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1. 发明申请

US20070184666A1 Method for removing residue containing an embedded metal 审中-公开
标题翻译：去除含有嵌入金属的残留物的方法
公开(公告)号：US20070184666A1
公开(公告)日：2007-08-09
申请号：US11349864
申请日：2006-02-08
申请人： Patricia Smith , Heungsoo Park , Laura Matz , Vinay Shah , Phillip Matz
发明人： Patricia Smith , Heungsoo Park , Laura Matz , Vinay Shah , Phillip Matz
IPC分类号： H01L21/302 , H01L21/31
CPC分类号： H01L21/02063 , H01L21/76814
摘要： The present invention provides a method for removing residue from a cavity during the formation of an interconnect structure, a method for manufacturing an interconnect structure using the same, and a method for manufacturing an integrated circuit using the same. The method for removing residue from a cavity during the formation of an interconnect structure, among other steps, may include subjecting residue (410) having an embedded metal therein located within a cavity (310) in a dielectric layer (240) and over at least a portion of a conductive feature (220) to a short duration oxidation process so as to oxidize a substantial portion of the embedded metal, and removing the residue (410) containing the oxidized embedded metal using an etch process.
摘要翻译：本发明提供了在形成互连结构期间从空腔中除去残留物的方法，使用该互连结构的互连结构的制造方法以及使用该互连结构的集成电路的制造方法。在互连结构形成期间除去空腔中的残留物的方法以及其它步骤可包括将位于介电层（240）内的位于空腔（310）内的嵌入金属的残余物（410）至少导电特征（220）的一部分延伸至短时间氧化过程，以便氧化大部分嵌入金属，以及使用蚀刻工艺去除含有氧化的嵌入金属的残余物（410）。

2. 发明申请

US20060281312A1 Hydrogen and oxygen based photoresist removal process 有权
标题翻译：氢和氧基光刻胶去除工艺
公开(公告)号：US20060281312A1
公开(公告)日：2006-12-14
申请号：US11147959
申请日：2005-06-08
申请人： Patricia Smith , Laura Matz , Vinay Shah
发明人： Patricia Smith , Laura Matz , Vinay Shah
IPC分类号： H01L21/302 , H01L21/461
CPC分类号： H01L21/31138 , G03F7/427
摘要： The present invention provides a photoresist removal process and a method for manufacturing an interconnect using the same. One embodiment of the photoresist removal process includes, among other steps, providing a low dielectric constant (k) substrate having a photoresist layer located thereover, and removing the photoresist layer using a plasma which incorporates a gas which includes hydrogen or deuterium and a small amount of oxygen less than about 20 volume percent of the gas. Another embodiment of the photoresist removal process includes, among other steps, providing a low dielectric constant (k) substrate having a photoresist layer located thereover, removing a bulk portion of the photoresist layer using a plasma which incorporates a gas which includes hydrogen or deuterium, and removing a small portion of the photoresist layer using a plasma which incorporates a gas which includes oxygen, wherein the order of the two removing steps is interchangeable.
摘要翻译：本发明提供一种光致抗蚀剂去除方法及其制造方法。除了其他步骤之外，光致抗蚀剂去除方法的一个实施方案包括提供具有位于其上的光致抗蚀剂层的低介电常数（k）衬底，以及使用包含氢或氘和少量气体的等离子体去除光致抗蚀剂层的氧气小于约20体积％的气体。除了其他步骤之外，光致抗蚀剂去除方法的另一个实施方案包括提供具有位于其上的光致抗蚀剂层的低介电常数（k）衬底，使用包含氢或氘的气体的等离子体去除光致抗蚀剂层的主体部分，以及使用包含氧气的等离子体去除一部分光致抗蚀剂层，其中两个除去步骤的顺序是可互换的。

