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    • 4. 发明申请
    • METHODS FOR OXIDATION OF A SEMICONDUCTOR DEVICE
    • 氧化半导体器件的方法
    • US20110217850A1
    • 2011-09-08
    • US13110613
    • 2011-05-18
    • RAJESH MANINORMAN TAMTIMOTHY W. WEIDMANYOSHITAKA YOKOTA
    • RAJESH MANINORMAN TAMTIMOTHY W. WEIDMANYOSHITAKA YOKOTA
    • H01L21/314
    • H01L21/31662H01L21/0223H01L21/02238H01L21/02244H01L21/02252H01L21/28273H01L21/31683H01L21/32105
    • Methods of fabricating an oxide layer on a semiconductor substrate are provided herein. The oxide layer may be formed over an entire structure disposed on the substrate, or selectively formed on a non-metal containing layer with little or no oxidation of an exposed metal-containing layer. The methods disclosed herein may be performed in a variety of process chambers, including but not limited to decoupled plasma oxidation chambers, rapid and/or remote plasma oxidation chambers, and/or plasma immersion ion implantation chambers. In some embodiments, a method may include providing a substrate comprising a metal-containing layer and non-metal containing layer; and forming an oxide layer on an exposed surface of the non-metal containing layer by exposing the substrate to a plasma formed from a process gas comprising a hydrogen-containing gas, an oxygen-containing gas, and at least one of a supplemental oxygen-containing gas or a nitrogen-containing gas.
    • 本文提供了在半导体衬底上制造氧化物层的方法。 氧化物层可以形成在设置在基板上的整个结构上,或者选择性地形成在非金属含有层上,具有暴露的含金属层的很少或没有氧化。 本文公开的方法可以在各种处理室中执行,包括但不限于去耦等离子体氧化室,快速和/或远程等离子体氧化室和/或等离子体浸入离子注入室。 在一些实施方案中,方法可以包括提供包含含金属层和不含金属的层的基材; 以及通过将衬底暴露于由包含含氢气体,含氧气体和至少一种补充氧气的工艺气体形成的等离子体而在非含金属层的暴露表面上形成氧化物层, 含有气体或含氮气体。
    • 10. 发明授权
    • Raman spectroscopy as integrated chemical metrology
    • 拉曼光谱作为综合化学计量学
    • US07542132B2
    • 2009-06-02
    • US11830202
    • 2007-07-30
    • Hongbin FangJosh GoldenTimothy W. WeidmanYaxin WangArulkumar Shanmugasundram
    • Hongbin FangJosh GoldenTimothy W. WeidmanYaxin WangArulkumar Shanmugasundram
    • G01J3/44G01N21/65
    • G01N21/65
    • A method for measuring the concentration of the metal solution and reducing agent solution within the electroless plating solution is disclosed. Raman spectroscopy is used to measure the concentration of each solution within the electroless plating solution after they have been mixed together. By measuring the concentration of each solution prior to providing the solution to a plating cell, the concentration of the individual solutions can be adjusted so that the targeted concentration of each solution is achieved. Additionally, each solution can be individually analyzed using Raman spectroscopy prior to mixing with the other solutions. Based upon the Raman spectroscopy measurements of the individual solutions prior to mixing, the individual components that make up each solution can be adjusted prior to mixing so that the targeted component concentration can be achieved.
    • 公开了一种用于测量化学镀溶液中的金属溶液和还原剂溶液的浓度的方法。 拉曼光谱法用于测量化学镀溶液混合在一起后每种溶液的浓度。 通过在将溶液提供给电镀池之前测量每种溶液的浓度,可以调节各溶液的浓度,从而实现每种溶液的目标浓度。 此外,每个溶液可以在与其他溶液混合之前使用拉曼光谱单独分析。 基于混合前单个溶液的拉曼光谱测量,可以在混合之前调整组成每种溶液的各个组分,从而可以实现目标组分浓度。