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1. 发明授权

US6165278A Removing thermal grease from electronic cards 失效
标题翻译：从电子卡中取出导热油脂
公开(公告)号：US6165278A
公开(公告)日：2000-12-26
申请号：US536238
申请日：2000-03-27
申请人： Paul Joseph Hart , Vittorio Sirtori , Sergio Varinelli , Marino Verderio , Franco Zambon
发明人： Paul Joseph Hart , Vittorio Sirtori , Sergio Varinelli , Marino Verderio , Franco Zambon
IPC分类号： B08B3/08 , C11D7/10 , C11D7/50 , C11D11/00 , H05K1/02 , H05K3/26 , B08B3/04
CPC分类号： C11D7/10 , B08B3/08 , C11D7/5022 , C11D11/0047 , H05K1/0203 , H05K3/26 , H05K2203/0783
摘要： A method for removing thermal grease from an electronic card having plated via holes and including electronic components thereon, the method including the steps of providing a substantially water free solution having an alcohol and at least one compound of a neutral ammonium salt of an organic acid and immersing the electronic card in the solution for a predetermined period of time remove the thermal grease from the electronic card.
摘要翻译：一种用于从具有电镀通孔并且包括电子部件的电子卡移除导热油脂的方法，所述方法包括以下步骤：提供具有醇和至少一种有机酸的中性铵盐的化合物的基本上无水的溶液，以及将电子卡浸入溶液中一段预定的时间，从电子卡片中取出导热油脂。

2. 发明授权

US06635123B2 Copper preservative treatment 失效
标题翻译：铜防腐处理
公开(公告)号：US06635123B2
公开(公告)日：2003-10-21
申请号：US09838876
申请日：2001-04-23
申请人： Pletro Luigi Cavallotti , Fiavio Cereda , Vittorio Sirtori , Franco Zambon
发明人： Pletro Luigi Cavallotti , Fiavio Cereda , Vittorio Sirtori , Franco Zambon
IPC分类号： C23C2200
CPC分类号： B23K1/206 , B23K1/203 , B23K35/34 , B23K35/3615 , C23C22/68 , C23F11/08 , H05K3/282 , Y10T428/12493 , Y10T428/12528 , Y10T428/12687 , Y10T428/12785 , Y10T428/12792 , Y10T428/12903 , Y10T428/31678
摘要： A method of pretreating a copper surface for protecting the surface from oxidation, by immersing the surface in a solution containing organic solderabilty preservatives, such as BenzoTriAzole, with the addition of a zinc salt. The method is particularly useful in the manufacturing of electronic Printed Circuit Boards for protecting the copper surfaces during the solder processes when the PCB undergoes high temperature. The addition of the zinc salts also gives the additional advantage of increasing the solderabilty properties of the copper surface (i.e. wettability and adhesion).
摘要翻译：通过将表面浸入含有有机可焊性防腐剂如BenzoTriAzole的溶液中，加入锌盐，预处理铜表面以保护表面免受氧化的方法。该方法在制造用于在PCB经历高温时的焊接工艺期间保护铜表面的电子印刷电路板特别有用。添加锌盐还具有增加铜表面的可焊性（即润湿性和粘附性）的额外优点。