3. 发明授权

US08677929B2 Method and apparatus for masking solar cell substrates for deposition 失效
标题翻译：用于掩蔽用于沉积的太阳能电池基板的方法和装置
公开(公告)号：US08677929B2
公开(公告)日：2014-03-25
申请号：US13338173
申请日：2011-12-27
申请人： Alexander J. Berger , Terry Bluck , Vinay Shah , Judy Huang , Karthik Janakiraman , Chau T. Nguyen , Greg Stumbo
发明人： Alexander J. Berger , Terry Bluck , Vinay Shah , Judy Huang , Karthik Janakiraman , Chau T. Nguyen , Greg Stumbo
IPC分类号： B05C3/00 , B05C19/02 , B65G37/00 , B65G47/12 , H01L21/00 , H01L25/00 , B05D1/18
CPC分类号： H01L31/1876 , B05D1/322 , B05D1/327 , C23C14/042 , C23C16/042 , Y02E10/50 , Y02P70/521
摘要： Disclosed are methods and apparatus for masking of substrates for deposition, and subsequent lifting of the mask with deposited material. Masking materials are utilized that can be used in high temperatures and vacuum environment. The masking material has minimal outgassing once inside a vacuum chamber and withstand the temperatures during deposition process. The mask is inkjeted over the wafers and, after deposition, removed using agitation, such as ultrasonic agitation, or using laser burn off.
摘要翻译：公开了用于掩蔽用于沉积的基底的方法和装置，以及随后用沉积材料提起掩模。使用可在高温和真空环境中使用的遮蔽材料。掩模材料一旦在真空室内就具有最小的除气，并能承受沉积过程中的温度。将掩模喷涂在晶片上，并且在沉积之后，使用搅拌（例如超声波搅拌）或使用激光烧掉来除去掩模。

4. 发明申请

US20060182536A1 Cartesian robot cluster tool architecture 有权
标题翻译：笛卡尔机器人集群工具架构
公开(公告)号：US20060182536A1
公开(公告)日：2006-08-17
申请号：US11315984
申请日：2005-12-22
申请人： Mike Rice , Jeffrey Hudgens , Charles Carlson , William Weaver , Robert Lowrance , Eric Englhardt , Dean Hruzek , Dave Silvetti , Michael Kuchar , Kirk Katwyk , Van Hoskins , Vinay Shah
发明人： Mike Rice , Jeffrey Hudgens , Charles Carlson , William Weaver , Robert Lowrance , Eric Englhardt , Dean Hruzek , Dave Silvetti , Michael Kuchar , Kirk Katwyk , Van Hoskins , Vinay Shah
IPC分类号： H01L21/677
CPC分类号： H01L21/68707 , H01L21/67173 , H01L21/67178 , H01L21/67184 , H01L21/67742 , H01L21/67745 , Y10S414/135
摘要： A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, that has an increased system throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history (or wafer history), and a reduced footprint. The various embodiments of the cluster tool may utilize two or more robots that are configured in a parallel processing configuration to transfer substrates between the various processing chambers retained in the processing racks so that a desired processing sequence can be performed on the substrates. In one aspect, the parallel processing configuration contains two or more robot assemblies that are adapted to move in a vertical and horizontal directions, to access the various processing chambers retained in generally adjacently positioned processing racks. Generally, the various embodiments described herein are advantageous since each row or group of substrate processing chambers are serviced by two or more robots to allow for increased throughput and increased system reliability. Also, the various embodiments described herein are generally configured to minimize and control the particles generated by the substrate transferring mechanisms, to prevent device yield and substrate scrap problems that can affect the cost of ownership of the cluster tool. The flexible and modular architecture allows the user to configure the number of processing chambers, processing racks, and processing robots required to meet the throughput needs of the user.
摘要翻译：一种使用多室处理系统或集群工具处理衬底的方法和装置，其具有增加的系统吞吐量，增加的系统可靠性，改进的器件产量性能，更可重复的晶片处理历史（或晶片历史）以及减少的脚印。群集工具的各种实施例可以使用以并行处理配置配置的两个或更多个机器人，以在保留在处理机架中的各种处理室之间传送衬底，使得可以在衬底上执行期望的处理顺序。在一个方面，并行处理配置包括两个或更多个机器人组件，其适于在垂直和水平方向上移动，以访问保持在通常相邻定位的处理机架中的各种处理室。通常，这里描述的各种实施例是有利的，因为每行或一组衬底处理室由两个或更多个机器人来维护，以允许增加的生产量和增加的系统可靠性。此外，本文所述的各种实施例通常被配置为最小化和控制由衬底传送机构产生的颗粒，以防止可能影响群集工具的所有权成本的装置产量和衬底废料问题。灵活和模块化的架构允许用户配置满足用户吞吐量需求所需的处理室，处理机架和处理机器人的数量。

5. 发明申请

US20060182531A1 Methods and apparatus for identifying small lot size substrate carriers 失效
公开(公告)号：US20060182531A1
公开(公告)日：2006-08-17
申请号：US11154932
申请日：2005-06-16
申请人： Vinay Shah , Martin Elliott , Jeffrey Hudgens , Eric Englhardt
发明人： Vinay Shah , Martin Elliott , Jeffrey Hudgens , Eric Englhardt
IPC分类号： H01L21/677
CPC分类号： H01L21/67265 , H01L21/67379 , H01L21/67775 , Y10S414/135 , Y10S414/14
摘要： In at least one aspect, a system is provided that includes (1) a substrate carrier having first docking features; and (2) a loadport having second docking features. The second docking features are adapted to block docking of substrate carriers that do not include the first docking features and to allow docking of substrate carriers that include the first docking features. Numerous other aspects are provided.

