , Y02P70/611
摘要： A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.

3. 发明授权

US09658033B1 Lattice reinforced armor array 有权
公开(公告)号：US09658033B1
公开(公告)日：2017-05-23
申请号：US13896699
申请日：2013-05-17
申请人： Armorworks Enterprises, LLC
发明人： William J. Perciballi
IPC分类号： F41H5/02 , F41H5/04 , B21D31/04 , B23K20/02
CPC分类号： F41H5/0421 , B21D31/04 , B21D47/00 , B23K20/025 , F41H5/0414 , F41H5/0428 , F41H5/0478
摘要： Designs and methods are provided for a hard armor structure comprising a symmetrical array of regularly shaped armor tiles, and a lattice structure comprising rigid cell walls surrounding each tile.

4. 发明申请

US20060105184A1 CERAMIC ARMOR AND METHOD OF MAKING BY ENCAPSULATION IN A HOT PRESSED THREE LAYER METAL ASSEMBLY 失效
标题翻译：陶瓷装甲和热压制三层金属装置制造方法
公开(公告)号：US20060105184A1
公开(公告)日：2006-05-18
申请号：US10721862
申请日：2003-11-26
申请人： Richard Palicka , Daniel Ashkin
发明人： Richard Palicka , Daniel Ashkin
IPC分类号： B32B1/04 , B23K31/02 , B23K1/00 , B23K20/00 , B32B15/04
CPC分类号： B23K20/233 , B23K20/025 , B23K2103/14 , F41H5/0414 , F41H5/0492 , Y10T29/49906 , Y10T29/49908 , Y10T428/12451 , Y10T428/12486 , Y10T428/12576 , Y10T428/12611 , Y10T428/239
摘要： A ceramic armor is disclosed in several embodiments. In a first embodiment, a metal base plate has a metal frame assembled on it having a central opening into which the ceramic material is placed. A cover plate is placed over the frame to enclose the ceramic material on all sides. In a second embodiment, the frame has an open central area that has two crossing walls that define four sub-chambers. Four pieces of ceramic material are placed in the respective sub-chambers and a covering plate is placed over it. In a further embodiment, the frame has a plurality of cavities mechanically formed in it. A ceramic tile or plate is placed in each cavity and a cover plate is placed over the frame. The metal used to encapsulate the ceramic material may, if desired, comprise a Titanium alloy such as Ti-6Al-4V, and the ceramic material may comprise Silicon Carbide, Boron Carbide, Tungsten Carbide, Titanium Diboride or Aluminum Nitride. A hot pressing procedure is carried out on the armor to cause the metal to plastically deform about the encapsulated ceramic material.
摘要翻译：在几个实施例中公开了一种陶瓷装甲。在第一实施例中，金属基板具有组装在其上的金属框架，该金属框架具有放置陶瓷材料的中心开口。将盖板放置在框架上方以将所有侧面上的陶瓷材料封闭。在第二实施例中，框架具有敞开的中心区域，其具有限定四个子室的两个交叉壁。将四块陶瓷材料放置在相应的子室中，并且将覆盖板放置在其上。在另一实施例中，框架具有机械地形成在其中的多个空腔。将瓷砖或板放置在每个空腔中，并将盖板放置在框架上。如果需要，用于包封陶瓷材料的金属可以包含诸如Ti-6Al-4V的钛合金，并且陶瓷材料可以包括碳化硅，碳化硼，碳化钨，二硼化钛或氮化铝。在装甲上进行热压操作，使金属围绕封装的陶瓷材料发生塑性变形。

