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    • 3. 发明授权
    • Schottky diode with leakage current control structures
    • 具有漏电流控制结构的肖特基二极管
    • US09231120B2
    • 2016-01-05
    • US13537299
    • 2012-06-29
    • Weize ChenXin LinPatrice M. Parris
    • Weize ChenXin LinPatrice M. Parris
    • H01L29/872H01L29/417H01L29/66H01L29/06
    • H01L29/872H01L29/0692H01L29/417H01L29/66143
    • A Schottky diode includes a device structure having a central portion and a plurality of fingers. Distal portions of the fingers overlie leakage current control (LCC) regions. An LCC region is relatively narrow and deep, terminating in proximity to a buried layer of like polarity. Under reverse bias, depletion regions forming in an active region lying between the buried layer and the LCC regions occupy the entire extent of the active region and thereby provide a carrier depleted wall. An analogous depletion region occurs in the active region residing between any pair of adjacent fingers. If the fingers include latitudinal oriented fingers and longitudinal oriented fingers, depletion region blockades in three different orthogonal orientations may occur. The formation of the LCC regions may include the use of a high dose, low energy phosphorous implant using an LCC implant mask and the isolation structures as an additional hard mask.
    • 肖特基二极管包括具有中心部分和多个指状物的器件结构。 手指的远端覆盖泄漏电流控制(LCC)区域。 LCC区域相对较窄和深,终止于类似极性的掩埋层附近。 在反向偏压下,在位于掩埋层和LCC区域之间的有源区域中形成的耗尽区域占据有源区域的整个范围,从而提供载流子耗尽的壁。 类似的耗尽区发生在驻留在任何一对相邻手指之间的有源区域中。 如果手指包括纬向取向的指状物和纵向取向的指状物,则可能发生三个不同正交取向的耗尽区域封锁。 LCC区域的形成可以包括使用使用LCC植入物掩模的高剂量,低能量磷植入物以及作为附加硬掩模的隔离结构。
    • 5. 发明授权
    • Tunable schottky diode with depleted conduction path
    • 可调肖特基二极管具有耗尽的导通路径
    • US08735950B2
    • 2014-05-27
    • US13605357
    • 2012-09-06
    • Weize ChenXin LinPatrice M. Parris
    • Weize ChenXin LinPatrice M. Parris
    • H01L29/66
    • H01L29/66893H01L27/0629H01L29/0619H01L29/0623H01L29/0653H01L29/0692H01L29/08H01L29/1066H01L29/107H01L29/66143H01L29/872
    • A device includes a semiconductor substrate, first and second electrodes supported by the semiconductor substrate, laterally spaced from one another, and disposed at a surface of the semiconductor substrate to form an Ohmic contact and a Schottky junction, respectively. The device further includes a conduction path region in the semiconductor substrate, having a first conductivity type, and disposed along a conduction path between the first and second electrodes, a buried region in the semiconductor substrate having a second conductivity type and disposed below the conduction path region, and a device isolating region electrically coupled to the buried region, having the second conductivity type, and defining a lateral boundary of the device. The device isolating region is electrically coupled to the second electrode such that a voltage at the second electrode during operation is applied to the buried region to deplete the conduction path region.
    • 一种器件包括半导体衬底,由半导体衬底支撑的第一和第二电极,彼此横向间隔开,并分别设置在半导体衬底的表面以形成欧姆接触和肖特基结。 该器件还包括半导体衬底中的导电通路区域,具有第一导电类型,并且沿第一和第二电极之间的导电路径设置,半导体衬底中的具有第二导电类型并设置在导电路径下方的掩埋区域 以及电耦合到所述掩埋区域的器件隔离区域,具有所述第二导电类型,并且限定所述器件的横向边界。 器件隔离区域电耦合到第二电极,使得在操作期间第二电极处的电压被施加到掩埋区域以耗尽导电路径区域。
    • 9. 发明授权
    • Semiconductor device and related fabrication methods
    • 半导体器件及相关制造方法
    • US09553187B2
    • 2017-01-24
    • US14567357
    • 2014-12-11
    • Weize ChenRichard J. De SouzaMazhar Ul HoquePatrice M. Parris
    • Weize ChenRichard J. De SouzaMazhar Ul HoquePatrice M. Parris
    • H01L29/78H01L29/66H01L27/02H01L21/28H01L29/49
    • H01L29/7835H01L21/28105H01L27/0251H01L29/4933H01L29/4983H01L29/66659
    • Semiconductor device structures and related fabrication methods are provided. An exemplary semiconductor device structure includes a body well region having a first conductivity type, a drift region and a source region each having a second conductivity type, where a channel portion of the body well region resides laterally between the source region and a first portion of the drift region that is adjacent to the channel portion. A gate structure overlies the channel portion and the adjacent portion of the drift region. A portion of the gate structure overlying the channel portion proximate the source region has the second conductivity type. Another portion of the gate structure that overlies the adjacent portion of the drift region has a different doping, and overlaps at least a portion of the channel portion, with the threshold voltage associated with the gate structure being influenced by the amount of overlap.
    • 提供半导体器件结构和相关的制造方法。 示例性的半导体器件结构包括具有第一导电类型的主体阱区域,漂移区域和各自具有第二导电类型的源极区域,其中主体阱区域的沟道部分横向位于源极区域和源极区域的第一部分之间 与沟道部分相邻的漂移区域。 栅极结构覆盖了沟道部分和漂移区域的相邻部分。 覆盖靠近源极区的沟道部分的栅极结构的一部分具有第二导电类型。 覆盖漂移区域的相邻部分的栅极结构的另一部分具有不同的掺杂,并且与沟道部分的至少一部分重叠,与栅极结构相关联的阈值电压受重叠量的影响。