6. 发明授权

US08207005B2 Forming solar cells using a patterned deposition process 失效
标题翻译：使用图案化沉积工艺形成太阳能电池
公开(公告)号：US08207005B2
公开(公告)日：2012-06-26
申请号：US13042313
申请日：2011-03-07
申请人： Timothy W. Weidman , Rohit Mishra , Michael P. Stewart , Kapila P. Wijekoon , Yonghwa Chris Cha , Tristan Holtam , Vinay Shah
发明人： Timothy W. Weidman , Rohit Mishra , Michael P. Stewart , Kapila P. Wijekoon , Yonghwa Chris Cha , Tristan Holtam , Vinay Shah
IPC分类号： H01L21/00 , H01L21/76 , H01L21/331 , H01L21/20 , H01L33/00
CPC分类号： H01L21/67034 , G01T1/2018 , H01L21/225 , H01L21/306 , H01L21/308 , H01L21/67727 , H01L21/67736 , H01L21/67745 , H01L21/6776 , H01L31/022441 , H01L31/0516 , H01L31/0682 , H01L31/1804 , Y02E10/547 , Y02P70/521
摘要： Embodiments of the invention contemplate the formation of a high efficiency solar cell using novel methods to form the active doped region(s) and the metal contact structure of the solar cell device. In one embodiment, the methods include the steps of depositing a dielectric material that is used to define the boundaries of the active regions and/or contact structure of a solar cell device. Various techniques may be used to form the active regions of the solar cell and the metal contact structure.
摘要翻译：本发明的实施例考虑使用新的方法形成高效太阳能电池，以形成太阳能电池器件的有源掺杂区域和金属接触结构。在一个实施例中，所述方法包括沉积用于限定太阳能电池器件的有源区域和/或接触结构的边界的介电材料的步骤。可以使用各种技术来形成太阳能电池的有源区域和金属接触结构。

7. 发明授权

US07720558B2 Methods and apparatus for mapping carrier contents 有权
标题翻译：用于映射运营商内容的方法和装置
公开(公告)号：US07720558B2
公开(公告)日：2010-05-18
申请号：US11220897
申请日：2005-09-06
申请人： Martin R. Elliott , Vinay Shah
发明人： Martin R. Elliott , Vinay Shah
IPC分类号： G06F19/00 , H01L21/677 , B65G1/133
CPC分类号： H01L21/67265
摘要： In a first aspect, a first method of mapping contents of a substrate carrier is provided. The first method includes the steps of (1) coupling a sensor to the substrate carrier or a loadport adapted to receive the substrate carrier; and (2) determining a presence or absence of a substrate in a slot of the substrate carrier using the sensor. Numerous other aspects are provided.
摘要翻译：在第一方面，提供了一种映射衬底载体的内容的第一种方法。第一种方法包括以下步骤：（1）将传感器耦合到衬底载体或适于接收衬底载体的负载端口; 和（2）使用传感器确定衬底载体的槽中是否存在衬底。提供了许多其他方面。

8. 发明授权

US07611319B2 Methods and apparatus for identifying small lot size substrate carriers 失效
标题翻译：用于识别小批量衬底载体的方法和装置
公开(公告)号：US07611319B2
公开(公告)日：2009-11-03
申请号：US11154932
申请日：2005-06-16
申请人： Vinay Shah , Martin R. Elliott , Jeffrey C. Hudgens , Eric Andrew Englhardt
发明人： Vinay Shah , Martin R. Elliott , Jeffrey C. Hudgens , Eric Andrew Englhardt
IPC分类号： B65B69/00
CPC分类号： H01L21/67265 , H01L21/67379 , H01L21/67775 , Y10S414/135 , Y10S414/14
摘要： In at least one aspect, a system is provided that includes (1) a substrate carrier having first docking features; and (2) a loadport having second docking features. The second docking features are adapted to block docking of substrate carriers that do not include the first docking features and to allow docking of substrate carriers that include the first docking features. Numerous other aspects are provided.
摘要翻译：在至少一个方面，提供了一种系统，其包括（1）具有第一对接特征的衬底载体; 和（2）具有第二对接特征的装载端口。第二对接特征适于阻止不包括第一对接特征的衬底载体的对接并允许对接包括第一对接特征的衬底载体。提供了许多其他方面。