5. 发明授权

US06651864B2 Dissipative ceramic bonding tool tip 有权
标题翻译：耗散陶瓷焊接工具尖端
公开(公告)号：US06651864B2
公开(公告)日：2003-11-25
申请号：US10036579
申请日：2001-12-31
申请人： Steven Frederick Reiber , Mary Louise Reiber
发明人： Steven Frederick Reiber , Mary Louise Reiber
IPC分类号： B23K3700
CPC分类号： H01L24/85 , B23K20/004 , B23K20/005 , B23K20/025 , B23K2101/32 , H01L24/45 , H01L24/78 , H01L2224/45015 , H01L2224/45144 , H01L2224/78302 , H01L2224/85205 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01105 , H01L2924/04941 , H01L2924/14 , H01L2924/181 , H01L2924/30105 , H01L2224/48 , H01L2924/00 , H01L2924/00015
摘要： Methods for making and using dissipative ceramic bonding tool tips for wire bonding electrical connections to bonding pads on integrated circuit chips and packages. The method of using the dissipative ceramic bonding tool tip includes dissipating charge while bonding to avoid damaging delicate electronic devices by a sudden surge of accumulated charge. The method of making the tool tip includes affecting its conductivity so that it conducts electricity at a rate sufficient to prevent charge buildup, but not sufficient to overload the device being bonded. For best results, a resistance in the tip assembly itself should range from 5×104 or 105 to 1012 ohms. In addition, the tips must also have specific mechanical properties to function satisfactorily.
摘要翻译：用于制造和使用耗散陶瓷焊接工具尖端的方法，用于将电连接到集成电路芯片和封装上的焊盘上。使用耗散陶瓷焊接工具尖端的方法包括在接合时消散电荷，以避免突然的累积电荷浪涌损坏精密的电子器件。制造刀尖的方法包括影响其导电性，使得其以足以防止电荷积聚的速率传导电，但不足以使被结合的装置过载。为了获得最佳效果，尖端组件本身的电阻应在5×10 4或10 5至10 12欧姆的范围内。此外，尖端还必须具有特别的机械性能以令人满意地起作用。

6. 发明授权

US5996434A Pressure head with dual horns 失效
标题翻译：压头与双喇叭
公开(公告)号：US5996434A
公开(公告)日：1999-12-07
申请号：US901916
申请日：1997-07-29
申请人： David W. Swanson
发明人： David W. Swanson
IPC分类号： B23K20/02 , B23K20/20
CPC分类号： B23K20/025 , Y10T74/18992
摘要： A pressure head (10) for contacting pressure areas through relative movement in the vertical Z-direction includes a frame (20), a pair of horn assemblies (12) each including a horn (100) for contacting a workpiece (230), the horn (100) supported by a gimbal (40) connected to the frame (20) and a pair of pressure assemblies 15, each including a pressure cylinder (310) for applying a force to its horn (100). The gimbal (40) has only a single outer torsion member (50) and supports the horn (100) such that the horn (100) can rotate about orthogonal X and Y rotation axes and can translate in the Z-direction relative to frame (20). Each gimbal (40) having only a single outer torsion member (50) allows a pair of gimbals (40) to support horns (100) in close proximity for operation on two proximal work areas.
摘要翻译：用于通过在垂直Z方向上的相对运动来接触压力区域的压头（10）包括框架（20），一对喇叭组件（12），每个喇叭组件包括用于接触工件（230）的喇叭（100）连接到框架（20）的万向节（40）支撑的喇叭（100）和一对压力组件15，每个压力组件15包括用于向其喇叭（100）施加力的压力缸（310）。万向节（40）仅具有单个外扭转构件（50）并且支撑喇叭（100），使得喇叭（100）可绕正交的X和Y旋转轴线旋转，并且可相对于框架在Z方向上平移 20）。每个仅具有单个外扭转构件（50）的万向节（40）允许一对万向节（40）邻近地支撑喇叭（100），以在两个近端工作区域上操作。

