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    • 1. 发明授权
    • Semiconductor device and related fabrication methods
    • 半导体器件及相关制造方法
    • US09553187B2
    • 2017-01-24
    • US14567357
    • 2014-12-11
    • Weize ChenRichard J. De SouzaMazhar Ul HoquePatrice M. Parris
    • Weize ChenRichard J. De SouzaMazhar Ul HoquePatrice M. Parris
    • H01L29/78H01L29/66H01L27/02H01L21/28H01L29/49
    • H01L29/7835H01L21/28105H01L27/0251H01L29/4933H01L29/4983H01L29/66659
    • Semiconductor device structures and related fabrication methods are provided. An exemplary semiconductor device structure includes a body well region having a first conductivity type, a drift region and a source region each having a second conductivity type, where a channel portion of the body well region resides laterally between the source region and a first portion of the drift region that is adjacent to the channel portion. A gate structure overlies the channel portion and the adjacent portion of the drift region. A portion of the gate structure overlying the channel portion proximate the source region has the second conductivity type. Another portion of the gate structure that overlies the adjacent portion of the drift region has a different doping, and overlaps at least a portion of the channel portion, with the threshold voltage associated with the gate structure being influenced by the amount of overlap.
    • 提供半导体器件结构和相关的制造方法。 示例性的半导体器件结构包括具有第一导电类型的主体阱区域,漂移区域和各自具有第二导电类型的源极区域,其中主体阱区域的沟道部分横向位于源极区域和源极区域的第一部分之间 与沟道部分相邻的漂移区域。 栅极结构覆盖了沟道部分和漂移区域的相邻部分。 覆盖靠近源极区的沟道部分的栅极结构的一部分具有第二导电类型。 覆盖漂移区域的相邻部分的栅极结构的另一部分具有不同的掺杂,并且与沟道部分的至少一部分重叠,与栅极结构相关联的阈值电压受重叠量的影响。
    • 7. 发明授权
    • Semiconductor device with floating RESURF region
    • 具有浮动RESURF区域的半导体器件
    • US09024380B2
    • 2015-05-05
    • US13529589
    • 2012-06-21
    • Weize ChenRichard J. De SouzaPatrice M. Parris
    • Weize ChenRichard J. De SouzaPatrice M. Parris
    • H01L29/66H01L29/06H01L29/78
    • H01L29/0692H01L29/0634H01L29/0653H01L29/66659H01L29/7835
    • A device includes a semiconductor substrate, a body region in the semiconductor substrate, having a first conductivity type, and including a channel region through which charge carriers flow, a drain region in the semiconductor substrate, having a second conductivity type, and spaced from the body region along a first lateral dimension, a drift region in the semiconductor substrate, having the second conductivity type, and electrically coupling the drain region to the channel region, and a plurality of floating reduced surface field (RESURF) regions in the semiconductor substrate adjacent the drift region, having the first conductivity type, and around which the charge carriers drift through the drift region under an electric field arising from a voltage applied to the drain region. Adjacent floating RESURF regions of the plurality of floating RESURF regions are spaced from one another along a second lateral dimension of the device by a respective gap.
    • 一种器件包括半导体衬底,半导体衬底中的主体区域,具有第一导电类型,并且包括电荷载流子流过的沟道区域,半导体衬底中的漏极区域,具有第二导电类型,并与第二导电类型间隔开 沿着第一横向尺寸的主体区域,具有第二导电类型的半导体衬底中的漂移区域,以及将漏极区域电耦合到沟道区域,以及在半导体衬底相邻的多个浮动缩小表面场(RESURF)区域 具有第一导电类型的漂移区域,并且电荷载流子在由施加到漏极区域的电压产生的电场下漂移穿过漂移区域。 多个浮动RESURF区域的相邻的浮动RESURF区域沿设备的第二横向尺寸彼此间隔开。