3. 发明授权

US06994803B2 Ball grid array module 有权
标题翻译：球栅阵列模块
公开(公告)号：US06994803B2
公开(公告)日：2006-02-07
申请号：US10436591
申请日：2003-05-12
申请人： Luigi Giussani , Lorenza Lombardi , Michele Monopoli , Vittorio Sirtori , Franco Zambon
发明人： Luigi Giussani , Lorenza Lombardi , Michele Monopoli , Vittorio Sirtori , Franco Zambon
IPC分类号： C09K3/00 , C09K15/32 , C11D17/00 , H05K3/30 , H05K13/00
CPC分类号： H05K3/0076 , H01L24/48 , H01L24/81 , H01L24/85 , H01L2224/05624 , H01L2224/16 , H01L2224/48091 , H01L2224/81801 , H01L2224/85 , H01L2224/85399 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01033 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H05K3/3452 , H05K2203/0786 , H05K2203/122 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , Y10T29/49147 , Y10T29/49149 , Y10T29/49169 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： The method according to a preferred embodiment of the present invention mitigates the problem of gold contamination during the SMT assembly operations in the manufacture of Hybrid Multi Chip Modules (HMCM), achieving a high assembly process yield. This target is accomplished by protecting, at the first process step, the gold with a thin layer (0.02–0.03 millimeter) of a paste very soluble in water and washing it off.The protective layer obtained with the above described method is very strong. Furthermore it is very easy to remove, since it is soluble in water.
摘要翻译：根据本发明的优选实施例的方法在制造混合多芯片模块（HMCM）的SMT组装操作期间减轻了金污染的问题，实现了高的组装工艺产量。该目标通过在第一工艺步骤中保护具有非常溶于水并将其清除的薄层（0.02-0.03毫米）的金来实现。

4. 发明授权

US06815088B2 Copper preservative treatment 失效
标题翻译：铜防腐处理
公开(公告)号：US06815088B2
公开(公告)日：2004-11-09
申请号：US10628262
申请日：2003-07-29
申请人： Pietro Luigi Cavallotti , Flavio Cereda , Vittorio Sirtori , Franco Zambon
发明人： Pietro Luigi Cavallotti , Flavio Cereda , Vittorio Sirtori , Franco Zambon
IPC分类号： B32B1504
CPC分类号： B23K1/206 , B23K1/203 , B23K35/34 , B23K35/3615 , C23C22/68 , C23F11/08 , H05K3/282 , Y10T428/12493 , Y10T428/12528 , Y10T428/12687 , Y10T428/12785 , Y10T428/12792 , Y10T428/12903 , Y10T428/31678
摘要： A method of pretreating a copper surface for protecting the surface from oxidation, by immersing the surface in a solution containing organic solderabilty preservatives, such as BenzoTriAzole, with the addition of a zinc salt. The method is particularly useful in the manufacturing of electronic Printed Circuit Boards for protecting the copper surfaces during the solder processes when the PCB undergoes high temperature. The addition of the zinc salts also gives the additional advantage of increasing the solderabilty properties of the copper surface (i.e. wettability and adhesion).

5. 发明授权

US06574860B1 Ball grid array module 失效
标题翻译：球栅阵列模块
公开(公告)号：US06574860B1
公开(公告)日：2003-06-10
申请号：US09666949
申请日：2000-09-20
申请人： Luigi Giussani , Lorenza Lombardi , Michele Monopoli , Vittorio Sirtori , Franco Zambon
发明人： Luigi Giussani , Lorenza Lombardi , Michele Monopoli , Vittorio Sirtori , Franco Zambon
IPC分类号： H05K334
CPC分类号： H05K3/0076 , H01L24/48 , H01L24/81 , H01L24/85 , H01L2224/05624 , H01L2224/16 , H01L2224/48091 , H01L2224/81801 , H01L2224/85 , H01L2224/85399 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01033 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H05K3/3452 , H05K2203/0786 , H05K2203/122 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , Y10T29/49147 , Y10T29/49149 , Y10T29/49169 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： The method according to a preferred embodiment of the present invention mitigates the problem of gold contamination during the SMT assembly operations in the manufacture of Hybrid Multi Chip Modules (HMCM), achieving a high assembly process yield. This target is accomplished by protecting, at the first process step, the gold with a thin layer (0.02-0.03 millimeter) of a paste very soluble in water and washing it off. The protective layer obtained with the above described method is very strong. Furthermore it is very easy to remove, since it is soluble in water.
摘要翻译：根据本发明的优选实施例的方法在制造混合多芯片模块（HMCM）的SMT组装操作期间减轻了金污染的问题，实现了高的组装工艺产量。该目标通过在第一工艺步骤中保护具有非常溶于水并将其清除的薄层（0.02-0.03毫米）的金来实现。用上述方法获得的保护层非常强。此外，它非常容易去除，因为它可溶于水。