7. 发明授权

US5370299A Bonding tool having diamond head and method of manufacturing the same 失效
标题翻译：具有金刚石头的接合工具及其制造方法
公开(公告)号：US5370299A
公开(公告)日：1994-12-06
申请号：US41545
申请日：1993-04-02
申请人： Keiichiro Tanabe , Toshiya Takahashi , Akihiko Ikegaya , Naoji Fujimori
发明人： Keiichiro Tanabe , Toshiya Takahashi , Akihiko Ikegaya , Naoji Fujimori
IPC分类号： B23K20/02 , C04B41/50 , C04B41/85 , H05K13/00 , H01L21/58
CPC分类号： C04B41/009 , B23K20/025 , C04B41/5002 , C04B41/85 , H01L24/79 , H05K13/003
摘要： A bonding tool has a head portion made essentially of vapor-deposited diamond, wherein a principal diamond crystal plane forming a head face is a (111) plane. Such a head face has high hardness and a good wear resistance. In order to improve the toughness of a bonding head which is mainly made of vapor-deposited diamond, a portion or ply forming the head face consists essentially of high-purity diamond, and another portion or ply supporting the head face consists essentially of low-purity diamond. The head face has a high rigidity, while the portion supporting the head face has a high toughness. In order to provide a bonding head portion which is mainly made of vapor-deposited diamond with electrical conductivity, a first portion or ply forming a head face consists essentially of polycrystalline diamond containing a relatively small amount of dopant, and another portion or ply supporting the first portion or ply contains a large amount of dopant. The head portion having electrical conductivity can be heated by energization. In a tool employing a coating containing vapor-deposited diamond as a bonding head portion, the coating is formed by a compound of a metal or ceramics and vapor-deposited diamond, in order to improve the strength of the coating and adhesion to a tool substrate.
摘要翻译：接合工具具有基本上由气相沉积金刚石制成的头部，其中形成头部面的主要金刚石晶体平面是（111）面。这种头面具有高硬度和良好的耐磨性。为了提高主要由气相沉积金刚石制成的接合头的韧性，形成头部面的部分或层基本上由高纯度的金刚石组成，并且支撑头部面的另一部分或层基本上由低熔点金刚石构成，纯度钻石。头部表面具有高刚性，而支撑头部面的部分具有高韧性。为了提供主要由具有导电性的气相沉积金刚石制成的接合头部分，形成头部面的第一部分或第一部分基本上由含有相对少量掺杂剂的多晶金刚石组成，另一部分或层叠支撑第一部分或第二部分含有大量的掺杂剂。可以通过通电来加热具有导电性的头部。在使用包含气相沉积金刚石作为粘合头部分的涂层的工具中，涂层由金属或陶瓷和气相沉积金刚石的化合物形成，以便提高涂层的强度和对工具基材的粘附。

8. 发明授权

US4872604A Heated tool with stop mechanism 失效
标题翻译：加热工具具有停止机构
公开(公告)号：US4872604A
公开(公告)日：1989-10-10
申请号：US215626
申请日：1988-07-06
申请人： Gero Zimmer
发明人： Gero Zimmer
IPC分类号： B23K3/047 , B23K20/02 , H01R43/02 , H05K3/34
CPC分类号： B23K3/0471 , B23K20/025 , H01R43/02 , H05K3/3421 , H05K2203/0182 , H05K2203/0195 , Y02P70/613
摘要： An apparatus for connecting one part to another by heating the parts comprises a heated tool with a heating bar, having a heated surface for being brought into contact with the one part and for being moved toward the other part, and a stop mechanism in the form of a mechanical stop bar, or sensing arrangement for stopping the movement of the heated tool toward the other part when a selected spacing between the heated tool and the other part is reached.
摘要翻译：用于通过加热部件将一个部件连接到另一个部件的装置包括具有加热棒的加热工具，其具有与一个部件接触并被朝向另一部分移动的加热表面，以及形式为止的停止机构机械止动杆或用于当加热的工具和另一部分之间的选定间隔到达时停止加热的工具向另一部分运动的检测装置。