9. 发明授权

US07577487B2 Methods and apparatus for a band to band transfer module 有权
标题翻译：一种带对带传输模块的方法和装置
公开(公告)号：US07577487B2
公开(公告)日：2009-08-18
申请号：US11521070
申请日：2006-09-13
申请人： Robert B. Lowrance , Eric Andrew Englhardt , Michael R. Rice , Vinay Shah , Sushant S. Koshti , Jeffrey C. Hudgens
发明人： Robert B. Lowrance , Eric Andrew Englhardt , Michael R. Rice , Vinay Shah , Sushant S. Koshti , Jeffrey C. Hudgens
IPC分类号： G06F19/00 , G06F7/00
CPC分类号： B65G47/52 , B65G29/00 , B65G47/28 , B65G2203/025 , H01L21/67706 , H01L21/67715 , Y10S414/135 , Y10S414/14
摘要： A band to band transfer module according to the present invention may be used with a substrate carrier transport system, or other systems, to transfer substrate carriers (e.g., small lot substrate carriers) from one conveyor to another conveyor or between two points on the same conveyor. The transfers (e.g., pick and place) of the substrate carriers may be made between conveyors traveling at different speeds. Numerous other aspects and features are disclosed.
摘要翻译：根据本发明的带带传输模块可以与衬底载体传输系统或其他系统一起使用，以将衬底载体（例如，小批量衬底载体）从一个传送器转移到另一个传送器或在相同的两个点之间输送带。可以在以不同速度行进的输送机之间形成基板载体的传送（例如拾取和放置）。公开了许多其他方面和特征。

10. 发明授权

US07374391B2 Substrate gripper for a substrate handling robot 有权
标题翻译：用于基板处理机器人的基板夹具
公开(公告)号：US07374391B2
公开(公告)日：2008-05-20
申请号：US11315873
申请日：2005-12-22
申请人： Michael Rice , Jeffrey Hudgens , Charles Carlson , William Tyler Weaver , Robert Lowrance , Eric Englhardt , Dean C. Hruzek , Mario David Silvetti , Michael Kuchar , Kirk Van Katwyk , Van Hoskins , Vinay Shah
发明人： Michael Rice , Jeffrey Hudgens , Charles Carlson , William Tyler Weaver , Robert Lowrance , Eric Englhardt , Dean C. Hruzek , Mario David Silvetti , Michael Kuchar , Kirk Van Katwyk , Van Hoskins , Vinay Shah
IPC分类号： B25J15/00
CPC分类号： H01L21/67178 , H01L21/67173 , H01L21/67276 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/68707
摘要： A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, that has an increased system throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history (or wafer history), and a reduced footprint. The various embodiments of the cluster tool may utilize two or more robots that are configured in a parallel processing configuration to transfer substrates between the various processing chambers retained in the processing racks so that a desired processing sequence can be performed on the substrates. In one aspect, the parallel processing configuration contains two or more robot assemblies that are adapted to move in a vertical and horizontal directions, to access the various processing chambers retained in generally adjacently positioned processing racks. Generally, the various embodiments described herein are advantageous since each row or group of substrate processing chambers are serviced by two or more robots to allow for increased throughput and increased system reliability. Also, the various embodiments described herein are generally configured to minimize and control the particles generated by the substrate transferring mechanisms, to prevent device yield and substrate scrap problems that can affect the cost of ownership of the cluster tool. The flexible and modular architecture allows the user to configure the number of processing chambers, processing racks, and processing robots required to meet the throughput needs of the user.
摘要翻译：一种使用多室处理系统或集群工具处理衬底的方法和装置，其具有增加的系统吞吐量，增加的系统可靠性，改进的器件产量性能，更可重复的晶片处理历史（或晶片历史）以及减少的脚印。群集工具的各种实施例可以使用以并行处理配置配置的两个或更多个机器人，以在保留在处理机架中的各种处理室之间传送衬底，使得可以在衬底上执行期望的处理顺序。在一个方面，并行处理配置包括两个或更多个机器人组件，其适于在垂直和水平方向上移动，以访问保持在通常相邻定位的处理机架中的各种处理室。通常，这里描述的各种实施例是有利的，因为每行或一组衬底处理室由两个或更多个机器人来维护，以允许增加的生产量和增加的系统可靠性。此外，本文所述的各种实施例通常被配置为最小化和控制由衬底传送机构产生的颗粒，以防止可能影响群集工具的所有权成本的装置产量和衬底废料问题。灵活和模块化的架构允许用户配置满足用户吞吐量需求所需的处理室，处理机架和处理机器人的数量。

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