6. 发明授权

US06453263B1 Surface analysis using ellipsometry 失效
标题翻译：使用椭偏仪进行表面分析
公开(公告)号：US06453263B1
公开(公告)日：2002-09-17
申请号：US09548941
申请日：2000-04-13
申请人： Vittorio Sirtori , Lorenza Lombardi , Michele Monopoli , Franco Zambon
发明人： Vittorio Sirtori , Lorenza Lombardi , Michele Monopoli , Franco Zambon
IPC分类号： G01B1302
CPC分类号： G01B11/303 , G01B11/0641
摘要： A method and system for estimating the roughness and the contamination of a surface. A preferred embodiment of the present invention makes use of a mathematical model which gives indications of the metal roughness, expressed as the ratio of metal volume to air volume, and the contamination thickness values of a metal substrate (e.g. gold) for a determined contamination (e.g. organic). This model is based on a series of tables which represent the expected values of &psgr;, i.e. the ratio between the amplitudes of the incident beam on the two polarization planes multiplied by the ratio of the amplitudes of the reflected beam on the polarization planes, and &Dgr;, i.e. the difference between the phases on the two polarization planes of the incident beam and the reflected beam, for a gold substrate having a predetermined roughness and a predetermined type of contamination (organic). Each table is built for a roughness value &phgr; expressed as the ratio of metal volume to air volume and gives the values of &psgr; and &Dgr; for a range of possible contaminations expressed as thickness of the contaminant film. Each table shows, for a predetermined value of &phgr;, the expected values of &psgr; and &Dgr; for an organic contaminant film having a thickness of 0, 10 . . . 100 Angstrom.
摘要翻译：用于估计表面的粗糙度和污染的方法和系统。本发明的优选实施例利用一种数学模型，该数学模型给出了金属粗糙度的指示，其表示为金属体积与空气体积的比率以及用于确定的污染物的金属基底（例如金）的污染物厚度值（例如有机）。该模型基于一系列表示psi的期望值的表，即在两个偏振面上的入射光束的振幅乘以反射光束在偏振面上的幅度的比率和DELTA 即对于具有预定粗糙度的金基板和预定类型的污染（有机的）的入射光束和反射光束的两个偏振面上的相位之间的差异。每个表都是用一个表示为金属体积与空气体积的比率的粗糙度值phi构成的，并给出了以污染物膜厚度表示的可能污染范围的psi和DELTA值。对于预定值的phi，每个表显示厚度为0,10的有机污染膜的psi和DELTA的期望值。。。 100埃。

7. 发明授权

US06190734B1 Protective treatment of a zinc or a zinc alloy surface 失效
标题翻译：锌或锌合金表面的保护处理
公开(公告)号：US06190734B1
公开(公告)日：2001-02-20
申请号：US09159238
申请日：1998-09-23
申请人： Vittorio Sirtori , Franco Zambon , Pietro Luigi Cavallotti , Luca Magagnin
发明人： Vittorio Sirtori , Franco Zambon , Pietro Luigi Cavallotti , Luca Magagnin
IPC分类号： B05D310
CPC分类号： C23F11/149 , B23K1/20 , B23K35/007 , B23K2101/42 , C23C22/02 , H05K3/282
摘要： A method and a bath for protecting a Zn or Zn alloy surface against the corrosion and oxidation and for improving the wettability characteristics of a Zn or Zn alloy surface with a Sn solder alloy. The method is particularly useful in the manufacture of electronic components, when the deposition of a thin layer of Zn or Zn alloy is needed before the deposition of the Sn alloy (particularly Pb free) to improve the solderability characteristics of the Cu surface.
摘要翻译：一种用于保护Zn或Zn合金表面免受腐蚀和氧化以及用Sn焊料合金改善Zn或Zn合金表面的润湿特性的方法和浴。当沉积Sn合金（特别是无铅）之前需要沉积Zn或Zn合金薄层以改善Cu表面的可焊性特征时，该方法特别适用于制造电子元件。

