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    • 2. 发明授权
    • Dynamic flash memory cells with ultra thin tunnel oxides
    • 具有超薄隧道氧化物的动态闪存单元
    • US06456535B2
    • 2002-09-24
    • US09882920
    • 2001-06-15
    • Leonard ForbesLuan C. TranAlan R. ReinbergJoseph E. GeusicKie Y. AhnPaul A. FarrarEugene H. CloudDavid J. McElroy
    • Leonard ForbesLuan C. TranAlan R. ReinbergJoseph E. GeusicKie Y. AhnPaul A. FarrarEugene H. CloudDavid J. McElroy
    • G11C1604
    • G11C16/0416
    • Structures and methods involving n-channel flash memories with an ultrathin tunnel oxide thickness, have been provided. Both the write and erase operations are performed by tunneling. According to the teachings of the present invention, the n-channel flash memory cell with thin tunnel oxides will operate on a dynamic basis. The stored data can be refreshed every few seconds as necessary. However, the write and erase operations will however now be orders of magnitude faster than traditional n-channel flash memory and the cell provides a large gain. The present invention further provides structures and methods for n-channel floating gate transistors which avoid n-channel threshold voltage shifts and achieve source side tunneling erase. The n-channel memory cell structure includes a floating gate separated from a channel region by an oxide layer of less than 50 Angstroms (Å). According to the teachings of the present invention, the floating gate is adapted to hold a charge of the order of 10−17 Coulombs at for at least 1.0 second at 85 degrees Celsius. The method includes applying a potential of less than 3.0 Volts across the floating gate oxide which is less than 50 Angstroms, in order to add or remove a charge from a floating gate. The method further includes reading the n-channel memory cell by applying a potential to a control gate of the n-channel memory cell of less than 1.0 Volt.
    • 已经提供了涉及具有超薄隧道氧化物厚度的n通道闪速存储器的结构和方法。 写和擦除操作都通过隧道执行。 根据本发明的教导,具有薄隧道氧化物的n沟道闪存单元将在动态的基础上操作。 存储的数据可以根据需要每隔几秒刷新一次。 然而,写入和擦除操作现在将比传统的n通道快闪存储器快几个数量级,并且电池提供了大的增益。 本发明还提供了可以避免n沟道阈值电压偏移并实现源极侧漏极擦除的n沟道浮栅晶体管的结构和方法。 n沟道存储单元结构包括通过小于50埃(A)的氧化物层与沟道区分离的浮栅。 根据本发明的教导,浮动门适于在85摄氏度下将10-17库仑的电荷持续至少1.0秒。 该方法包括在小于50埃的浮栅上施加小于3.0伏特的电位,以从浮栅中增加或去除电荷。 该方法还包括通过向n沟道存储单元的控制栅极施加小于1.0伏的电位来读取n沟道存储单元。
    • 3. 发明授权
    • Dynamic flash memory cells with ultrathin tunnel oxides
    • 具有超薄隧道氧化物的动态闪存单元
    • US06249460B1
    • 2001-06-19
    • US09513938
    • 2000-02-28
    • Leonard ForbesLuan C. TranAlan R. ReinbergJoseph E. GeusicKie Y. AhnPaul A. FarrarEugene H. CloudDavid J. McElroy
    • Leonard ForbesLuan C. TranAlan R. ReinbergJoseph E. GeusicKie Y. AhnPaul A. FarrarEugene H. CloudDavid J. McElroy
    • G11C1604
    • G11C16/0416
    • Structures and methods involving n-channel flash memories with an ultrathin tunnel oxide thickness, have been provided. Both the write and erase operations are performed by tunneling. According to the teachings of the present invention, the n-channel flash memory cell with thin tunnel oxides will operate on a dynamic basis. The stored data can be refreshed every few seconds as necessary. However, the write and erase operations will however now be orders of magnitude faster than traditional n-channel flash memory and the cell provides a large gain. The present invention further provides structures and methods for n-channel floating gate transistors which avoid n-channel threshold voltage shifts and achieve source side tunneling erase. The n-channel memory cell structure includes a floating gate separated from a channel region by an oxide layer of less than 50 Angstroms (Å). According to the teachings of the present invention, the floating gate is adapted to hold a charge of the order of 10−17 Coulombs at for at least 1.0 second at 85 degrees Celsius. The method includes applying a potential of less than 3.0 Volts across the floating gate oxide which is less than 50 Angstroms, in order to add or remove a charge from a floating gate. The method further includes reading the n-channel memory cell by applying a potential to a control gate of the n-channel memory cell of less than 1.0 Volt.
    • 已经提供了涉及具有超薄隧道氧化物厚度的n通道闪速存储器的结构和方法。 写和擦除操作都通过隧道执行。 根据本发明的教导,具有薄隧道氧化物的n沟道闪存单元将在动态的基础上操作。 存储的数据可以根据需要每隔几秒刷新一次。 然而,写入和擦除操作现在将比传统的n通道快闪存储器快几个数量级,并且电池提供了大的增益。 本发明还提供了可以避免n沟道阈值电压偏移并实现源极侧漏极擦除的n沟道浮栅晶体管的结构和方法。 n沟道存储单元结构包括通过小于50埃(A)的氧化物层与沟道区分离的浮栅。 根据本发明的教导,浮动门适于在85摄氏度下将10-17库仑的电荷持续至少1.0秒。 该方法包括在小于50埃的浮栅上施加小于3.0伏特的电位,以从浮栅中增加或去除电荷。 该方法还包括通过向n沟道存储单元的控制栅极施加小于1.0伏的电位来读取n沟道存储单元。
    • 6. 发明授权
    • Phase change memory for archival data storage
    • 用于存档数据存储的相变存储器
    • US07541081B2
    • 2009-06-02
    • US11190014
    • 2005-07-27
    • Paul A. FarrarLeonard ForbesAlan R. Reinberg
    • Paul A. FarrarLeonard ForbesAlan R. Reinberg
    • B32B3/02
    • G11B7/2595G11B7/00455G11B7/24038G11B7/243
    • A structure for storing digital data is provided, with a high reflectance layer comprising a noble metal formed over an underlying material layer, and a plurality of low reflectance portions comprising a mixture of a noble metal and an underlying material. The plurality of low reflectance portions have top surfaces comprising a compound of the underlying and the noble metal. A method of changing reflectance on a data storage disk is also disclosed. The method comprises the acts of irradiating a laser light beam onto a noble metal formed over an underlying layer, and raising the temperature of the noble metal above the melting temperature forming a compound of the noble metal and the underlying material.
    • 提供了一种用于存储数字数据的结构,其中包括形成在下层材料层上的贵金属的高反射率层和包含贵金属和下层材料的混合物的多个低反射率部分。 多个低反射率部分具有包括底层和贵金属的化合物的顶表面。 还公开了一种在数据存储盘上改变反射率的方法。 该方法包括将激光照射到形成在下层上的贵金属上的动作,并将贵金属的温度升高到高于贵金属和底层材料的化合物的熔融温度。