9. 发明授权

US4096983A Bonding copper leads to gold film coatings on alumina ceramic substrate 失效
标题翻译：结合铜导致氧化铝陶瓷基底上的金膜涂层
公开(公告)号：US4096983A
公开(公告)日：1978-06-27
申请号：US786389
申请日：1977-04-11
申请人： Loraine F. Beilein , Frank S. Burkett, Jr.
发明人： Loraine F. Beilein , Frank S. Burkett, Jr.
IPC分类号： B23K20/02 , B23K31/00 , H01L21/603 , H01R43/02 , B23K31/02
CPC分类号： H01L24/85 , B23K20/025 , H01L24/48 , H01R12/57 , H01L2224/05624 , H01L2224/05644 , H01L2224/45014 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48455 , H01L2224/48463 , H01L2224/4847 , H01L2224/48475 , H01L2224/4848 , H01L2224/48499 , H01L2224/48599 , H01L2224/48624 , H01L2224/48644 , H01L2224/48844 , H01L2224/49429 , H01L2224/85051 , H01L2224/85201 , H01L2224/85203 , H01L24/45 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/15787 , H01L2924/20104 , H01L2924/20105 , H01L2924/20752 , H01L2924/20755 , H01L2924/2076 , Y10S228/904
摘要： A process for thermocompression bonding a copper wire lead to gold film on alumina ceramic substrate by use of a gold interface. The three step process involves: (1) thermocompressing a gold lead with a die-formed head to the gold film, (2) removing the gold lead to form a gold die-formed head bonding pad, and (3) thermocompressing the copper lead to the gold die-formed head bonding pad.
摘要翻译：通过使用金界面将铜线引线与氧化铝陶瓷基板上的金膜热压接合的方法。三步工艺包括：（1）将带有模具头的金铅热压到金膜上，（2）去除金铅以形成金模头焊接垫，（3）热压铜导线到金模头焊接垫。

10. 发明授权

US07077306B2 Ceramic armor and method of making by encapsulation in a hot pressed three layer metal assembly 失效
标题翻译：陶瓷装甲和通过在热压三层金属组件中封装制造的方法
公开(公告)号：US07077306B2
公开(公告)日：2006-07-18
申请号：US10721862
申请日：2003-11-26
申请人： Richard John Palicka , Daniel Ashkin
发明人： Richard John Palicka , Daniel Ashkin
IPC分类号： F41H5/04 , B23K20/02 , B32B3/14
CPC分类号： B23K20/233 , B23K20/025 , B23K2103/14 , F41H5/0414 , F41H5/0492 , Y10T29/49906 , Y10T29/49908 , Y10T428/12451 , Y10T428/12486 , Y10T428/12576 , Y10T428/12611 , Y10T428/239
摘要： A ceramic armor is disclosed in several embodiments. In a first embodiment, a metal base plate has a metal frame assembled on it having a central opening into which the ceramic material is placed. A cover plate is placed over the frame to enclose the ceramic material on all sides. In a second embodiment, the frame has an open central area that has two crossing walls that define four sub-chambers. Four pieces of ceramic material are placed in the respective sub-chambers and a covering plate is placed over it. In a further embodiment, the frame has a plurality of cavities mechanically formed in it. A ceramic tile or plate is placed in each cavity and a cover plate is placed over the frame. The metal used to encapsulate the ceramic material may, if desired, comprise a Titanium alloy such as Ti-6Al-4V, and the ceramic material may comprise Silicon Carbide, Boron Carbide, Tungsten Carbide, Titanium Diboride or Aluminum Nitride. A hot pressing procedure is carried out on the armor to cause the metal to plastically deform about the encapsulated ceramic material.
摘要翻译：在几个实施例中公开了一种陶瓷装甲。在第一实施例中，金属基板具有组装在其上的金属框架，该金属框架具有放置陶瓷材料的中心开口。将盖板放置在框架上方以将所有侧面上的陶瓷材料封闭。在第二实施例中，框架具有敞开的中心区域，其具有限定四个子室的两个交叉壁。将四块陶瓷材料放置在相应的子室中，并且将覆盖板放置在其上。在另一实施例中，框架具有机械地形成在其中的多个空腔。将瓷砖或板放置在每个空腔中，并将盖板放置在框架上。如果需要，用于包封陶瓷材料的金属可以包含诸如Ti-6Al-4V的钛合金，并且陶瓷材料可以包括碳化硅，碳化硼，碳化钨，二硼化钛或氮化铝。在装甲上进行热压操作，使金属围绕封装的陶瓷材料发生塑性变形。

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