8. 发明授权

US06179927B2 Decontamination of electronic cards from copper salts 失效
标题翻译：从铜盐中去除电子卡片
公开(公告)号：US06179927B2
公开(公告)日：2001-01-30
申请号：US09583716
申请日：2000-05-30
申请人： Vittorio Sirtori , Giovanni Cattaneo , Fabio Mauri
发明人： Vittorio Sirtori , Giovanni Cattaneo , Fabio Mauri
IPC分类号： B08B304
CPC分类号： H05K3/3489 , C23G5/032 , Y10S134/902
摘要： A method for decontaminating the copper surfaces (e.g. circuits) of an electronic card from copper salts which can be formed after the soldering of the electronic components onto the substrate employing a water free solution which comprises an alcohol and at least one neutral ammonium salt of an organic acid.
摘要翻译：一种用于将电子卡的铜表面（例如电路）从铜盐净化的方法，其可以在使用无水溶液将电子部件焊接到基底上之后形成，所述无水溶液包含醇和至少一种中性铵盐有机酸。

9. 发明授权

US6133213A Solution for removing copper salts from a copper surface comprising an alcohol and an ammonium salt 失效
标题翻译：从包含醇和铵盐的铜表面除去铜盐的溶液
公开(公告)号：US6133213A
公开(公告)日：2000-10-17
申请号：US357588
申请日：1999-07-20
申请人： Vittorio Sirtori , Giovanni Cattaneo , Fabio Mauri
发明人： Vittorio Sirtori , Giovanni Cattaneo , Fabio Mauri
IPC分类号： C23G5/032 , H05K3/34 , C11D7/26
CPC分类号： H05K3/3489 , C23G5/032 , Y10S134/902
摘要： A water free solution for decontaminating copper surfaces (e.g. circuits of an electronic card) from copper salts which includes an alcohol and at least one neutral ammonium salt of an organic acid.
摘要翻译：一种无铜溶液，用于从包含醇和至少一种有机酸的中性铵盐的铜盐中净化铜表面（例如电子卡的回路）。

10. 发明授权

US5863406A Method of manufacturing a printed circuit board 失效
标题翻译：印刷电路板的制造方法
公开(公告)号：US5863406A
公开(公告)日：1999-01-26
申请号：US809334
申请日：1997-05-19
申请人： Roberto Mazzoni , Adelio Monzani , Vittorio Sirtori
发明人： Roberto Mazzoni , Adelio Monzani , Vittorio Sirtori
IPC分类号： H05K3/24 , H05K3/34 , H05K3/42 , C25D5/02
CPC分类号： H05K3/3473 , H05K3/428 , H05K2203/0485 , H05K2203/0542 , H05K3/243 , H05K3/3489 , Y10T29/49144
摘要： A method of manufacturing a printed circuit board adapted for having surface mounted components positioned thereon including the step of selectively electroplating a thick solder layer (340) onto selected conductive projections (230). The selective electrodeposition is performed by electrolessly applying a conductive layer (310) onto the board (100) previously provided with circuit conductors (220) and conductive projections (230), providing a thick insulating mask (310) leaving exposed the selected conductive projections (230), and electroplating the thick solder layer (340). The method of manufacturing an electronic card by surface mounting of components (SMT) onto the printed circuit board (100) obtainable by the above-described method further includes the step of dispensing a flux, preferably a no-clean flux dispensed by syringe, onto the board (100), avoiding solder paste application or adhesive screening.
摘要翻译： PCT No.PCT / EP95 / 02634 371日期1997年5月19日 102（e）日期1997年5月19日PCT提交1995年7月6日PCT公布。出版物WO97 / 02727 日期1997年1月23日制造适于具有位于其上的表面安装部件的印刷电路板的方法包括将厚焊料层（340）选择性地电镀到选定的导电突起（230）上的步骤。通过将导电层（310）无电地施加到预先设置有电路导体（220）和导电突起（230）的板（100）上，从而提供厚的绝缘掩模（310），使所选择的导电突起 230），并且电镀厚焊料层（340）。通过将组件（SMT）表面安装到可通过上述方法获得的印刷电路板（100）上制造电子卡的方法还包括将助熔剂，优选地由注射器分配的免清洗助剂分配到板（100），避免焊膏应用或粘合剂筛选。

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